Samsung electronics co., ltd. (20240258224). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20240258224 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a package-bottom redistribution structure at a lower side of a package and including a conductive line, an upper semiconductor chip at an upper side of the package, an upper back end of line (beol) layer, at a lower side of the upper semiconductor chip, and including a conductive line, a lower semiconductor chip below the upper semiconductor chip, where a horizontal width of the lower semiconductor chip is less than a horizontal width of the upper semiconductor chip, and where the upper semiconductor chip overlaps at least a portion of the lower semiconductor chip, a lower beol layer at a lower side of the lower semiconductor chip and including a conductive line, a passivation layer on an upper surface of the lower semiconductor chip, and a through silicon via (tsv) structure penetrating the passivation layer and the lower semiconductor chip.