Samsung electronics co., ltd. (20240429203). SEMICONDUCTOR PACKAGE AND FABRICATING METHOD OF SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD OF SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Jing Cheng Lin of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD OF SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20240429203 titled 'SEMICONDUCTOR PACKAGE AND FABRICATING METHOD OF SEMICONDUCTOR PACKAGE
Original Abstract Submitted
provided is a semiconductor package including a first redistribution structure, a second redistribution structure on the first redistribution structure, a plurality of semiconductor chips on an upper surface of the second redistribution structure, a bridge chip on a lower surface of the second redistribution structure, and a first molding layer between the first redistribution structure and the second redistribution structure and adjacent to the bridge chip, wherein the first molding layer is between the bridge chip and the first redistribution structure.