SEMICONDUCTOR PACKAGE

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SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234342 titled 'SEMICONDUCTOR PACKAGE

The semiconductor package described in the patent application consists of a semiconductor chip with a substrate having two surfaces, a chip pad with a conductive layer, a support pad with an insulating layer, a support bump connected to the support pad, a wiring substrate facing the semiconductor substrate, a support bonding on trace (bot) pad on the wiring substrate bonded to the support bump, and a dummy area on the wiring substrate away from the support bot pad.

The semiconductor package includes a unique support structure with a support pad and support bump for enhanced stability.
The presence of a dummy area on the wiring substrate helps in optimizing the layout and design of the package.
The support bonding on trace (bot) pad ensures secure bonding between the wiring substrate and the support bump.
The combination of the chip pad, support pad, and support bump provides a reliable and efficient packaging solution for the semiconductor chip.
The insulating layer on the support pad helps in preventing electrical interference and ensures proper functioning of the semiconductor package.

Potential Applications: - This technology can be applied in various electronic devices requiring semiconductor packaging. - It can be used in consumer electronics, automotive electronics, and industrial applications.

Problems Solved: - Provides a stable and reliable packaging solution for semiconductor chips. - Helps in optimizing the layout and design of semiconductor packages. - Prevents electrical interference and ensures proper functioning of electronic devices.

Benefits: - Enhanced stability and reliability of semiconductor packages. - Improved performance and efficiency of electronic devices. - Optimal layout and design for semiconductor packaging.

Commercial Applications: - The technology can be utilized by semiconductor manufacturers for packaging their chips. - It can be integrated into various electronic devices to improve their performance and reliability.

Questions about Semiconductor Package Technology: 1. How does the support bump contribute to the stability of the semiconductor package? 2. What are the advantages of having a dummy area on the wiring substrate in semiconductor packaging?

Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.

Original Abstract Submitted

a semiconductor package includes a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface, a chip pad located on the first surface and including a conductive layer, a support pad positioned on the first surface, spaced apart from the chip pad and including an insulating layer, a support bump connected to the support pad, a wiring substrate disposed to face the semiconductor substrate, a support bonding on trace (bot) pad disposed on the wiring substrate and bonded to the support bump, and a dummy area disposed on the wiring substrate and spaced apart from the support bot pad.