Samsung electronics co., ltd. (20240128097). CHIP EJECTOR simplified abstract
CHIP EJECTOR
Organization Name
Inventor(s)
CHIP EJECTOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128097 titled 'CHIP EJECTOR
Simplified Explanation
The patent application describes a chip ejector with a pushing mechanism that can easily delaminate a semiconductor chip from a film using vacuum suction and downward force.
- Ejector body with vacuum holes:
- The ejector body has first vacuum holes to fix the film with the semiconductor chip using vacuum suction. - An opening is formed under the semiconductor chip. - At least one second vacuum hole is arranged around the opening to provide vacuum suction to a portion of the film under the edge of the chip.
- Pushing mechanism:
- The pushing mechanism is lifted through the opening to lift up the semiconductor chip and the film. - A strong downward force is applied to the portion of the film under the edge of the chip to delaminate it easily.
Potential Applications
The technology can be used in semiconductor manufacturing processes for separating chips from films during production.
Problems Solved
The chip ejector solves the problem of efficiently and effectively delaminating thin semiconductor chips from films without causing damage.
Benefits
The technology allows for precise and gentle separation of semiconductor chips, reducing the risk of damage and improving overall production efficiency.
Potential Commercial Applications
"Semiconductor Chip Ejector Technology for Delamination in Manufacturing Processes"
Possible Prior Art
There may be existing technologies for separating semiconductor chips from films, but the specific combination of vacuum suction, opening design, and pushing mechanism as described in this patent application may be novel.
Unanswered Questions
How does this technology compare to traditional methods of separating semiconductor chips from films?
The article does not provide a direct comparison between this technology and traditional methods, such as manual delamination or other automated processes.
What are the potential limitations or challenges of implementing this chip ejector technology in semiconductor manufacturing facilities?
The article does not address any potential limitations or challenges that may arise when implementing this technology in real-world manufacturing environments.
Original Abstract Submitted
a chip ejector may include an ejector body and a pushing mechanism, the ejector body may include first vacuum holes, an opening and at least one second vacuum hole, the first vacuum holes may fix a film having at least one semiconductor chip using a vacuum, the opening may be formed under the semiconductor chip, the second vacuum hole may be arranged around the opening to provide a portion of the film under an edge portion of a lower surface of the semiconductor chip with the vacuum, the pushing mechanism may be lifted in the ejector body through the opening to lift up the semiconductor chip and the film, thus, a sufficiently strong downward force may be applied to the portion of the film under the edge portion of the lower surface of the semiconductor chip to readily delaminate the semiconductor chip having a thin thickness from the film.
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