Samsung electronics co., ltd. (20240292634). MEMORY DEVICE WITH INTERPLANE PAD PART simplified abstract
MEMORY DEVICE WITH INTERPLANE PAD PART
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MEMORY DEVICE WITH INTERPLANE PAD PART - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240292634 titled 'MEMORY DEVICE WITH INTERPLANE PAD PART
The memory device described in the patent application consists of a first structure and a second structure bonded together. The first structure contains multiple planes with a pad part between two adjacent planes, each plane housing a memory cell. The second structure includes a peripheral circuit. The planes function as independent units for operations and are arranged in an n x m array.
- The memory device comprises a first structure with multiple planes, each containing a memory cell.
- A pad part is present between adjacent planes, providing structural support.
- The second structure includes a peripheral circuit for overall device functionality.
- The planes operate independently, forming minimum units for memory operations.
- The arrangement of planes follows an n x m array configuration, enhancing memory efficiency.
Potential Applications: - Data storage devices - Embedded systems - Consumer electronics - Cloud computing servers
Problems Solved: - Increased memory capacity - Enhanced data processing speed - Improved memory organization and efficiency
Benefits: - Higher performance in data storage and retrieval - Enhanced reliability and durability - Increased efficiency in memory operations
Commercial Applications: Title: Advanced Memory Devices for High-Performance Computing This technology can be utilized in high-performance computing systems, data centers, and IoT devices to improve memory capabilities and overall system performance.
Questions about the technology: 1. How does the memory device's n x m array configuration impact its performance compared to traditional memory structures? 2. What specific advantages does the independent operation of planes offer in terms of memory functionality and efficiency?
Original Abstract Submitted
a memory device may include a first structure and a second structure bonded to the first structure. the first structure may have a plurality of planes and a pad part between two planes adjacent to each other among the plurality of planes. each of the plurality of planes may include a memory cell. the second structure may include a peripheral circuit. the plurality of planes may be minimum units in which operations are independently performed and may be in an n�m array (n and m being integers of 2 or larger). the pad part may be between the rows and/or between the columns of the n�m array.
