Samsung electronics co., ltd. (20240280895). METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Sangchul Yang of Suwon-si (KR)
Byung-Hyun Lee of Suwon-si (KR)
METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240280895 titled 'METHOD OF FABRICATING SEMICONDUCTOR DEVICE
Simplified Explanation
The method involves correcting misalignments in semiconductor device fabrication to improve accuracy.
- Form target pattern on first wafer
- Measure misalignment value
- Calculate block and pattern misalignment values
- Calculate block and pattern correction values
- Perform second exposure process on second wafer based on corrections
Key Features and Innovation
- Correction of misalignments in semiconductor device fabrication
- Improved accuracy in patterning processes
- Enhanced precision in semiconductor manufacturing
Potential Applications
- Semiconductor industry for improved device fabrication
- Electronics manufacturing for higher quality products
- Research and development for advanced semiconductor technologies
Problems Solved
- Addressing misalignments in semiconductor device fabrication
- Improving accuracy and precision in patterning processes
- Enhancing overall quality of semiconductor devices
Benefits
- Increased accuracy in semiconductor manufacturing
- Higher quality products in electronics industry
- Improved efficiency in device fabrication processes
Commercial Applications
- Precision semiconductor manufacturing for various electronic devices
- Quality control in semiconductor fabrication processes
- Potential market implications for improved semiconductor technologies
Questions about Semiconductor Device Fabrication
How does correcting misalignments impact semiconductor device fabrication processes?
Correcting misalignments improves accuracy and precision in patterning processes, leading to higher quality semiconductor devices.
What are the potential applications of this method in the semiconductor industry?
This method can be applied in semiconductor manufacturing for improved device fabrication, leading to higher quality products and advanced technologies.
Original Abstract Submitted
a method of fabricating a semiconductor device may include forming a target pattern on a first wafer by performing a first exposure process, measuring a misalignment value of the target pattern, calculating a block misalignment value and a pattern misalignment value based on the misalignment value, calculating a block correction value based on the block misalignment value and calculating a pattern correction value based on the pattern misalignment value, and performing a second exposure process on a second wafer, based on the block correction value and the pattern correction value.