Samsung electro-mechanics co., ltd. (20250125096). MULTILAYER ELECTRONIC COMPONENT
MULTILAYER ELECTRONIC COMPONENT
Organization Name
samsung electro-mechanics co., ltd.
Inventor(s)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 20250125096 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
a multilayer electronic component of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; a connection portion disposed in an end of the internal electrode; an interface plating layer disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the connection portion; and an external electrode disposed on the interface plating layer, wherein the connection portion may have a different crystal structure from the internal electrode.