Samsung electronics co., ltd. (20240258242). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20240258242 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a package body, a fan-in-chip structure (fics) in the package body, a first redistribution structure, and a second redistribution structure. the fics includes a first chip having a front surface and a rear surface, a bridge wiring structure including a bridge wiring layer on the rear surface of the first chip, and a bridge pad electrically connected to the bridge wiring layer. the first redistribution structure is on a bottom surface of the package body and the front surface of the first chip and includes a first redistribution element. the second redistribution structure is on a top surface of the package body and the rear surface of the first chip and includes a second redistribution element electrically connected to the bridge wiring structure.