Samsung display co., ltd. (20240159515). DEVICE AND METHOD FOR MEASURING THICKNESS simplified abstract
DEVICE AND METHOD FOR MEASURING THICKNESS
Organization Name
Inventor(s)
OHJUNE Kwon of Yongin-si, Gyeonggi-do (KR)
JINHO Hyun of Yongin-si, Gyeonggi-do (KR)
DEVICE AND METHOD FOR MEASURING THICKNESS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240159515 titled 'DEVICE AND METHOD FOR MEASURING THICKNESS
Simplified Explanation
The abstract describes a thickness measuring device that includes an imaging unit positioned above an inspection substrate, which consists of a substrate, a pattern on the substrate, and an inspection layer on the pattern. The imaging unit captures images of the inspection substrate to generate inspection image data, which is then used by a data calculating unit to determine the thickness of the inspection layer. The imaging unit is tilted at a fixed angle with respect to the inspection substrate, and the data calculating unit calculates the thickness value of the inspection layer using the coordinate value of the pattern from the inspection image data.
- Imaging unit positioned above inspection substrate
- Inspection image data used to calculate thickness of inspection layer
- Imaging unit tilted at fixed angle with respect to substrate
- Data calculating unit uses coordinate value of pattern to calculate thickness
Potential Applications
This technology can be applied in industries where precise measurement of thickness is crucial, such as semiconductor manufacturing, microelectronics, and thin film coatings.
Problems Solved
This technology solves the problem of accurately measuring the thickness of thin layers on substrates, which is essential for quality control and ensuring product performance.
Benefits
The benefits of this technology include improved accuracy in thickness measurement, increased efficiency in production processes, and enhanced quality control measures.
Potential Commercial Applications
Potential commercial applications of this technology include quality control systems in manufacturing plants, research and development laboratories, and testing facilities.
Possible Prior Art
One possible prior art for this technology could be similar thickness measuring devices used in industries such as semiconductor manufacturing or nanotechnology research.
What are the specific industries that could benefit from this technology?
Industries such as semiconductor manufacturing, microelectronics, and thin film coatings could benefit from this technology due to the need for precise thickness measurements in their production processes.
How does this technology improve upon existing thickness measuring devices?
This technology improves upon existing devices by utilizing a tilted imaging unit to capture more accurate images of the inspection substrate, leading to more precise calculations of the thickness of the inspection layer.
Original Abstract Submitted
a thickness measuring device includes an imaging unit disposed above an inspection substrate, which includes a substrate, a pattern provided on the substrate, and an inspection layer disposed on the pattern. the imaging unit images the inspection substrate to output inspection image data and a data calculating unit receives the inspection image data and calculates a thickness value of the inspection layer from the inspection image data, wherein the imaging unit is disposed inclined at a fixed angle with respect to the inspection substrate, and wherein the data calculating unit calculates the thickness value of the inspection layer using a coordinate value of the pattern from the inspection image data.