Samsung electronics co., ltd. (20250006703). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250006703 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a package substrate. a lower chip is on the package substrate. an upper chip is on the lower chip. an input/output signal bump is between the lower chip and the package substrate and receives/outputs a signal to/from the lower chip. a wire bonding pad is on the upper chip and includes a wire connected thereto. a first input/output signal ball is on the package substrate and receives/outputs the signal to/from the lower chip and is connected to the input/output signal bump. a second input/output signal ball is on the package substrate and receives/outputs a signal to/from the upper chip and is electrically connected to the wire bonding pad. the input/output signal bump is closer to the first input/output signal ball than the second input/output signal ball. the wire bonding pad is closer to the second input/output signal ball than the first input/output signal ball.
