SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP

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SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240304504 titled 'SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP

The semiconductor package described in the patent application includes a semiconductor chip with an active layer, a bump pad on the active layer, and a passivation layer covering the bump pad with two openings.

The first opening exposes a portion of the bump pad's surface, while the second opening exposes another portion of the bump pad's surface.
A first bump is placed on the first exposed portion of the bump pad, and a test bump is placed on the second exposed portion.
The first bump consists of at least one metal layer, and the test bump is shorter in length in the vertical direction compared to the first bump.

Potential Applications: - This technology can be used in various semiconductor devices where precise testing and connection points are required. - It can be applied in the manufacturing of integrated circuits and electronic components.

Problems Solved: - Provides a reliable and efficient method for testing semiconductor chips during production. - Ensures accurate connections between the chip and external components.

Benefits: - Improved testing accuracy and efficiency. - Enhanced reliability in semiconductor packaging. - Cost-effective manufacturing process.

Commercial Applications: Title: Semiconductor Package Testing Technology for Enhanced Reliability This technology can be utilized in the semiconductor industry for testing and packaging of chips, leading to improved reliability and cost savings. It can be integrated into the production processes of semiconductor manufacturers to streamline testing procedures and ensure high-quality products.

Questions about Semiconductor Package Testing Technology: 1. How does the length difference between the first bump and the test bump impact the testing process? The length difference allows for different testing capabilities and can help in identifying specific issues with the semiconductor chip.

2. What are the advantages of using a passivation layer with multiple openings in semiconductor packaging? The passivation layer with multiple openings provides access points for testing and connection purposes, enhancing the functionality of the semiconductor package.

Original Abstract Submitted

a semiconductor package includes: a semiconductor chip including an active layer; a bump pad positioned on the active layer; a passivation layer covering the bump pad and including a first opening and a second opening, wherein the first opening exposes a first portion of the second surface of the bump pad, and the second opening exposes a second portion of the second surface of the bump pad; a first bump disposed on the first portion of the second surface of the bump pad, which is exposed through the first opening; and a test bump disposed on the second portion of the second surface of the bump pad, which is exposed through the second opening, wherein the first bump includes at least one metal layer, and a length of the test bump in a vertical direction is less than a length of the first bump in the vertical direction.