Samsung electronics co., ltd. (20240421058). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
This abstract first appeared for US patent application 20240421058 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Original Abstract Submitted
a semiconductor package may include a package structure on a redistribution structure. the redistribution structure may include a wiring structure and an insulating structure covering the wiring structure. the package structure may include a semiconductor chip connected to the wiring structure. the insulating structure of the redistribution structure may include a plurality of first insulating layers and a second insulating layer between the plurality of first insulating layers. the plurality of first insulating layers may include at least one of a first conductive line pattern and a first conductive via pattern. the second insulating layer may include a second conductive line pattern overlapping the first conductive line pattern in a vertical direction.
