Samsung Electronics Co., Ltd. patent applications on 2025-06-26
Patent Applications by Samsung Electronics Co., Ltd. on June 26th, 2025
Samsung Electronics Co., Ltd.: 186 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}, 4), H10B12/315 (ELECTRONIC MEMORY DEVICES, 3), H10B12/482 (ELECTRONIC MEMORY DEVICES, 3), H01M10/0562 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY, 3), H10D30/475 (No explanation available, 2), H04W64/00 (Locating users or terminals {or network equipment} for network management purposes, e.g. mobility management, 2), H04M1/0216 ({Foldable in one direction, i.e. using a one degree of freedom hinge}, 2), G11C7/1048 ({Data bus control circuits, e.g. precharging, presetting, equalising}, 2), H10B41/27 (ELECTRONIC MEMORY DEVICES, 2), H10B12/50 (ELECTRONIC MEMORY DEVICES, 2)
With keywords such as: including, plurality, having, cleaner, shaft, rotor, axis, motor, rotational, fixed in patent application abstracts.
Top Inventors:
- Masayuki TAKADA of Yokohama-shi JP (1 patents)
- Minoru YOSHIDA of Yokohama-shi JP (1 patents)
- Youngjun CHO of Suwon-si KR (1 patents)
- Hyunju LEE of Suwon-si KR (1 patents)
- Seungryong CHA of Suwon-si KR (1 patents)
Collaborating organizations:
- UIF (University Industry Foundation), Yonsei University (1 patents)
- Seoul National University R&DB Foundation (1 patents)
Patent Applications by Samsung Electronics Co., Ltd.
20250204731. FAN MOTOR CLEANER INCLUDING SAME (Samsung Electronics ., .)
Abstract: a fan motor, and a cleaner including the fan motor, including a shaft having a rotational axis; a rotor fixed to the shaft, and including a plurality of magnetic poles about the rotor; and a stator including an annular core ring, a plurality of teeth protruding from the core ring toward the rotational axis, and a plurality of coils respectively wound around each tooth, wherein each tooth includes a protruding end facing the rotor with an air gap between the protruding end and an outer circumferential surface of the rotor, a first flange portion protruding from the protruding end in the rotation direction of the rotor, and a second flange portion protruding from the protruding end in an opposite direction of the rotation direction of the rotor, wherein the first and second flange portions are asymmetrical with respect to a central line of the tooth extending from the rotational axis.
20250204743. MOP WASHING APPARATUS MOP WASHING SYSTEM COMPRISING SAME (Samsung Electronics ., .)
Abstract: this mop washing system comprises a mop cleaner and a mop washing apparatus. the mop washing apparatus comprises a main body, and a water tank. the mop washing apparatus is a washing tray provided to accommodate a mop to be washed, and comprises a first bottom to allow the water to flow in and includes a guide wall, the guide wall has an opening. the washing tray comprises a second bottom at a lower than the first bottom to accommodate the water discharged through the opening and which includes a washing tray discharge port to allow the water to be discharged the outside of the washing tray. the mop washing apparatus further comprises a drainage tray to at least partially accommodate the washing tray, and comprises a receiving groove so that the drainage tray is at least partially accommodated therein and is detachable.
20250205103. WEARABLE DEVICE OPERATING METHOD THEREFOR (Samsung Electronics ., .)
Abstract: a wearable device may include: a first sensor for measuring a joint angle of a user; a driving module, which generates torque through a motor so as to apply an external force to the user; and a processor, which receives angle information obtained by measuring the angle through the first sensor, determines, on the basis of the received angle information and a plurality of parameter values, first control information for generating the torque, controls the driving module on the basis of the determined first control information such that torque corresponding to the determined first control information is generated, determines reference values for changing parameters by using at least one from among angle values of the received angle information, a provided angular velocity value and a provided torque value, and changes at least one of the parameter values if at least one from among a first angle value received from the first sensor values after the reference values are determined, a first angular velocity value obtained after the reference values are determined, and a first torque value determined after the reference values are determined reaches one of the determined reference values.
Abstract: an electronic device that detects the connection of a fastening frame, may receive a sensed magnetic flux value from a sensor module of the electronic device, determine that a fastening frame is connected to a housing of the electronic device if the received magnetic flux value is at or above a preset threshold value, and transmit, to a first external device, a first event signal corresponding to the connection of the fastening frame and the housing.
20250205522. MASK (Samsung Electronics ., .)
Abstract: a mask is provided. the mask includes a mask body allowing air to be introduced and discharged therethrough, a fan disposed at the rear of the mask body to generate a blowing force, a first filter disposed between the mask body and the fan, and configured to filter air intaken by the fan, and a second filter disposed at rear of the fan to cover at least a part of a face of the user. the second filter is configured to filter air intaken from an outside of the mask body during the user inhales, and filter air discharged toward the outside of the mask body during the user exhales.
20250205544. METHOD DEVICE EXERCISE ASSISTANCE (Samsung Electronics ., .)
Abstract: an exercise assist method includes receiving a user input signal comprising exercise setting information from an external device; measuring, based on the user input signal, a joint angle of a hip joint of a user wearing an exercise assist device configured to assist a user in performing a leg movement; and controlling torque of the exercise assist device to be applied to a leg of the user based on the measured joint angle and the exercise setting information.
Abstract: the present disclosure relates to a cleaning brush for a semiconductor device, a cleaning module for a semiconductor device, a chemical mechanical polishing (cmp) equipment, and a post-cmp cleaning method. an example cleaning brush for a semiconductor device includes a polymer with a stimulus-responsive ligand. an example cleaning module for a semiconductor device includes the cleaning brush. an example chemical mechanical polishing equipment includes the cleaning module. an example post-cmp cleaning method uses the cleaning brush, the cleaning module, or the chemical mechanical polishing equipment.
Abstract: in a method of soldering electronic devices, a lamp heater may be provided, the lamp heater including a light-emitting portion and a shutter portion, wherein the light-emitting portion is configured to irradiate a first irradiation region, a second irradiation region, and a third irradiation region sequentially arranged in a first direction, wherein the shutter portion provides a first shutter configured to block light to the first irradiation region and a second shutter configured to block light to the third irradiation region. a package array may be disposed on a substrate supply actuator, wherein the package array includes a first package and a second package that are sequentially disposed along the first direction. the substrate supply actuator may be moved in the first direction to sequentially pass the package array through the first irradiation region, the second irradiation region and the third irradiation region. soldering processes may be performed on the first package and the second package by selectively blocking the light to the first irradiation region and the light to the third irradiation region when the first package and the second package moves through the first irradiation region, the second irradiation region, and the third irradiation region.
20250206335. METHOD DEVICE PATH GENERATION (Samsung Electronics ., .)
Abstract: a processor-implemented method with path generation includes obtaining input data that includes recognition sensor data and state data, inputting the input data into an artificial neural network (ann) model and outputting output data corresponding to the input data in a single forward process, and obtaining path data and control data corresponding to the path data, based on the output data.
20250206533. APPARATUS METHOD STORING ARTICLES (Samsung Electronics ., .)
Abstract: an apparatus for storing articles includes first and second ports different from each other; and one input/output sensor corresponding to the first port and the second port, in which the input/output sensor includes a memory that stores first and second identifiers different from each other, and a controller that allocates the first identifier to the input/output sensor during a first time interval, and allocates the second identifier to the input/output sensor during a second time interval, the controller is configured such that, when the controller starts a communication with a conveying robot using the first identifier during the first time interval, the conveying robot performs an article loading and unloading operation at the first port, and when the controller starts the communication with the conveying robot using the second identifier during the second time interval, the conveying robot performs the operation at the second port.
Abstract: a ternary paraelectric having a cc structure and a method of manufacturing the same are provided. the ternary paraelectric having a cc structure includes a material having a chemical formula of abothat has a monoclinic system, is a space group no. 9, and has a dielectric constant of 150 to 250, wherein “a” is a group 1 element, and “b” is a group 5 element. “a” may include one of na, k, li and rb. “b” may include one of nb, v, and ta. the abomaterial may be nanboin which bandgap energy thereof is greater than that of sto. the abomaterial may have relative density that is greater than 90% or more.
Abstract: a method of preparing a carrier on which a denitrifying microorganism and a biofilm-forming microorganism are immobilized, the method including: mixing a polyvinylalcohol, a denitrifying microorganism, and a biofilm-forming microorganism to prepare a mixture; and adding the mixture to a solution containing a crosslinking agent to prepare the carrier on which a denitrifying microorganism and a biofilm-forming microorganism are immobilized. also, a polyvinylalcohol carrier on which a denitrifying microorganism and a biofilm-forming microorganism are immobilized, and a method of removing or reducing nitric oxide in a sample by using the same.
20250207316. CLOTHES DRYER (Samsung Electronics ., .)
Abstract: a clothes dryer including a cabinet including an inlet, and a door rotatably arranged on the cabinet to open or close the inlet. the door includes a holder rotatably arranged on the cabinet, a front cover, a cover supporter to be coupled to the holder so that the cover supporter is arranged between the front cover and the holder to support the front cover, a first rim cover to be coupled to the front cover so that the first rim cover covers a rim of the front cover, and a second rim cover configured to be coupled to a rim of the holder so that the second rim cover is connected to the first rim cover. the first rim cover is separable from the second rim cover by separating the cover supporter from the holder.
20250207734. GAS CYLINDER REPLACEMENT SYSTEM (Samsung Electronics ., .)
Abstract: there is provided a gas cylinder replacement system that may automatically couple or remove a gas pipe and a gas cylinder to or from each other. the gas cylinder replacement system includes a gas cabinet for storing therein a gas pipe and a gas cylinder connected to the gas pipe, a gas cylinder replacement apparatus and a controller configured to control the gas cylinder replacement apparatus. the gas cylinder replacement apparatus includes a body, a locomotion unit configured to travel in a semiconductor process line, a manipulator including a tool changer, and a vision unit installed at a distal end of the manipulator. an attachable valve manipulation unit includes a first gripper configured to grip a valve locking device of the gas cylinder. an attachable pipe handling unit includes a second gripper configured to grip the gas pipe.
