Samsung electronics co., ltd. (20240413177). IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
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IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
This abstract first appeared for US patent application 20240413177 titled 'IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
Original Abstract Submitted
disclosed are image sensors and methods of fabricating the same. the image sensor includes a semiconductor substrate including a pixel zone and a pad zone and having a first surface and a second surface opposing each other, a first pad separation pattern on the pad zone and extending from the first surface of the semiconductor substrate toward the second surface of the semiconductor substrate, a second pad separation pattern extending from the second surface toward the first surface of the semiconductor substrate on the pad zone the second pad and in contact with the first pad separation pattern, and a pixel separation pattern on the pixel zone and extending from the second surface of the semiconductor substrate toward the first surface of the semiconductor substrate.