Samsung electronics co., ltd. (20250014963). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250014963 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a substrate, a first semiconductor chip on the substrate, a heat-dissipating structure on the first semiconductor chip, an adhesive layer between the first semiconductor chip and the heat-dissipating structure, a second semiconductor chip on the heat-dissipating structure, a molding film on the substrate and covering at least portions of the first semiconductor chip, the heat-dissipating structure, and the second semiconductor chip, and a shield layer on an upper surface and sidewalls of the molding film, wherein the shield layer includes a first portion extending into a first hole and contacting an upper surface of the first semiconductor chip, and the first hole may penetrate the molding film, the heat-dissipating structure, and the adhesive layer.