Samsung electronics co., ltd. (20240258180). SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION CIRCUIT
SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION CIRCUIT
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SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION CIRCUIT
This abstract first appeared for US patent application 20240258180 titled 'SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION CIRCUIT
Original Abstract Submitted
a semiconductor device includes a first semiconductor chip; a second semiconductor chip stacked on the first semiconductor chip, wherein a type of the second semiconductor chip is different from a type of the first semiconductor chip; and a crack detection circuit including: a first crack detection line repeatedly passing through an interface between the first semiconductor chip and the second semiconductor chip; a second crack detection line including a bonding pad or a through-via structure contacting a surface of the second semiconductor chip opposite to the interface; and a crack detector in the second semiconductor chip, the crack detector being configured to output a first test signal to the first crack detection line, receive a first reception signal from the first crack detection line, output a second test signal to the second crack detection line, and receive a second reception signal from the second crack detection line.