Samsung electronics co., ltd. (20240238935). CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract
CHEMICAL MECHANICAL POLISHING APPARATUS
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
CHEMICAL MECHANICAL POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240238935 titled 'CHEMICAL MECHANICAL POLISHING APPARATUS
The abstract describes a chemical mechanical polishing apparatus that includes a turntable, a CMP pad on the turntable, a polishing head above the turntable, a slurry supply unit, and a temperature control unit.
- Turntable with CMP pad for polishing wafers
- Polishing head presses wafer against CMP pad
- Slurry supply unit provides slurry to the CMP pad
- Temperature control unit with heating members to heat the CMP pad
- Suction port on the body of the temperature control unit to suction steam
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Optical device fabrication
Problems Solved: - Achieving precise and uniform polishing of wafers - Controlling temperature during the polishing process
Benefits: - Improved efficiency in wafer polishing - Enhanced quality and consistency of polished wafers
Commercial Applications: Title: Advanced Chemical Mechanical Polishing Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance the quality and efficiency of wafer polishing processes. It can also be valuable in the production of microelectronics and optical devices.
Questions about Chemical Mechanical Polishing Apparatus: 1. How does the temperature control unit contribute to the polishing process? The temperature control unit with heating members helps maintain the desired temperature of the CMP pad, ensuring consistent and effective polishing of wafers.
2. What role does the slurry supply unit play in the chemical mechanical polishing process? The slurry supply unit provides the abrasive slurry to the CMP pad, aiding in the removal of material from the wafer surface during the polishing process.
Original Abstract Submitted
a chemical mechanical polishing apparatus, may include: a turntable; a cmp pad installed on an upper surface of the turntable; a polishing head disposed above the turntable and contacting a wafer with the cmp pad to press the wafer; a slurry supply unit supplying slurry to the cmp pad; and a temperature control unit disposed between the slurry supply unit and the polishing head, wherein the temperature control unit may be provided with a body disposed above the cmp pad; and heating members disposed on a bottom surface of the body to heat the cmp pad, wherein the body may be provided with a suction port disposed between the heating members to suction steam.
