Samsung electronics co., ltd. (20240306376). SEMICONDUCTOR DEVICES HAVING LANDING PAD STRUCTURES simplified abstract
SEMICONDUCTOR DEVICES HAVING LANDING PAD STRUCTURES
Organization Name
Inventor(s)
Seungyoung Seo of Suwon-si (KR)
SEMICONDUCTOR DEVICES HAVING LANDING PAD STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240306376 titled 'SEMICONDUCTOR DEVICES HAVING LANDING PAD STRUCTURES
The semiconductor device described in the abstract includes various structures such as cell gate structures, bitline structures, contact plugs, landing pad structures, conductive patterns, and insulating pattern structures.
- The device features a cell gate structure that crosses the active region of the substrate and extends in a first horizontal direction.
- Bitline structures intersect the cell gate structure and extend in a second horizontal direction, intersecting the first direction.
- A contact plug is positioned between the bitline structures.
- The landing pad structure includes a lower landing pad and an upper landing pad with a cavity.
- A conductive pattern is located in the cavity of the upper landing pad.
- An insulating pattern structure is in contact with one of the bitline structures and the landing pad structure.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices for various electronic applications. - It can improve the performance and efficiency of integrated circuits in electronic devices.
Problems Solved: - Enhances the connectivity and functionality of semiconductor devices. - Provides a more efficient and reliable structure for electronic components.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced connectivity and functionality in electronic applications.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Electronic Components This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and other consumer electronics. It can also be applied in the development of advanced computing systems and industrial equipment.
Questions about the technology: 1. How does the conductive pattern in the upper landing pad contribute to the functionality of the semiconductor device? 2. What are the potential implications of using this technology in the manufacturing of electronic devices?
Original Abstract Submitted
a semiconductor device includes a substrate including an active region; a cell gate structure disposed in the substrate, crossing the active region, and extending in a first horizontal direction; bitline structures crossing the cell gate structure and extending in a second horizontal direction intersecting the first horizontal direction; a contact plug disposed between the bitline structures; a landing pad structure disposed on the contact plug and including a lower landing pad and an upper landing pad on the lower landing pad, wherein the upper landing pad includes a cavity; a conductive pattern disposed in the cavity of the upper landing pad; and an insulating pattern structure in contact with one of the bitline structures and in contact with the landing pad structure.