20250207788. WINDOW-TYPE AIR CONDITIONER (Samsung Electronics ., .)
Abstract: a window-type air conditioner that is installable in a window frame is provided. the window-type air conditioner includes an outdoor module including a compressor for compressing a refrigerant, an outdoor heat exchanger in which heat exchange between outdoor air and the refrigerant occurs, and an outdoor housing accommodating the compressor and the outdoor heat exchanger, an indoor module including an indoor housing spaced apart from the outdoor housing, and an indoor heat exchanger that is arranged in the indoor housing and in which heat exchange between indoor air and the refrigerant occurs, a refrigerant pipe providing a flow path through which the refrigerant moves between the indoor module and the outdoor module, and a connection support module connecting the indoor module and the outdoor module, and being configured so that opposite end portions thereof support the indoor housing and the outdoor housing, wherein at least one soundproof member surrounding the refrigerant pipe is arranged in the connection support module.
20250207799. AIR CONDITIONER CONTROL METHOD THEREOF (Samsung Electronics ., .)
Abstract: an air conditioner comprises: an outdoor unit including a compressor; a plurality of indoor units supplied with the refrigerant and performing cooling and heating operations; a mode switching unit connected between the outdoor unit and the indoor units and switches operation modes of the indoor units; a high-pressure gas pipe connected to the outlet side of the compressor and the mode switching unit; a low-pressure gas pipe connected to the inlet side of the compressor and the mode switching unit; a hot gas valve provided in a hot gas pipe connecting the high-pressure gas pipe and the low-pressure gas pipe; and a control unit which determines whether a mixed cooling and heating operation is possible, based on the indoor temperature and the cooling operation rates of the plurality of indoor units, and controls the hot gas valve based on whether the mixed cooling and heating operation is possible.
20250207801. AIR CONDITIONER CONTROL METHOD THEREFOR (Samsung Electronics ., .)
Abstract: an air conditioner may include: at least one indoor unit including an indoor temperature sensor configured to detect an indoor temperature; an outdoor unit including a compressor configured to compress a refrigerant, an outdoor heat exchanger configured to exchange heat between the refrigerant and outdoor air, and an outdoor temperature sensor configured to detect an outdoor temperature; an expansion valve configured to adjust a flow rate of the refrigerant; and at least one processor, comprising processing circuitry, individually and/or collectively, configured to determine whether a refrigerant amount is normal based on the outdoor temperature, the indoor temperature, and an opening/closing rate of the at least one expansion valve.
20250207803. AIR CONDITIONER CONTROLLING METHOD THEREOF (Samsung Electronics ., .)
Abstract: an air conditioner includes: an indoor unit including an indoor heat exchanger; an outdoor unit including a compressor configured to supply a refrigerant to the indoor heat exchanger; a pressure sensor configured to detect a pressure of the compressor; an indoor humidity sensor configured to detect an indoor humidity; an indoor temperature senor configured to detect an indoor temperature; and a controller comprising at least one processor, comprising processing circuitry, individually and/or collectively, configured to: periodically obtain a temperature difference between the indoor temperature and a desired temperature or a humidity difference between the indoor humidity and a reference humidity, adjust a target pressure of the compressor based on a first change amount of the temperature difference or a second change amount of the humidity difference, and adjust a frequency of the compressor in response to the target pressure being adjusted.
20250207835. REFRIGERATOR CONTROLLING METHOD SAME (Samsung Electronics ., .)
Abstract: a refrigerator includes: a compressor; a condenser connected to the compressor; a first valve including a first input port, a first port and a second port, and a third port; a second valve including a second input port connected to the third port, a first output port, a second output port, and a third output port; and a controller configured to control the first valve to allow the first input port to communicate with the first port and to allow the second port to communicate with the third port in the first mode, control the first valve to close the second port and to allow the first port to communicate with the third port in the second mode, and control the first valve to close the first port and the second port and to allow the first input port to communicate with the third port in the third mode.
20250207842. REFRIGERATOR HOME APPLIANCE (Samsung Electronics ., .)
Abstract: a refrigerator including a main body forming a storage compartment, and a door configured to open and close the storage compartment. the door includes a door body rotatably coupled to the main body and including an insulator therein, a panel body positioned in a front of the door body, a first trim disposed at a first edge of the panel body and configured to be coupled to the door body while being rotated with respect to the door body, and a second trim disposed at a second edge opposite to the first edge of the panel body and configured to be coupled to the door body when the first trim is coupled to the door body.
Abstract: a two-dimensional (2d) pressure sensor includes a substrate, a pressure deformation layer on the substrate and configured to deform due to external pressure applied by a workpiece, a magnetic bump on the pressure deformation layer and configured to move due to the external pressure applied by the workpiece, a proximity sensor in the pressure deformation layer and configured to detect at least one of movement of the workpiece and movement the magnetic bump, and a tactile sensor in the pressure deformation layer and configured to detect deformation of the pressure deformation layer.
20250208441. WEARABLE DEVICE COMPRISING SPEAKER (Samsung Electronics ., .)
Abstract: a wearable device according to an embodiment includes a frame including a first partition wall having flexibility and a second partition wall in contact with the first partition wall and having rigidity, and a speaker including a first surface and a second surface opposite to the first surface, and being surrounded by the second partition wall. the wearable device includes a first space in contact with the second surface and extending from an inside of the second partition wall to an inside of the first partition wall. the wearable device includes an enclosure including a flexible region disposed on the first partition wall, and a rigid region extending from the flexible region and disposed on the second partition wall. the enclosure is configured to seal the first space.
Abstract: an optical phased array according to an example embodiment includes a light source configured to emit a light in an infrared band; a light irradiator configured to receive the emitted light and irradiate the light to an outside; a phase modulation optical amplification unit provided between the light source and the light irradiator; and an optical splitting configured to split the light emitted from the light source, wherein the phase modulation optical amplification unit is configured to amplify the light emitted from the light source while modulating a first phase of the emitted light to a second phase, and includes: a phase modulator configured to cause a portion of a phase difference between the first phase and the second phase; and a phase modulation optical amplifier configured to amplify the emitted light while causing a remaining portion of the phase difference.
20250208483. CAMERA MODULE ELECTRONIC DEVICE COMPRISING CAMERA MODULE (Samsung Electronics ., .)
Abstract: a camera module is provided. the camera module includes a frame, a lens unit which is movably disposed with respect to the frame and includes at least one lens, a first carrier which includes an auto focus (af) magnet disposed to face a first direction, and coupled to the lens unit to move the lens unit in the first direction, and a second carrier including a first optic image stabilization (ois) magnet disposed to a first face and a second ois magnet disposed to a second face and moving the lens unit in at least one of a second direction or a third direction different from the second direction, wherein the frame includes a first af coil disposed to the frame to face the af magnet, a first ois coil disposed to the frame to face the first ois magnet, and a second ois coil disposed to the frame to face the second ois magnet, and wherein the first carrier includes a first yoke disposed to face the first ois magnet, and a second yoke disposed to face the second ois magnet.
Abstract: a full-shot layout correction method includes inputting data of a full-shot layout, extracting a density map from the full-shot layout, extracting a blurred density map by blurring the density map, defining a correction area based on the blurred density map, separating a cell pattern and a core pattern, which overlap the correction area, performing an optical proximity correction (opc) on the cell pattern, and reconstructing a full-shot layout by using the cell pattern on which the opc has been performed.
Abstract: an euv light source includes: a vacuum chamber including a target area, a main generator configured to drop a main droplet into the target area; a laser source configured to irradiate, to the target area, a laser beam that strikes the main droplet to generate plasma; a mirror adjacent to the target area and configured to concentrate extreme ultraviolet rays generated from the plasma, and an additional generator adjacent to the main generator and configured to drop an additional droplet into the target area.
20250208519. EXPOSURE EQUIPMENT (Samsung Electronics ., .)
Abstract: provided is a wafer exposure time inspection device including an estimation circuit configured to estimate a minimum step time or an optimal exposure speed. in the minimum step time, a step time during which an exposure device completes exposure for one shot area from among a plurality of shot areas on a wafer and moves to a next shot area is minimized, and in the optimal exposure speed, a sum of the step time and a scan time during which the shot area is exposed is minimized. a comparison circuit configured to compare a measured wafer exposure time with a first optimal wafer exposure time calculated from the minimum step time and the scan time or compare the measured wafer exposure time with a second optimal wafer exposure time calculated from the estimated optimal exposure speed.
20250208631. ROBOT CLEANER LIQUID DETECTING METHOD THEREOF (Samsung Electronics ., .)
Abstract: a robot cleaner includes: an ir light source; an ir receiver; a driver; and one or more processors configured to: control the driver to move the robot cleaner through a space, output ir light using the ir light source while the robot cleaner moves through the space, and perform an operation of detecting liquid on a floor around the robot cleaner based on the reflected ir light received by the ir receiver, and to: perform the operation of detecting liquid in a first mode, based on the liquid being detected, change the robot cleaner to a second mode, and perform the operation of detecting liquid in the second mode. in the first mode, the operation of detecting liquid is performed based on a specific period. in the second mode, a period of the operation of detecting liquid is changed based on a distance between the robot cleaner and the liquid.
20250208651. FOLDABLE COMPUTING DEVICE (Samsung Electronics ., .)
Abstract: a foldable computing device includes a first body including a bottom case including an interface opening, a daughter board, and an input/output (io) port on the daughter board and corresponding to the interface opening. the foldable computing device further includes: a rotating shaft; a second body pivotally connected to the first body by the rotating shaft; and a telescoping unit including at least one body that is connected to the rotating shaft, wherein the rotating shaft is configured to rotate based on unfolding or folding of the first body and the second body with respect to each other, and wherein the at least one body of the telescoping unit is configured to cause the io port to telescopically engage with or disengage from the interface opening based on the rotating shaft rotating due to the unfolding or the folding.
Abstract: an electronic device includes: a housing including: a first surface, a second surface, and a side surface, and including a first coupling portion; a first frame including a first through hole and a first fastening portion corresponding to the first coupling portion, wherein the first frame is detachably coupled to the side surface; and a strap including a first receiving groove and a first pin that is movable in a second direction perpendicular to the first direction with respect to the first receiving groove. the first pin is accommodated in the first through hole. the strap is detachably coupled to the first frame. the first coupling portion is coupled to the first fastening portion. a first coupling between the first frame and the housing is maintained. the first receiving groove surrounds an end of the first frame. a second coupling between the first frame and the strap is maintained.
20250208662. ELECTRONIC DEVICE INCLUDING KEYBOARD (Samsung Electronics ., .)
Abstract: disclosed is an electronic device comprising: a housing comprising a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface surrounding at least a portion of a space between the first surface and the second surface; a first conductive part arranged along a first part of the side surface; a second conductive part arranged along a second part of the side surface; a first segmentation portion disposed between the first conductive part and the second conductive part and electrically isolating the first conductive part and the second conductive part from each other, a keyboard exposed to the outside through the first surface; a communication circuit arranged inside the housing; and a processor arranged inside the housing and electrically connected to the keyboard and the communication circuit, wherein, based on the electronic device being arranged to overlap a partial area of an external electronic device, the first segmentation portion is aligned with a second segmentation portion arranged at a side surface portion of a housing of the external electronic device.
