Samsung electro-mechanics co., ltd. (20250125095). MULTILAYER ELECTRONIC COMPONENT
MULTILAYER ELECTRONIC COMPONENT
Organization Name
samsung electro-mechanics co., ltd.
Inventor(s)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 20250125095 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
a multilayer electronic component includes a body containing a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body and connected to the internal electrode. the external electrode includes a conductive resin layer including metal particles, core-shell particles including a polymer core and a metal shell disposed on at least a portion of the polymer core, and a resin. the conductive resin layer includes a first region adjacent to the body and a second region adjacent to an outside of the conductive resin layer. in at least one cross section passing through the body, an area fraction occupied by the core-shell particles in the second region is greater than an area fraction occupied by the core-shell particles in the first region.