INTEGRATED CIRCUIT DEVICE

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Inventor(s)

INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240258328 titled 'INTEGRATED CIRCUIT DEVICE

The abstract describes an integrated circuit device with lower and upper source/drain areas, contacts on the bottom and top surfaces of these areas, and a first vertical conductive rail connecting the lower and upper contacts.

Simplified Explanation:

An integrated circuit device is designed with lower and upper source/drain areas connected by a vertical conductive rail.

Key Features and Innovation:

- Lower and upper source/drain areas with corresponding contacts - Vertical conductive rail connecting lower and upper contacts - Different vertical levels for upper surfaces of the conductive rail

Potential Applications:

- Semiconductor industry for advanced integrated circuits - Electronics manufacturing for improved circuit design

Problems Solved:

- Enhanced connectivity between source/drain areas - Efficient vertical integration in circuit design

Benefits:

- Improved performance and reliability of integrated circuits - Enhanced functionality in electronic devices

Commercial Applications:

"Advanced Integrated Circuit Device for Enhanced Connectivity and Performance"

Questions about the Technology:

1. How does the vertical conductive rail improve connectivity in the integrated circuit device? 2. What advantages does the design of the lower and upper source/drain areas offer in circuit performance?

By focusing on the innovative design of the integrated circuit device, this technology aims to revolutionize the semiconductor industry and electronics manufacturing with improved connectivity and performance.

Original Abstract Submitted

an integrated circuit device is provided. the device includes: lower source/drain areas; lower contacts respectively on bottom surfaces of the lower source/drain areas; upper source/drain areas spaced apart from the lower source/drain areas in a vertical direction; upper contacts respectively on upper surfaces of the upper source/drain areas; and a first vertical conductive rail electrically connected to a first contact of the lower contacts and the upper contacts, the first vertical conductive rail extending in the vertical direction, and including a first portion having a first upper surface at a first vertical level and a second portion having a second upper surface at a second vertical level lower than the first vertical level. the second portion overlaps a first upper contact among the upper contacts in the vertical direction.