Abstract: an electronic device is provided. the electronic device includes a hinge structure including a hinge bracket, a first hinge plate rotatable with respect to the hinge bracket, and, a second hinge plate distinct from the first hinge plate and rotatable with respect to the hinge bracket, a display disposed on the first hinge plate and the second hinge plate across the hinge structure, a plurality of reinforcement members, attached to the display, including a first reinforcement member facing a surface of the first hinge plate and spaced apart from the first hinge plate, and a second reinforcement member facing a surface of the second hinge plate and spaced apart from the second hinge plate, and a first heat dissipation member including a first region interposed between the first reinforcing member and the surface of the first hinge plate, a second region interposed between the second reinforcing member and the surface of the second hinge plate, and a third region connecting the first and the second region and being deformed by movement of the first hinge plate and the second hinge plate, wherein, in an unfolded state of the electronic device in which a direction in which the surface of the first hinge plate faces the same direction in which the surface of the second hinge plate faces, at least a portion of the third region passes through a gap between a side surface of the first hinge plate and a side surface of the second hinge plate, which face each other.
20250208708. ELECTRONIC DEVICE METHOD CONTROLLING ELECTRONIC DEVICE (Samsung Electronics ., .)
Abstract: an electronic device comprising at least one sensor; a memory comprising at least one instruction; and at least one processor configured to execute the at least one instruction to: determine, through the at least one sensor, a location of a user, wherein the location comprises: a distance between the user and a screen on which an image, which is output from the electronic device, is displayed, and a direction of the user with respect to the electronic device, select a target object in a first area, which corresponds to a direction in which the user is located, among an entire area displayed on the screen, and control the target object to be enlarged, when the at least one processor determines that the distance between the user and the screen is within a first threshold distance.
Abstract: an electronic device according to one embodiment may comprise a gps module, a communication module, a memory, and a processor. the processor according to one embodiment may be configured to determine, using the gps module, that the electronic device has entered a designated space. the processor according to one embodiment may be configured to receive, from the wearable electronic device through the communication module, first communication signal information about a communication signal received by a wearable electronic device. the processor according to one embodiment may be configured to perform clustering on the first communication signal information to identify a first area where the wearable electronic device is located from among a plurality of areas included in the designated space. the processor according to one embodiment may be configured to transmit information about the first area to the wearable electronic device through the communication module. the processor according to one embodiment, on the basis of transmitting the information about the first area to the wearable electronic device, may be configured to obtain, from the wearable electronic device through the communication module, information about a first activity of a user related to the first area. the processor according to one embodiment may be configured to obtain a first command for controlling a head mounted display (hmd) device on the basis of the information about the first activity and the information about the first area. the processor according to one embodiment may be configured to transmit the first command to the hmd device through the communication module. various other embodiments can be applied.
Abstract: an electronic device providing a user interface, according to embodiments of the disclosure may comprise memory storing at least one instruction and at least one processor executing the at least one instruction. the at least one processor may perform a communication connection with a user device based on a trigger input, receive user characteristic information in association with the user device, generate a personal setting option applicable based on the user characteristic information, output a first user interface allowing a selection to be made as to whether to apply the personal setting option, and output a second user interface to which the personal setting option is applied, based on an input through which the selection is made to apply the personal setting option.
20250208772. STORAGE DEVICE OPERATION METHOD THEREOF (Samsung Electronics ., .)
Abstract: a storage device includes a plurality of memory devices and a storage controller receiving a plurality of commands that operate the plurality of memory devices from an external host device. the storage device determines an operation order of the plurality of memory devices according to the plurality of commands based on a power consumption profile table including a power information indicating a power consumption of each of the plurality of memory devices.
20250208792. STORAGE DEVICE (Samsung Electronics ., .)
Abstract: a storage device includes a memory device having a first erase unit area and a second erase unit area that has a bit density higher than a bit density of the first erase unit area, and a storage controller. the storage controller receives a write command including a tag indicating a danger from a first electronic control unit, based on an automobile safety level of data received with the write command being greater than or equal to a threshold level, stores the data in the first erase unit area, and based on the automobile safety level being lower than the threshold level, stores the data in the second erase unit area, and based on a danger termination signal being received from the first electronic control unit, moves the data received with the write command and stored in the first erase unit area, to the second erase unit area.
Abstract: an electronic device outputs, on a second display screen, a page layout output on a first display screen along with another page layout grouped together with the page layout in response to a screen switch from the first display screen to the second display screen having a greater display area than a display area of the first display screen, and switches the grouped page layouts in response to a swipe input being detected.
20250208859. UPDATE METHOD ELECTRONIC DEVICE THEREFOR (Samsung Electronics ., .)
Abstract: an electronic device is provided. the electronic device includes memory storing one or more computer programs, and including a first area in which a first version of an operating system (os) is installed, a second area different from the first area, and a secure area in which version information about the os is stored, and a one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to store update data corresponding to of the a second version os in the second area, set a portion of the second area in which the update data is stored and a portion of the first area as a virtual partition, attempt to boot using the second version of the os installed in the virtual partition, transmit a result of the booting to the secure area, and determine whether to change the version information stored in the secure area based on the result.
Abstract: an ecc engine of a semiconductor memory device includes an ecc encoder and an ecc decoder. the ecc encoder generates parity data based on main data based on a primitive polynomial and stores a codeword including the main data and the parity data in a target page. the ecc decoder reads the codeword from the target page based on an address to generate a syndrome and corrects at least one error bit in the read codeword based on the syndrome by respectively applying different syndromes to a single bit error in the read codeword, adjacent bit errors and non-adjacent bit errors occurring in non-adjacent two memory cells in the target page. the ecc decoder generates the different syndromes based on a parity check matrix generated as a function of the primitive polynomial. the primitive polynomial has an alpha matrix as a solution belonging to a galois field.
Abstract: some example embodiments provide an electronic device including: a plurality of processors; and a storage device. the storage device includes a first storage interface connected to a first processor among the plurality of processors, a second storage interface connected to a second processor among the plurality of processors, a non-volatile memory, and an interface controller that controls a connection relationship between the first storage interface, the second storage interface, and the non-volatile memory. the first processor, the second processor, and the storage device are on a first substrate. the storage device communicates with the first and second processors via different methods, such that the storage device communicates with the first processor according to a first method and communicates with the second processor according to a second method different from the first method.
Abstract: a method of performing data analysis according to a natural language query from a user includes: receiving, from a user terminal, a user input including the natural language query requesting the data analysis; determining, based on the user input, at least one database among a plurality of databases as a target database; generating a prompt based on the user input and the target database; inputting the prompt into a code generation model to obtain a structured query (sql) statement; executing the sql statement to generate a result of the data analysis on the target database; and transmitting the result of the data analysis to the user terminal, where the result of the data analysis is displayed on a screen of the user terminal.
Abstract: a storage device including: a non-volatile memory device that includes a first stripe including a victim memory block and a plurality of striping memory blocks associated with the victim memory block, and a second stripe including a decoy memory block; and a memory controller configured to: identify a victim page within the victim memory block based on physical address history information stored in a decoy page within the decoy memory block; generate recovery data based on a plurality of striping pages, each included in the plurality of striping memory blocks, wherein the plurality of striping pages correspond to the victim page; and program the recovery data into the victim page.
Abstract: a method for layout designing, includes preparing a first layout, forming a test pattern based on the first layout generating first error data based on the first layout and the test pattern, wherein the first error data includes a value of misalignment of the test pattern from a reference position, normalizing coordinate data of the first layout to obtain first coordinate data, generating first stress distribution data by performing finite element analysis simulation, wherein a boundary condition of the structural analysis mesh model is determined based on the first coordinate data, generating an error prediction machine learning model based on the first error data, the first coordinate data, and the first stress distribution data, predicting second error data of a second layout, and generating a final layout based on the second error data.
Abstract: a method of operating an artificial neural network model including a plurality of nodes includes: dividing the artificial neural network model into a divided artificial neural network including plurality node groups using a first grouping manner, allocating the plurality of node groups to a plurality of first hardware accelerators and a plurality of second hardware accelerators using a first corresponding manner to generate an allocation, executing the divided artificial neural network model on a plurality of input values to generate a plurality of inference results values, for each of the plurality of inference result values, recording activation area information of the plurality of node groups and a call count, and performing at least one of a first operation to change the allocation and a second operation to change the divided artificial neural network based on the activation area information and the call count.
Abstract: an electronic device includes at least one processing device configured to obtain an image. the at least one processing device is also configured to determine high-frequency features of the image using the image. the at least one processing device is further configured to determine a weighting map based on blurriness of at least some pixels in the image, where the weighting map represents how much to sharpen the at least some pixels in the image. the at least one processing device is also configured to apply the weighting map to the high-frequency features of the image to generate weighted high-frequency features. in addition, the at least one processing device is configured to combine the weighted high-frequency features with the at least some pixels in the image to generate an enhanced image.
20250209657. METHOD ELECTRONIC DEVICE TRACKING OBJECT (Samsung Electronics ., .)
Abstract: a method of tracking at least one object, includes: obtaining an image; extracting, from the image, a feature map for performing a plurality of tasks related to object tracking; extracting, by using the extracted feature map, location information indicating a location of the at least one object, an identification feature for identifying the at least one object, and a body orientation angle at which a body of the at least one object is oriented; and tracking the at least one object, based on the location information, the identification feature, and the body orientation angle of the at least one object.
20250209704. ELECTRONIC DEVICE DISPLAYING TEXT METHOD THEREFOR (Samsung Electronics ., .)
Abstract: an electronic device is provided. the electronic device includes a display, memory storing one or more computer programs, and one or more processors communicatively coupled to the display and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to display an image in the display, based on a first input indicating to select a text in the image, a first visual object overlappingly on a portion in the image selected by the first input, display, based on one or more characters included in the portion of the image overlapped by the first visual object, a second visual object including the one or more characters in association with the first visual object, and change, based on the portion of the image overlapped by the first visual object having a size changed based on a second input indicating to change the size of the first visual object overlapped on the image, the one or more characters included in the second visual object.
