SEMICONDUCTOR PACKAGE

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SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 20250125238 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

a semiconductor package includes a first substrate including a first insulating layer and a first wiring layer disposed on or in the first insulating layer; first and second packages disposed on the first substrate, and each including a substrate, a semiconductor chip on the substrate, connection members connecting the substrate to the semiconductor chip, and a serdes chip embedded in the substrate; 1-1 connection members connecting the first substrate to the first package; and 2-1 connection members connecting the first substrate to the second package. the number of connection members of the first package is greater than the number of 1-1 connection members. the number of connection members of the second package is greater than the number of 2-1 connection members.