Samsung electronics co., ltd. (20240258228). INTEGRATED CIRCUIT DEVICE
INTEGRATED CIRCUIT DEVICE
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INTEGRATED CIRCUIT DEVICE
This abstract first appeared for US patent application 20240258228 titled 'INTEGRATED CIRCUIT DEVICE
Original Abstract Submitted
an integrated circuit device includes a first substrate having a first surface and a second surface opposite to the first surface, and including an active device therein, beol structure disposed on the first surface of the first substrate and configured to route signals, a second substrate disposed on the first surface of the first substrate with the first beol structure disposed therebetween, and including a passive device therein, a power distribution structure disposed on the second surface of the first substrate, a first bonding structure positioned on the first beol structure, and a second bonding structure disposed between the first bonding structure and the second substrate.