Abstract: a computer-implemented method of generating fullbody animatable avatar of a person from a single image of the person includes: obtaining an image of a person body and a parametric body model defined by pose parameters and shape parameters of the person body in the image, and by camera parameters used when capturing the image; defining, based on the parametric body model, a texturing function including a mapping between each pixel corresponding to a part of the person body shown in the image and corresponding texture coordinates in a texture space, and corresponding texture coordinates in the texture space for a part of the person body not shown in the image; sampling rgb texture of the person body based on the mapping and obtaining a map of sampled pixels.
Abstract: provided are an electronic device for obtaining a result of recognizing an object from an image obtained using a metalens, and an operation method of the electronic device. the method may include obtaining a coded image based on light reflected from the object and phase-modulated by penetrating through the metalens; and inputting the coded image to an artificial intelligence (ai) model, and obtaining a result of recognizing the object using the ai model, the ai model is a trained neural network model configured to output a label indicating a ground truth associated with an rgb image using a simulated image, the simulated image being based on optical properties of the metalens, wherein the ai model outputs the label based on a recognition of the simulated image, and wherein the ai model is trained to minimize a correlation between the rgb image and the simulated image.
20250209827. METHOD APPARATUS MOVING OBJECT VIEW IMAGE PROCESSING (Samsung Electronics ., .)
Abstract: a method and apparatus with moving object view image processing is provided. the method includes generating a first view image of a first moving object view and a second view image of a second moving object view, determining a first occlusion region in the first view image by an obstacle in the first view, and determining a second occlusion region in the second view image by an obstacle in the second view, determining a first temporary boundary of the obstacle in the first view with respect to a first overlap region between the first view and the second view, based on the first occlusion region, determining a second temporary boundary of the obstacle in the second view with respect to the first overlap region, based on the second occlusion region, and generating a top-view image of the moving object based on the first and second temporary boundaries.
20250209840. METHOD APPARATUS PERFORMING IMAGE TAGGING (Samsung Electronics ., .)
Abstract: a method of performing image tagging may include obtaining a plurality of image tags from an image using an image tag generating model, determining a degree of relevance between the plurality of image tags based on a plurality of area distribution maps respectively corresponding to each image tag of the plurality of image tags, generating a combined tag with interconnected image tags therein based on the degree of relevance, and performing image tagging on the image using the plurality of image tags and the combined tag.
20250209854. SYSTEM METHOD STATIC DYNAMIC REAL-TIME GESTURE RECOGNITION (Samsung Electronics ., .)
Abstract: a system and a method are disclosed for performing gesture recognition. a method includes receiving frames of 3d physical body joints; performing a dynamic gesture recognition operation on a window of the frames; performing a static gesture recognition operation on an individual frame among the frames; applying a result of the static gesture recognition operation to a finite-state machine; fusing results of the dynamic gesture recognition operation and the finite-state machine; and generating a final recognized gesture based on the fusing.
20250210022. ELECTRONIC DEVICE CONTROL METHOD THEREOF (Samsung Electronics ., .)
Abstract: an electronic device comprises: a speaker; a display; a communication device that receives content; and a processor that controls, based on content being received, the speaker to output a sound in association with the content, wherein the processor generates a character user interface (ui) in association with the content based on metadata corresponding to the content, and controls the display so that the generated character ui is displayed.
20250210072. BITLINE SENSING AMPLIFIER MEMORY DEVICE INCLUDING SAME (Samsung Electronics ., .)
Abstract: disclosed is a blsa that reads data of a memory cell and includes an amplifying circuit amplifying a difference between a first voltage level of the second node and a second voltage level of the first node. the amplifying circuit includes a first pmos transistor connected between the second node and a third node and operating in response to the second voltage level, a second pmos transistor connected between the first node and the third node and operating in response to the first voltage level, a first nmos transistor connected between the second node and a fourth node connected to a first bitline of a first memory cell and operating in response to the first voltage level, and a second nmos transistor connected between the second node and a fifth node connected to a second bitline of a second memory cell and operating in response to the second voltage level.
20250210076. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes a first semiconductor die including a first interface circuit; and a second semiconductor die stacked with the first semiconductor die and including a second interface circuit connected to the first semiconductor die by a plurality of via structures, wherein the first interface circuit is configured to generate an error detection code for transmission data and transmit the data signal including the transmission data and the error detection code to the second interface circuit through at least some of the plurality of via structures, and the second interface circuit is configured to generate response data indicating whether the data signal is normally received and an error correction code of the response data, and transmit a response signal including the response data and the error correction code to the first interface circuit through at least one via structure among the plurality of via structures.
Abstract: a decision feedback equalizer (dfe) includes an adder including a first node and a second node, and the adder configured to: receive an input signal, amplify a voltage difference between a reference voltage level and a voltage level of the input signal, and output a first internal signal from the first node and a second internal signal from the second node, a first dfe tap configured to provide a first tap bias current to one of the first node and the second node, based on a first sample signal corresponding to an immediately preceding bit of the input signal, and a tap bias voltage generation circuit configured to provide the first dfe tap with a first tap bias voltage corresponding to the first tap bias current, based on the dq bias voltage, a tap code, and a temperature code depending on a temperature of the dfe.
20250210092. INTEGRATED CIRCUIT DEVICE (Samsung Electronics ., .)
Abstract: an integrated circuit device includes a substrate having a cell array area, a peripheral circuit area including a core area, and an interface area between the cell array area and the core area, a cell device isolation film defining cell active regions in the cell array area and having a first depth in a vertical direction, peripheral device isolation films defining peripheral active regions in the peripheral circuit area and each having a second depth greater than the first depth in the vertical direction, an interface device isolation film in the interface area of the substrate, and an active dam surrounding the cell array area, wherein at least a first portion of the active dam is in the core area, and at least a second portion of the active dam is apart from the cell array area with the interface device isolation film therebetween.
Abstract: a storage device is provided. the storage device includes a nonvolatile memory device configured to receive a command and an address for a write operation or an erase operation via command-address pins, transmit and receive write data or read data via data pins, and generate degeneration information by measuring at least one of a program execution time to perform the write operation and an erase execution time to perform the erase operation; and a storage controller configured to receive the degeneration information from the nonvolatile memory device, and control the nonvolatile memory device to adjust at least one of a program voltage of the write operation and an erase voltage of the erase operation based on the degeneration information.
20250210121. MAGNETIC MEMORY DEVICE (Samsung Electronics ., .)
Abstract: a magnetic memory device includes a conductive line extended in a first direction, a magnetic track line provided on the conductive line and extended in the first direction, and a non-magnetic line provided on the magnetic track line and extended in the first direction. the magnetic track line includes a lower magnetic layer and an upper magnetic layer stacked on the conductive line, an exchange coupling layer between the lower and upper magnetic layers, and a spacer layer between the exchange coupling layer and the upper magnetic layer. the exchange coupling layer is in contact with a bottom surface of the spacer layer, and the lower and upper magnetic layers are antiferromagnetically coupled with each other by the exchange coupling layer.
Abstract: provided are a method for producing a data-encoded nucleic acid by using a template-dependent nucleic acid polymerase, and a data-encoded nucleic acid produced thereby.
20250210313. APPARATUS PROCESSING SUBSTRATE (Samsung Electronics ., .)
Abstract: an apparatus for processing a substrate, the apparatus comprising a reaction chamber configured to receive the substrate, a support arranged in the reaction chamber configured to support the substrate, and a showerhead arranged between the reaction chamber and the support configured to inject a reaction gas to the substrate on the support. a diameter of the showerhead is longer than a diameter of the support. a radial difference between the diameter of the showerhead and the diameter of the support is no less than half of a gap between the showerhead and the support.
20250210322. SUBSTRATE PROCESSING APPARATUS (Samsung Electronics ., .)
Abstract: provided is a substrate processing apparatus including a chamber, a support member inside the chamber, a center bias electrode at an inner center region of the support member, an edge bias electrode at an inner edge region of the support member, a center power supply unit connected to the center bias electrode and configured to output a center start voltage at a start point of a control period and a center end voltage at an end point of the control period, and an edge power supply unit connected to the edge bias electrode and configured to output an edge start voltage at the start point and an edge end voltage at the end point, wherein a value obtained by subtracting the edge start voltage from the edge end voltage is greater than a value obtained by subtracting the center start voltage from the center end voltage.
20250210380. BARRIER LAYER REMOVAL DEVICE BARRIER LAYER REMOVAL METHOD (Samsung Electronics ., .)
Abstract: disclosed is a barrier layer removal device including: a frame mounted with a tape to which a wafer is attached, wherein the wafer includes a barrier layer disposed on one surface, a support on which the wafer, attached to the tape, is disposed, a frame cover disposed above the frame, wherein the frame fixes the wafer on the support by pressing an edge region of the one surface of the wafer and a nozzle for spraying an etchant on the barrier layer of the wafer.
20250210382. JIG DISPENSING UNDERFILLING MATERIAL (Samsung Electronics ., .)
Abstract: a jig for dispensing an underfilling material may include a jig body, a dispensing passage and an air passage. the jig body may be configured to cover a package substrate on which a semiconductor chip may be mounted via conductive bumps. the dispensing passage may be formed at one side of the jig body to dispense the underfilling material between the semiconductor chip and the package substrate. the air passage may be extended from the dispensing passage to the other side of the jig body. the jig body may accurately define a dispense region of the underfilling material on an upper surface of the package substrate. thus, it may not be required to sensitively control a discharge amount of the underfilling material so that a waste of the underfilling material may be reduced. further, when the underfilling material may make contact with the air passage with closing of the dispensing passage by the cover, the air lock may be formed in the air passage. thus, a void may not be formed in the underfilling material. furthermore, an overflow of the underfilling material may be prevented.
20250210383. SUBSTRATE PROCESSING APPARATUS (Samsung Electronics ., .)
Abstract: provided are a process module and a substrate processing apparatus including the same. the process module includes a plurality of process chambers each including a processing space in which a plurality of substrates are processed and a plurality of processing areas in which the plurality of substrates are respectively arranged within the processing space, a plurality of heater blocks respectively located in the plurality of processing areas and on which the plurality of substrates are respectively arranged, a shower head arranged on each heater block and configured to spray a process gas onto each substrate, a rotating arm unit configured to receive each substrate transferred from outside each process chamber and rotate to place each substrate on each heater block, and an exhaust port formed outside each heater block and configured to suck in the process gas.
Abstract: an inspection device of a semiconductor device includes: a semiconductor device which has a first face and a second face that are opposite to each other; and a measuring device which faces the first face, and measures heat of the semiconductor device, wherein the measuring device includes: a heat generating unit which generates heat on the second face of the semiconductor device, by emitting electromagnetic waves that penetrate through the semiconductor device; and a thermal image capturing unit which generates image data about a temperature of the second face of the semiconductor device.
