Samsung electronics co., ltd. (20240213109). SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES simplified abstract
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Unbyoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213109 titled 'SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
The semiconductor package described in the abstract includes a first semiconductor device with a first semiconductor substrate, a first interconnect structure, and a trench extending into the substrate. A second semiconductor device is placed on top of the first device, and a cover insulating layer covers both devices.
- The semiconductor package features a unique trench structure that extends into the first semiconductor substrate, allowing for improved connectivity and insulation.
- The cover insulating layer fills the trench in the first semiconductor device, enhancing the overall performance and reliability of the package.
- By covering the side surface of the second semiconductor device, the cover insulating layer provides additional protection and insulation for the entire package.
- The design of this semiconductor package aims to optimize the functionality and durability of the semiconductor devices within it.
- The integration of the cover insulating layer with the trench structure showcases innovative engineering techniques in semiconductor packaging.
Potential Applications: - This technology can be applied in various electronic devices such as smartphones, tablets, and computers. - It can also be used in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Improved connectivity and insulation in semiconductor packages. - Enhanced protection and reliability of semiconductor devices. - Optimization of functionality and durability in electronic devices.
Benefits: - Increased performance and reliability of electronic devices. - Enhanced protection for semiconductor devices. - Improved overall functionality and durability of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the consumer electronics industry, automotive sector, medical device manufacturing, and industrial equipment production. It offers improved performance, reliability, and durability for electronic devices, making it a valuable innovation for various commercial applications.
Questions about Semiconductor Packaging Technology: 1. How does the trench structure in the semiconductor package contribute to improved connectivity and insulation? The trench structure in the semiconductor package allows for better connectivity between components and provides enhanced insulation to prevent interference and damage.
2. What are the potential applications of this advanced semiconductor packaging technology in different industries? This technology can be applied in consumer electronics, automotive electronics, medical devices, and industrial equipment to improve performance, reliability, and durability.
Original Abstract Submitted
provided is a semiconductor package including a first semiconductor device including a first semiconductor substrate, a first interconnect structure on the first semiconductor substrate, and a trench extending into the first interconnect structure and a portion of the first semiconductor substrate, a second semiconductor device on the first semiconductor device, and a cover insulating layer on the first semiconductor device and a side surface of the second semiconductor device, the cover insulating layer including a first portion filling the trench included in the first semiconductor device and contacting the first semiconductor substrate.
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