Samsung electronics co., ltd. (20240253118). MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SINTERED BODY
MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SINTERED BODY
Organization Name
Inventor(s)
Takafumi Noguchi of Yokohama-shi JP
Toshihiro Iizuka of Yokohama-shi JP
Kenichi Nagayama of Yokohama-shi JP
MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SINTERED BODY
This abstract first appeared for US patent application 20240253118 titled 'MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SINTERED BODY
Original Abstract Submitted
in a manufacturing method for a sintered body, a mold device including a die, first and second punches, first and second spacers, first and second rams, and a plurality of thermal resistors is used. the manufacturing method includes an operation of loading raw material powder into a cavity of the die and then sintering the raw material powder, while pressing and molding the raw material powder in the uniaxial direction using the first and second punches, to form a sintered body and an operation of cooling the formed sintered body. in the operation of cooling the formed sintered body, an acoustic emission (ae) waveform is detected from the formed sintered body, and it is determined whether a crack has occurred in the formed sintered body using the detected ae waveform.