Abstract: a carrier substrate includes a main layer including and extending between a first surface and a second surface opposite to each other, a first trench extending from the first surface of the carrier substrate into the main layer, and a first organic pattern inside the first trench. a method of manufacturing a semiconductor package includes providing such a carrier substrate, disposing a semiconductor chip on the carrier substrate, and forming a redistribution layer electrically connected to the semiconductor chip.
Abstract: a substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.
20250210418. SEMICONDUCTOR PACKAGE PACKAGE MODULE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a semiconductor package includes a film substrate, a plurality of first connection patterns and a plurality of second connection patterns disposed in a first direction on the film substrate, a semiconductor chip between the first and second connection patterns, a protection pattern on the film substrate and at least partially surrounding the semiconductor chip, a plurality of pads between the film substrate and the semiconductor chip, a test pattern between the film substrate and the protection pattern, a plurality of first lines respectively coupled with the plurality of first connection patterns, a plurality of second lines respectively coupled with the plurality of second connection patterns, and a test line extending from a second line of the plurality of second lines and coupled with the test pattern. the test line includes a first part coupled with the second line, and a second part coupling the first part with the test pattern.
20250210430. SEMICONDUCTOR PACKAGE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: a semiconductor package including a molding layer and a method for manufacturing the same are provided. the semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, and a molding layer on the semiconductor chip on the package substrate, the molding layer including a first filler having a first size and a second filler having a second size larger than the first size, wherein the molding layer includes a first area on an upper surface of the semiconductor chip, and a second area on a side surface of the first area, and wherein a ratio of a first content percentage of the first filler and a first content percentage of the second filler in the first area is different from a ratio of a second content percentage of the first filler and a second content percentage of the second filler in the second area.
20250210431. SEMICONDUCTOR PACKAGE MANUFACTURING METHOD THEREOF (Samsung Electronics ., .)
Abstract: a semiconductor package includes: a semiconductor chip and an electronic component mounted on a substrate; and a molding layer disposed on the substrate and covering the semiconductor chip and the electronic component, wherein the electron component includes a plurality of grooves, wherein the plurality of grooves are disposed on a surface of the electronic component, wherein the plurality of grooves have a first width at an entrance portion of the plurality of grooves and a second width greater than the first width below the entrance portion, and wherein the molding layer is disposed in the plurality of grooves.
20250210434. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes: a substrate; first semiconductor chips mounted on the substrate; a second semiconductor chip mounted on the substrate; a first molding member covering sides of the first semiconductor chips; and a second molding member covering the first semiconductor chips and the second semiconductor chip. each of the first semiconductor chip includes a plurality of semiconductor chips that are stacked on each other along a first direction. the first molding member includes recesses extending along the first direction. the recesses include first portions, which extend to edges of the first molding member and have a first width, and second portions, which are connected to the first portions and are positioned more inward into the first molding member than the first portions. the second portions have a second width that is greater than the first width, and the second molding member fills at least parts of the recesses.
20250210440. SEMICONDUCTOR PACKAGE MANUFACTURING METHOD SAME (Samsung Electronics ., .)
Abstract: a semiconductor package including a substrate; a semiconductor chip on the substrate and electrically connected to the substrate; a molding material on the substrate that molds the semiconductor chip; a thermal conductive adhesive on the semiconductor chip and the molding material; and a thermal conductive layer on the thermal conductive adhesive. a first surface of the thermal conductive layer faces the thermal conductive adhesive. a second surface of the thermal conductive layer which is opposite the first surface of the thermal conductive layer has a higher surface roughness value than the first surface.
20250210448. DIE ATTACH FILM SEMICONDUCTOR PACKAGE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a die attach film including an adhesive layer, an alumina filler disposed in the adhesive layer, and a diamond filler disposed in the adhesive layer, wherein a content of the alumina filler and the diamond filler in combination is about 70 parts by weight to about 85 parts by weight based on 100 parts by weight of the adhesive layer, and a ratio of parts by weight of the alumina filler to parts by weight of the diamond filler is about 2:1 to about 3:1.
20250210466. SEMICONDUCTOR DEVICES DATA STORAGE SYSTEMS INCLUDING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device includes a first structure and a second structure thereon. the first structure includes a substrate, circuit elements on the substrate, a lower interconnection structure electrically connected to the circuit elements, and lower bonding pads, which are electrically connected to the lower interconnection structure. the second structure includes a stack structure including: gate electrodes and interlayer insulating layers, which are alternately stacked and spaced apart in a vertical direction; a plate layer that extends on the stack structure; channel structures within the stack structure, separation regions, which penetrate at least partially through the stack structure, and upper bonding pads, which are electrically connected to the gate electrodes and the channel structures, and are bonded to corresponding ones of the lower bonding pads.
20250210481. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a lower substrate comprising a lower interconnection layer. a first semiconductor chip is on the lower substrate and electrically connected to the lower interconnection layer. connection structures are on the lower substrate and surround the first semiconductor chip. support members are disposed on at least a portion of connection structures adjacent to side surfaces of the first semiconductor chip and edges of the lower substrate. an upper substrate is on the first semiconductor chip and the connection structures, and comprises an upper interconnection layer. a second semiconductor chip is on the upper substrate and is electrically connected to the upper interconnection layer. a third semiconductor chip is on the upper substrate and is electrically connected to the upper interconnection layer, spaced apart from the second semiconductor chip in a horizontal direction, and overlaps the first semiconductor chip in a vertical direction.
20250210487. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a first molding member, a redistribution structure, a mark metal layer, and a mesh metal layer. the first molding member covers at least one first semiconductor chip. the redistribution structure is provided on the first molding member and includes a redistribution pattern, an upper pad, and a redistribution insulating layer. the mark metal layer is provided on the redistribution structure. the mesh metal layer is provided on a lower surface of the mark metal layer and includes at least one hole.
20250210494. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a lower substrate that includes a lower wiring layer; a semiconductor chip disposed on the lower substrate, and an upper substrate disposed on the semiconductor chip. the upper substrate includes a lower surface that faces the semiconductor chip, an upper wiring layer, and a plurality of protruding structures disposed below the lower surface. the lower surface of the upper substrate includes a cavity region that overlaps the semiconductor chip in a first direction, and a plurality of channel regions that extend from the cavity region to an edge of the upper substrate. the cavity region and the plurality of channel regions are defined by the plurality of protruding structures.
20250210499. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes: a first substrate; a lower semiconductor chip on the first substrate and including a through via; an upper semiconductor chip on the lower semiconductor chip and connected to the through via; a first lower conductive structure on the first substrate and laterally spaced apart from the lower semiconductor chip; a second lower conductive structure on the first substrate and laterally spaced apart from the lower semiconductor chip and the first lower conductive structure; an upper conductive structure on the second lower conductive structure; a conductive layer in direct physical contact with a top surface of the upper semiconductor chip and electrically connected to the first lower conductive structure; and a second substrate on the conductive layer and electrically connected to the upper conductive structure.
20250210500. PACKAGE SUBSTRATE SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a package substrate includes a base substrate. upper pads are disposed on an upper surface of the base substrate. lower pads are disposed on a lower surface of the base substrate. a plurality of interconnection patterns respectively connect the upper pads and the lower pads to each other. the plurality of interconnection patterns includes signal interconnection patterns and power interconnection patterns. at least one signal interconnection pattern includes a first pattern extending in a first direction and a plurality of second patterns protruding from the first pattern in a second direction perpendicular to the first direction. at least one power interconnection pattern surrounds the at least one signal interconnection pattern and has a shape corresponding to the first pattern and the plurality of second patterns. the at least one power interconnection pattern is a supply path for a ground voltage.
20250210501. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a package substrate and a first semiconductor device disposed on the package substrate, wherein the package substrate includes a pad array, wherein the pad array includes a first signal pad, a first power pad, and a second signal pad sequentially disposed adjacent to each other in a row, a first via spaced apart from the first signal pad, a second via spaced apart from the second signal pad, a first signal line which connects the first signal pad and the first via, a second signal line which connects the second signal pad and the second via, a ground plate disposed to surround the first via, the second via, the first signal line, and the second signal line, and a first ground via disposed between the first signal line and the second signal line, and connected to the ground plate.
20250210502. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a first rdl containing a first redistribution wiring structure, a first semiconductor chip on the first rdl, a first mold on the first rdl and covering the first semiconductor chip, a second rdl on the first mold and containing a second redistribution wiring structure, a first conductive post extending through the first mold and contacting the first and second redistribution wiring structures and being spaced apart from the first semiconductor chip in a horizontal direction by a first distance, and a second conductive post extending through the first mold, contacting the first and second redistribution wiring structures and being spaced apart from the first semiconductor chip in the horizontal direction by a second distance greater than the first distance. a volume of the first conductive post is smaller than a volume of the second conductive post.
20250210523. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes standard cells on a substrate, first interconnection lines extending in a first direction and connected to an active region and a gate structure, second interconnection lines extending in a second direction, the second interconnection lines including a first line and a second line electrically connected to the first interconnection lines, first vias electrically connecting at least one of the first interconnection lines and at least one of the second interconnection lines to each other, and a connection structure disposed on the second interconnection lines and connecting the first line and the second line to each other. the connection structure includes a first inclined via connected to the first line and inclined toward the second line, and a second inclined via connected to the second line and inclined toward the first line. upper ends of the first and second inclined vias are connected to each other.
Abstract: a circuit chip including a substrate, first and second channel active regions on the substrate, and extending in a first direction, the second channel active regions spaced apart from the first channel regions in a second direction intersecting the first direction, first and second gate electrodes intersecting the second channel active regions, third and fourth gate electrodes intersecting the first channel active regions, and a contact electrode between the first, second, third, and fourth gate electrodes. the contact electrode including a stem section in a vertical direction, and first and second branch sections extending from the stem section and contacting a respective source/drain region on the first and second channel active regions, the first gate electrode and the third gate electrode overlapping in the second direction, and including edge portions having widths decreasing as the first gate electrode and the third gate electrode extend toward facing ends thereof.
20250210529. SEMICONDUCTOR DEVICE METHOD FABRICATING SAME (Samsung Electronics ., .)
Abstract: a semiconductor package includes a first semiconductor chip, which includes a first semiconductor substrate and a first bonding layer on the first semiconductor substrate. a second semiconductor chip includes a second semiconductor substrate, a second bonding layer bonded to the first bonding layer, and a chip-through-via which penetrates the second semiconductor substrate and is connected to the second bonding layer. a passivation film extends along an upper side of the second semiconductor chip and does not extend along side-faces of the second semiconductor chip. the chip-through-via penetrates the passivation film. a multiple-gap-fill film extends along the upper side of the first semiconductor chip, the side faces of the second semiconductor chip, and the side faces of the passivation film. the multiple-gap-fill films includes an inorganic filling film and an organic filling film which are sequentially stacked on the first semiconductor chip.
