WAFER PROCESSING APPARATUS

Organization Name

samsung electronics co., ltd.

Inventor(s)

Hun Yong Park of Suwon-si (KR)

Yeon Tae Kim of Suwon-si (KR)

Jang Hwi Lee of Suwon-si (KR)

Sang Woo Bae of Suwon-si (KR)

Kyung Su Kim of Suwon-si (KR)

Tae Soon Park of Suwon-si (KR)

Jung Chul Lee of Suwon-si (KR)

Sung Ho Jang of Suwon-si (KR)

Won Don Joo of Suwon-si (KR)

WAFER PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234177 titled 'WAFER PROCESSING APPARATUS

The abstract describes a wafer processing apparatus with a chamber that has a first rib on the outer side of a sidewall. The first rib has different light transmittance properties in its first and second portions.

Simplified Explanation:

- Wafer processing apparatus with a chamber and a rib on the outer side of a sidewall with varying light transmittance.

Key Features and Innovation:

- Chamber providing internal space for wafer processing. - First rib on the outer side of a sidewall with different light transmittance in its portions.

Potential Applications:

- Semiconductor manufacturing. - Thin film deposition processes. - Solar cell production.

Problems Solved:

- Control of light transmittance in wafer processing. - Enhanced process efficiency.

Benefits:

- Improved process control. - Higher quality output. - Potential cost savings.

Commercial Applications:

- Semiconductor industry for wafer processing. - Thin film coating companies. - Solar panel manufacturers.

Questions about Wafer Processing Apparatus:

1. How does the varying light transmittance in the rib benefit wafer processing? - The different light transmittance helps in controlling the exposure of the wafer to light during processing, leading to improved quality and efficiency.

2. What are the potential drawbacks of having a rib with varying light transmittance? - One potential drawback could be the complexity of manufacturing and maintaining such a structure, which may increase production costs.

Original Abstract Submitted

a wafer processing apparatus may include a chamber providing an internal space; and a first rib on an outer side of a first sidewall of the chamber. an outer side of the first rib may include a first portion and a second portion. a light transmittance of the first portion may be different from a light transmittance of the second portion.