Samsung electronics co., ltd. (20240401855). HEAT PUMP SYSTEM AND CONTROL METHOD THEREOF
HEAT PUMP SYSTEM AND CONTROL METHOD THEREOF
Organization Name
Inventor(s)
HEAT PUMP SYSTEM AND CONTROL METHOD THEREOF
This abstract first appeared for US patent application 20240401855 titled 'HEAT PUMP SYSTEM AND CONTROL METHOD THEREOF
Original Abstract Submitted
a heat pump system according to an aspect of the disclosure may comprise: a compressor configured to compress a refrigerant; a water heat exchanger configured to exchange heat between the compressed refrigerant and introduced water; an expansion valve configured to expand the refrigerant condensed in the water heat exchanger; an outdoor heat exchanger configured to exchange heat between the refrigerant expanded by the expansion valve and outdoor air; a high-tension pressure sensor configured to detect the temperature of the refrigerant to be condensed in the water heat exchanger; a discharged water temperature sensor configured to detect the temperature of water on which heat exchange has been performed in the water heat exchanger; and a control unit including a controller comprising circuitry configured to: determine a target condensation temperature of the refrigerant based on a detection result of the discharged water temperature sensor, compare the target condensation temperature with the current condensation temperature detected by the high-tension pressure sensor, and control the degree of opening of the expansion valve based on the comparison result.