20250210531. DISPLAY DEVICE (Samsung Electronics ., .)
Abstract: a display device includes a glass substrate having a first surface including a chip region and a display region, a second surface opposite to the first surface, and a third surface extending from the first surface and the second surface and being perpendicular to the first surface, a display panel in the display region on the first surface of the glass substrate, a semiconductor chip in the chip region on the first surface of the glass substrate, a wiring structure surrounding the chip region on the first surface of the glass substrate and the second surface and the third surface of the glass substrate, and a plurality of semiconductor devices below the second surface of the glass substrate.
20250210533. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a first sub-semiconductor device, an interposer, and a second sub-semiconductor device stacked on each other, and a heat sink covering the second sub-semiconductor device. the first sub-semiconductor device includes a first substrate and a first semiconductor chip. the interposer includes a dielectric layer, a thermal conductive layer in contact with a bottom surface of the dielectric layer, a first thermal conductive pad in contact with a top surface of the dielectric layer, and thermal conductive vias penetrating the dielectric layer to connect the thermal conductive layer to the first thermal conductive pad. a bottom surface of the thermal conductive layer is adjacent to and connected to a top surface of the first semiconductor chip. the second sub-semiconductor device is disposed on the dielectric layer without overlapping the first thermal conductive pad. the heat sink further covers the first thermal conductive pad to be connected thereto.
20250210542. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a substrate including an inner layer wiring structure including an insulating layer and a wiring layer, a first protective layer on a first surface of the inner layer wiring structure, a second protective layer on a second surface of the inner layer wiring structure that is opposite to the first surface of the inner layer wiring structure, and a first warpage reduction member and a second warpage reduction member on the first protective layer, a semiconductor chip above the first protective layer and connected to the substrate, and a molding material encapsulating the semiconductor chip, where the first warpage reduction member is on a first side surface of the substrate, and the second warpage reduction member is on a second side surface of the substrate, the second side surface being opposite to the first side surface.
Abstract: a semiconductor package is capable of reducing electromagnetic interference (emi). the semiconductor package includes a circuit board, semiconductor chips mounted on the circuit board, a molding formed on the circuit board and covering each of the semiconductor chips, an electromagnetic shield formed on the circuit board and covering the molding and ground wires connected to ground pads, which are installed on the circuit board. the ground wires penetrate the molding and the electromagnetic shield.
20250210556. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package may include a first semiconductor chip including a substrate having opposing front and back surfaces, through-vias extending from the front surface toward the back surface, dummy patterns arranged around the through-vias and such that a surface of each of the dummy patterns is exposed to the back surface, a plurality of first back pads arranged on the through-vias, and a plurality of second back pads arranged on the surface of each of the dummy patterns. a second semiconductor chip may be on the first semiconductor chip, and may include a plurality of first front pads and a plurality of second front pads. in a plan view, at least one of the dummy patterns overlaps two or more second back pads arranged in at least one direction of a first direction and a second direction.
20250210560. SEMICONDUCTOR PACKAGE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: the described technology relates generally to a semiconductor package and a method of manufacturing the same, the method of manufacturing a semiconductor package according to an example embodiment includes a method of manufacturing a semiconductor package including a package substrate including a main pad and a semiconductor chip including a chip pad, forming a coating layer containing a surface-active material on the main pad of the package substrate, forming a connection solder pattern on the chip pad of the semiconductor chip, forming a flux to surround the connection solder pattern, mounting the semiconductor chip on the package substrate so that the connection solder pattern and the main pad are in contact, and combining the flux with the surface-active material of the coating layer to form a flux structure, and including a cleaning step to remove at least a portion of the coating layer and the flux structure.
20250210565. SEMICONDUCTOR PACKAGE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: a method of manufacturing a semiconductor package includes forming an insulating layer; forming a seed layer on the insulating layer; forming a photoresist layer on the seed layer; forming a plurality of line pattern holes by patterning the photoresist layer, a horizontal length of a middle portion of each of the plurality of line pattern holes being less than a horizontal length of an upper portion of each of the plurality of line pattern holes and a horizontal length of a lower portion of each of the plurality of line pattern holes; and forming a redistribution line pattern by performing a plating process using a portion of the seed layer exposed by the plurality of line pattern holes.
20250210566. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a lower package substrate, a semiconductor chip mounted on the lower package substrate, a molding member positioned on the lower package substrate and covering at least a portion of the semiconductor chip, and a conductive post positioned within the molding member. the molding member and the conductive post define a trench including a first inner surface recessed toward the lower package substrate from an upper surface of the molding member and a second inner surface corresponding to a side surface of the conductive post. the side surface of the conductive post extends beyond the first inner surface of the trench in a direction away from the lower package substrate. the first inner surface of the molding member includes a first curved surface connecting the upper surface of the molding member to the side surface of the conductive post.
20250210570. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes: a package substrate that includes a substrate pad; a semiconductor chip that is disposed on the package substrate, the semiconductor chip including a chip pad; a bonding wire that connects the substrate pad to the chip pad; an adhesive member between the package substrate and the semiconductor chip; and a dam that extends along a side surface of the adhesive member and surrounds at least some of side surfaces of the adhesive member. a height of the dam is greater than or equal to a height of the adhesive member.
20250210576. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes first, second and third semiconductor chip stack structures and a molding member. the first semiconductor chip stack structure includes first and second semiconductor chips having first and second planar areas and a first adhesion layer therebetween. the second semiconductor chip stack structure is on and bonded with the first semiconductor chip stack structure, and includes third and fourth semiconductor chips having a third planar area and the second planar area and a second adhesion layer therebetween. the third semiconductor chip stack structure is on the second semiconductor chip stack structure, and includes fifth and sixth semiconductor chips having the third planar area and the second planar area, and a third adhesion layer therebetween. the molding member is on the first semiconductor chip, and covers sidewalls of the first adhesion layer, the second semiconductor chip, and the second and third semiconductor chip stack structures.
20250210580. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor device includes a package substrate including substrate pads and a first, second, and third semiconductor chips sequentially stacked on the package substrate. the first semiconductor chip includes first signal pads and first dummy pads in a line, the second semiconductor chip includes second signal pads and third signal pads disposed in a line, the third semiconductor chip includes fourth signal pads disposed in a line. the first signal pads correspond to the second signal pads, the first dummy pads correspond to the third signal pads, the third signal pads correspond to the fourth signal pads, on a one-to-one basis.
Abstract: a die attaching apparatus includes a collet body with a first vacuum passageway formed therein, and an adsorption member coupled with a bottom surface of the collet body. the adsorption member includes a first adsorption portion in the first region and having a first adsorption surface with a convex dome shape, and a second adsorption portion in a second region that extends peripherally around the first region and having a second adsorption surface. the second adsorption portion includes a plurality of second vacuum passageways formed therein that are in fluid communication with the first vacuum passageway.
Abstract: a semiconductor package includes a buffer die, a plurality of core dies sequentially stacked on the buffer die, a dummy support die attached to an uppermost core die among the plurality of core dies by an adhesive member, and a sealing member on outer side surfaces of the plurality of core dies and an outer side surface of the dummy support die. the dummy support die includes an overhang portion that protrudes from the outer side surface of the uppermost core die. the adhesive member includes a fillet portion that is in contact with the overhang portion and that is on at least a portion of the outer side surface of the uppermost core die.
20250210612. 2.5D PACKAGE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: a 2.5d package includes an interposer, semiconductor chips on the interposer, an underfill member that is between the interposer and each of the semiconductor chips and between the interposer and an uppermost surface of one or more semiconductor chips of the semiconductor chips, and a mold on the interposer and a first sidewall of the one or more semiconductor chips, where the semiconductor chips define one or more recesses that are on the underfill member and at least partially expose a second sidewall of the one or more semiconductor chips, and where the second sidewall of the one or more semiconductor chips is opposite to the first sidewall of the one or more semiconductor chips.
Abstract: an anode-solid electrolyte sub-assembly for a solid secondary battery, and a method of manufacturing the same, wherein the anode-solid electrolyte sub-assembly includes an anode current collector, a mixed ionic-electronic conductor (miec) structure, the mixed ionic-electronic conductor structure between the anode current collector and a solid electrolyte. the mixed ionic-electronic conductor has a plurality of open portions that extend in a direction from the anode current collect towards the solid electrolyte and at least one end of an open portion of plurality of open portions is open. a plurality of lithiophilic metal material particles are disposed on the mixed ionic-electronic conductor structure, an interlayer is disposed between the mixed ionic-electronic conductor structure on which the lithiophilic metal material particles are disposed and the solid electrolyte. the interlayer includes an interlayer material comprising a carbon-containing anode compound; lithium; a mixture of a carbon-containing anode compound and at least one of a second metal or a metalloid; a composite of a carbon-containing anode compound and at least one of a second metal or a metalloid; or a combination thereof.
Abstract: a composite solid-state electrolyte, a method of preparing the same, and a lithium battery including the same. the composite solid-state electrolyte includes a first solid-state electrolyte including a cubic garnet phase and a pyrochlore phase, and a second solid-state electrolyte including a glass phase, and a volume of the first solid-state electrolyte is greater than that of the second solid-state electrolyte, based on a total volume of the composite solid-state electrolyte.
20250210700. ALL-SOLID SECONDARY BATTERY (Samsung Electronics ., .)
Abstract: an secondary battery includes a cathode layer, an anode layer having an anode current collector and an anode active material layer on the anode current collector,
20250210844. MM-WAVE SIGNAL POWER DIVIDER ANTENNA ARRAY (Samsung Electronics ., .)
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). the present invention relates to an mm-wave signal power divider implemented on a pcb that includes an input arm, two output arms and a termination load embedded into the pcb, wherein each power divider arm includes a feedline having impedance z0; each power divider output arm further includes a main power divider branch and an additional power divider branch; the main power divider branch connects the input arm feedline and the output arm feedline and has a length multiple of ��/4; the additional power divider branch extends from the point of connection of the main power divider branch with the output arm feedline to the symmetry plane of the termination load and has a length multiple of ��/2; additional power divider branches are connected in the symmetry plane of the termination load.
