Samsung electronics co., ltd. (20240429066). METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Junghoon Kang of Suwon-si (KR)
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20240429066 titled 'METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a method of fabricating a semiconductor package is disclosed. the method may include providing an insulating layer, forming a seed layer to cover a top surface of the insulating layer, forming a sacrificial layer on the seed layer, forming penetration holes to penetrate the sacrificial layer and expose the seed layer, forming conductive posts in the penetration holes, removing the sacrificial layer, performing a laser irradiation process on the seed layer to form seed patterns below the conductive posts, attaching a semiconductor chip to a portion of the insulating layer which is placed between the conductive posts, and removing the insulating layer. an outer side surface of the conductive post and an outer side surface of the seed pattern may be substantially coplanar with each other, thereby forming a flat surface.