Abstract: a charger integrated circuit includes a bidirectional switching converter including first to fourth switching elements connected in series, an inductor connected to a third switching element, and a capacitor connected to a second switching element and the third switching element, and a controller configured to generate, a first pwm signal and a second pwm signal based on sensing signals from the bidirectional switching converter, and a first switching signal controlling first and fourth switching elements based on the first pwm signal in response to an average of an inductor current being positive, a second switching signal controlling second and third switching elements based on the second pwm signal, and generate the first switching signal based on the second pwm signal, and the second switching signal based on the first pwm signal in response to the average value of the inductor current being negative.
20250211216. DELAY CONTROL CIRCUIT MEMORY MODULE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a delay control circuit includes: a delay cell including a plurality of bias inverters, first rc circuits, and second rc circuits, the delay cell activates a number of first rc circuits in response to a step code, delays a signal by a delay time based on the number of the activated first rc circuits, and outputs the delayed signal; a zq calibrator including pull-up and pull-down circuits, the zq calibrator adjusts a number of activated pull-up and pull-down circuits, and inputs a pull-up and pull-down voltage, based on a calibration code to the bias inverters; and a step adjuster including a first ring oscillator including test delay cells, the step adjuster determining characteristics of the first and second rc circuits and activates a number of second rc circuits based on the characteristics and an operating frequency of the delay control circuit.
20250211239. PHASE-LOCKED LOOP DEVICE, OPERATING METHOD DEVICE (Samsung Electronics ., .)
Abstract: a phase-locked loop device and a method for operating the same, including: a voltage-controlled oscillator configured to generate an output clock signal; a divider configured to divide the output clock signal into a first phase division signal; a sampling phase frequency detector configured to: receive a first supply voltage, a second supply voltage different from the first supply voltage, and the first phase division signal, and based on determining that a phase difference between the first phase division signal and a reference clock signal corresponds to a first interval, output a hold voltage and a status signal for the phase difference; a transconductance circuit configured to output a first conversion current based on the hold voltage; a charge pump configured to output a second conversion current based on the status signal; and a loop filter configured to provide a voltage control signal to the voltage-controlled oscillator.
Abstract: a method for soft decoding of generalized reed-solomon (rs) error correction codes, includes receiving a codeword through a digital electronic communication channel; verifying that an hd error-and-erasures decoding has failed; finding a groebner basis that accounts for a fixed set of erasures; constructing a chase and gmd decoding tree on the set of chase coordinates and the set of gmd coordinates; traversing the decoding tree using polynomials of the groebner basis as a basis that represents updated coefficient polynomials on the chase and gmd decoding tree; updating polynomials on the decoding tree using root and derivate steps that flip an edge, or a root step for an erasure edge; calculating error locations by polynomial evaluation of candidate polynomials from the decoding tree, and calculating error values by using forney's formula; and correcting the received codeword according to the calculated error locations and calculated error values.
Abstract: an electronic device is provided. the electronic device includes a housing, wherein the housing includes a substrate layer having a three-dimensional (3d) shape including at least one protrusion, and a film layer disposed on a surface of the substrate layer facing outside of the electronic device and having a higher hardness than the substrate layer, and the film layer having the higher hardness includes a first optical pattern formed on a first surface facing a first direction which is an internal direction of the electronic device.
20250211285. ELECTRONIC DEVICE INCLUDING ANTENNA (Samsung Electronics ., .)
Abstract: an electronic device includes: a conductive portion at least partially exposed to outside of the electronic device; a coil; a near-field communication (nfc) circuitry; and a transmission line connected with the conductive portion, the coil, and the nfc circuitry, includes: a first signal path connected with a first terminal of the nfc circuitry and a first area of the conductive portion, a second signal path connected with a second terminal of the nfc circuitry and a first ending portion of the coil, and a third signal path connected with a second area of the conductive portion and a second ending portion of the coil, and wherein a signal path, which is selected among the first signal path, the second signal path, and the third signal path, includes a first ground path and a second ground path that are connected to a ground area of the electronic device.
20250211291. SYSTEM METHOD TELECOMMUNICATION NETWORK (Samsung Electronics ., .)
Abstract: according to an embodiment, a method performed by a device for a near-real time radio access network intelligent controller, (near-rt ric) of a telecommunication network, wherein the method comprises generating a control message for configuration related to at least one function of a radio unit (ru), and transmitting, to the ru, the control message via an interface between the near-rt ric and the ru.
20250211293. FLEXIBLE CELL-LAYOUT VIA BACK-TO-BACK TRP CONFIGURATION (Samsung Electronics ., .)
Abstract: a method and device for flexible cell layout via back-to-back trp configuration. the method comprises arranging a first trp set including a first trp and a second trp in a back-to-back configuration in which antenna elements of the first trp are positioned to radiate in an opposite direction from antenna elements of the second trp; and providing a three-dimensional (3d) massive multiple-input multiple-output unit (mmu) architecture including the first trp set.
20250211382. FRAME STRUCTURE DESIGN AMBIENT IOT SYSTEMS (Samsung Electronics ., .)
Abstract: a system and a method are disclosed for ambient internet of things (a-iot) systems. the system and method include transmitting a carrier wave to an ambient internet of things (iot) device, transmitting a control signal and a payload signal to the a-iot device, and receiving a back scattering signal from the a-iot device after a time delay. the time delay is between the transmitting of the control signal and the receiving of the back scattering signal.
20250211392. METHOD APPARATUS POSITIONING SIGNAL (Samsung Electronics ., .)
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure provides a method performed by a user equipment (ue) and a user equipment. the method comprises: determining whether a conflict condition is satisfied or whether a conflict occurs based on resources related to a first signal and resources related to a reference signal for positioning: transmitting and/or receiving the first signal and/or the reference signal for positioning based on the result of the determination.
20250211405. UE OPERATION REDUCED POWER CONSUMPTION (Samsung Electronics ., .)
Abstract: methods, user equipment (ue), and base stations for reception or transmission of physical downlink control channels (pdcch) associated with a master node (mn) or with a secondary node (sn) are provided. a method of operating a ue to receive pdcchs includes receiving an indication for a first number of cells nand for a second number of cells n; and determining a first total number of pdcch candidates on n cells of the mn over a time period according to nand a second total number of pdcch candidates on n cells of the sn over the time period according to n. � is a subcarrier spacing (scs) configuration for an active bandwidth part (bwp) on each of the n cells or n cells.
20250211448. STORAGE DEVICE, OPERATING METHOD CONTROLLER, SYSTEM (Samsung Electronics ., .)
Abstract: a storage device, an operating method of a controller, and a system. the storage device configured to perform a secure joint test action group (jtag) authentication based on token history information including a history of a number of times of use of at least one token, a hash value, and a temporary digital signature. temporary authentication information includes a temporary token comprising a token identifier and a maximum count indicating a maximum number of times the temporary token is permitted to be used, a public key of an authentication server, a temporary public key and a temporary private key corresponding to the storage device, and a temporary digital signature generated for temporary public keys and the temporary token, the temporary digital signature generated based on a private key of the authentication server paired with the public key.
Abstract: an operation method of a server device includes receiving an internet protocol (ip) address of an internet-of-things (iot) device from the iot device, identifying another iot device having a same ip address as the ip address of the iot device, based on there being no link generated between the iot device and the another iot device, generating a link between the iot device and the another iot device, based on there being a link generated between the iot device and the another iot device, increasing a weight for the link generated between the iot device and the another iot device, and generating data on the iot device and the another iot device based on the weight for the generated link.
20250211635. PEER-TO-PEER COMMUNICATION WIRELESS NETWORKS (Samsung Electronics ., .)
Abstract: a station (sta) in a wireless network transmits, to an access point (ap), a stream classification service (scs) request for itself and on behalf of another peer sta. the sta receives, from the ap, a first scs response for the scs request for sta and a second scs response for the scs request for peer sta. sta or peer sta may receive a trigger frame granting a transmission opportunity (txop) via the pp direct link established between the sta and the peer sta, if the ap accepts the scs request associated with that sta.
Abstract: an electronic device is provided. the electronic device includes a hinge structure including a first hinge plate, a second hinge plate rotatable with respect to the first hinge plate, and a third hinge plate rotatable with respect to the first hinge plate, a display, disposed on the hinge structure, foldable by movement of the second hinge plate and the third hinge plate with respect to the first hinge plate, a layer, attached to the display, including a first heat dissipation member that includes a first segment, a second segment spaced apart from the first segment, and a plurality of third segments disposed between the first segment and the second segment and spaced apart from each other, and a first conductive member attached on a surface of the first hinge plate facing the plurality of third segments, wherein, in an unfolded state of the electronic device in which a direction in which a surface of the second hinge plate faces is the same as a direction in which a surface of the third hinge plate faces, when the display is viewed in a second direction opposite to a first direction in which the surface of the first hinge plate faces, the first conductive member overlaps a portion of the first segment and a portion of the second segment.
Abstract: an electronic device is provided. the electronic device includes a foldable housing, a flexible display, at least one camera, at least one sensor and at least one processor, wherein the foldable housing includes a first housing having a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, a first connecting member which is connected to a side surface of the first housing and which can be folded in a first rotating direction and unfolded in a second rotating direction, a second housing which is connected to the first connecting member and has a third surface facing the first direction and a fourth surface facing the second direction, and in which the flexible display is positioned on the third surface, a second connecting member connected to the side surface of the second housing, and a third housing which is connected to the second connecting member and has a fifth surface facing the first direction and a sixth surface facing the second direction.
Abstract: an electronic device according to an embodiment may include: a first housing; a second housing slidably coupled to the first housing; a flexible display disposed to be supported by the first housing and the second housing and having a display area configured to be reduced or increased based on a slide-in or slide-out of the second housing; a support including a bendable structure, supporting at least a portion of the flexible display, and configured to move along sliding of the second housing; a guide rail configured to guide a movement of the support; and a support bracket supporting the support and including a support part having an outer surface having a polygonal shape.
20250211665. ELECTRONIC DEVICE COMPRISING FLEXIBLE DISPLAY (Samsung Electronics ., .)
Abstract: according to various embodiments, an electronic device may include: a hinge module; a first housing connected to the hinge module; a second housing connected to the hinge module so as to be foldable against the first housing; and a flexible display disposed to be supported by the first housing and the second housing. the flexible display may include: a window layer; a display panel located under the window layer, and including a plane part and a bending part configured to extend from the plane part and be bent from an edge area of the flexible display adjacent to a side wall of the second housing toward a rear surface of the flexible display; a buffer part disposed between the display panel and the second housing to cover at least a part of the edge area together with the bending part; and at least one protection member at least partly embedded in the buffer part and disposed between the bending part and the second housing.
20250211666. ELECTRONIC DEVICE COMPRISING FIXING MEMBER (Samsung Electronics ., .)
Abstract: according to an embodiment disclosed in the present document, an electronic device may be provided. the electronic device may comprise: a housing; an inner structure disposed in the housing; a fixing member including a first support region coupled to one surface of the inner structure and a second support region extending from the first support region; and a flexible circuit board arranged across the one surface of the inner structure in a first direction. a part of the flexible circuit board may pass through a passage formed between the second support region and the one surface of the inner structure.
20250211667. ELECTRONIC DEVICE WATERPROOF STRUCTURE (Samsung Electronics ., .)
Abstract: an electronic device according to various embodiments of the disclosure may include: a first housing, a second housing, a hinge assembly comprising a hinge disposed between the first housing and the second housing, and including a hinge plate and a hinge module disposed at both ends of the hinge plate in a longitudinal direction of the hinge plate, a first circuit board disposed in the first housing, a second circuit board disposed in the second housing, a flexible display disposed on the first housing, the second housing, and the hinge assembly, a first waterproof member comprising a waterproof material disposed between the first housing and the flexible display, a first adhesive member comprising an adhesive disposed between the hinge module and the flexible display, an electrical component disposed between the first waterproof member and the first adhesive member, an electrical component waterproof member comprising a waterproof material disposed between the electrical component and the flexible display, and a first support disposed between the electrical component waterproof member and the flexible display. an electrical component groove may be formed in the first housing, the electrical component may be disposed in an area of the first circuit board corresponding to the electrical component groove, and covered by the electrical component waterproof member, and a first electrical component hole coupled to the electrical component groove may be formed in a part of the first housing.
Abstract: in one embodiment, a method includes receiving a request from a first user to register an electronic sim card from a user device, authenticating biometric information of the first user that is accessed from the user device, generating a private key to be stored on the user device and a public key to be stored on a blockchain network based on the biometric information, determining a block associated with the first user exists on the blockchain network based on the private key, determining whether the first user is eligible for registration based on variables stored on the block, and registering the first user with the electronic sim card if the first user is eligible for registration, else declining the request from the first user for registration.
20250211709. ELECTRONIC DEVICE CONTROL METHOD THEREFOR (Samsung Electronics ., .)
Abstract: an electronic apparatus may include memory storing first and second learning models that have the same network structure and estimate a motion between two frames, a processor configured to obtain a first frame included in an input image and a second frame which is a previous frame of the first frame, and generate an interpolation frame using the obtained first frame and second frame, and the first learning model is a model trained with image data having a first characteristic, the second learning model is a model trained with image data having a second characteristic which is opposite to the first characteristic, and the processor is configured to generate a third learning model using a first control parameter and the first and second learning models, estimate a motion between the first frame and the second frame using the generated third learning model, and generate the interpolation frame based on the estimated motion.
20250211719. PROJECTION APPARATUS OPERATING METHOD THEREOF (Samsung Electronics ., .)
Abstract: a projection apparatus for projecting an image including a projection unit, a memory to store one or more instructions, and at least one processor configured to execute the one or more instructions to obtain spatial information of a space onto which the image is to be projected, obtain position information of a stitching area included in the image, and control the projection unit to project the image in which the stitching area is adjusted to be positioned according to projection information obtained based on the spatial information of the space and the position information of the stitching area.
20250211741. IMAGE SEGMENTATION METHOD APPARATUS IMAGE ENCODING DECODING (Samsung Electronics ., .)
Abstract: provided is an image decoding method including: determining a first coding block and a second coding block corresponding to the first coding block; when a size of the first coding block is equal to or smaller than a preset size, obtaining first split shape mode information and second split shape mode information from a bitstream; determining a split mode of the first coding block, based on the first split shape mode information, and determining a split mode of the second coding block, based on the second split shape mode information; and decoding a coding block of a first color component which is determined based on the split mode of the first coding block and a coding block of a second color component which is determined based on the split mode of the second coding block.
Abstract: a video decoding method may include obtaining, from a bitstream, prediction motion vector information indicating a prediction motion vector of a current block and difference motion vector information indicating a difference motion vector of the current block; determining the prediction motion vector according to whether or not an adjacent block of the current block is decoded and the prediction motion vector information; determining a motion vector resolution of the current block according to whether or not the adjacent block of the current block is decoded; determining the difference motion vector according to the difference motion vector information; determining a motion vector of the current block according to the prediction motion vector, the motion vector resolution, and the difference motion vector; and reconstructing the current block according to the motion vector of the current block.
Abstract: provided is an image sensor including a pixel array including a shared capacitor. an image sensor includes a first pixel and a second pixel, wherein the first pixel may include a first photodiode, a first floating diffusion node, a first global selection transistor, a first capacitor, a first sampling transistor, a second capacitor, and a second sampling transistor, the second pixel may include a second photodiode, a second floating diffusion node, a second global selection transistor, a third capacitor, a third sampling transistor, a fourth capacitor, and a fourth sampling transistor, and the image sensor may further include a shared transistor including a first end connected to a first output node and a second end connected to a second output node.
Abstract: an electronic device is provided. the electronic device includes a first sound output device including a plurality of microphones and configured to be wearable on a first location of the body, a second sound output device including a plurality of microphones and configured to be wearable on a second location of the body, memory storing one or more computer programs, and one or more processors electrically connected to the first sound output device, the second sound output device, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to identify whether the first sound output device and the second sound output device are normally worn, based on reception signals received through at least one microphone among the plurality of microphones of the first sound output device or at least one microphone among the plurality of microphones of the second sound output device, and induce re-wearing of the first sound output device and the second sound output device in response to identification of abnormal wearing of the first sound output device and the second sound output device.
Abstract: an electronic device and an operating method thereof are provided. the electronic device includes a first subscriber identity module to store a first profile associated with a first cellular network, a second subscriber identity module to store a second profile associated with a second cellular network, an application processor, a communication circuit configured to support transmission or reception of data through at least one cellular network among the first cellular network and the second cellular network, memory storing one or more computer programs, and a communication processor communicatively coupled to the first subscriber identity module, the second subscriber identity module, the application processor, the communication circuit, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the communication processor individually or collectively, cause the electronic device to receive, while being connected to the first cellular network, a request for activating the second cellular network from the application processor so as to carry out a service provided by a second application having a priority higher than a priority of a first application carrying out a service through the first cellular network, determine whether there is a combination of connectable frequency bands among combinations of frequency bands that allow the communication circuit to perform data transmission through the first cellular network and data transmission through the second cellular network, release a connection to a first communication network, and activate a connection to a second communication network based on determining that there is no combination of connectable frequency bands.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure related to a system and method for authenticating and authorizing a calling party by an ip multimedia subsystem (ims) network. in particular, the present disclosure provides a unique mechanism implemented at the hss for providing parameter provisioning service by exposing related application programming interface (api) to the third party for creating the group data information with all the necessary details like list of impus for which authentication and authorization is needed to use a first node identities assigned by the first node. the group data information is further utilized by ims originating network for invoking a signing server for performing secondary a&a for the calling party. the method further includes invoking a verification sever for validation of the call invite request by ims terminating network based on the presence of identity header added by signing server. further, based on a receipt of a validation status response from the verification server, the call invite is forwarded to the called party for the establishment of the call between the calling party and the called party. thus, the disclosed mechanism ensures that the called party receives a call from the intended user.
Abstract: the disclosure relates to a pre-5th-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th-generation (4g) communication system such as long term evolution (lte). a method for communication of a constrained user equipment (ue) with a message in fifth generation (msgin5g) server providing a msgin5g service in an iot network is provided. the method includes receiving, by an unconstrained ue, a registration request comprises a security credential of the constrained ue from the constrained ue, where the unconstrained ue have access to the msgin5g server and the constrained ue do not have access to the msgin5g server. the method includes determining, by the unconstrained ue, whether the constrained ue is authorized based on the security credential. the method includes performing, by the unconstrained ue, a registration of the constrained ue with the unconstrained ue for communication of the constrained ue with the msgin5g server based on authorization of the constrained ue.
20250212049. PEER-TO-PEER COMMUNICATION WIRELESS NETWORKS (Samsung Electronics ., .)
Abstract: a station (sta) in a wireless network, comprising a memory and a processor coupled to the memory, the processor configured to establish, with an access point (ap), a quality of service (qos) flow for the first sta; and transmit, to the ap, a first frame indicating to terminate a qos flow for a second sta that is established between eh ap and the second sta.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for managing an application context relocation (acr) procedure by an edge enabler server (ees) in an edge data network is provided. the method comprises identifying that a first acr procedure is initiated; and based on the first acr procedure being initiated, sending a first notification message indicating a start of the first acr procedure to a first entity in the edge data network. upon receiving the first notification message, the first entity does not trigger execution of a second acr procedure until the first acr procedure is completed.
Abstract: according to an embodiment, an electronic device may comprise an rf circuit and at least one processor. the at least one processor may be configured to allocate a first rf path of the rf circuit to a first network communication corresponding to a first sim during a first period and a second network communication corresponding to a second sim during a second period, wherein the first sim is activated during the first period and the second sim is activated during the second period. the at least one processor may be configured to identify an occurrence of a timer start event associated with a disconnection of the second network communication. the at least one processor may be configured to start a timer having information about an area to which the electronic device is connected within the second network communication and/or an expiration time corresponding to the timer start event, based on identifying the occurrence of the timer start event. the at least one processor may be configured to perform a tau procedure based on elapse of the expiration time of the timer. other various embodiments are possible as well.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide a first edge enabler client (eec) and a method for discovering a common edge application server (eas) for a multi-user or a multi-application client (ac) session in a wireless communication network. the method further includes detecting, by the first eec, a trigger for an eas discovery. the method further includes transmitting, by the first eec, an eas discovery request message with a grouping information to an edge enabler server (ees). the method further includes receiving, by the first eec, an eas discovery response message with at least one of a plurality of eas or an already selected common eas based on the grouping information. the method further includes determining, by the first eec, a common eas for establishing the multi-user session or the multi ac session in between the first eec and at least one second eec.
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for remapping slice by using an access and mobility management function (amf) in a wireless communication system is provided. the method comprises the steps of: determining that a slice for at least one protocol data unit (pdu) session of user equipment (ue) will be replaced with an alternative slice; transmitting, to a policy control function (pcf), a message for requesting the alternative slice including an identifier of the slice; receiving the message including the identifier of the alternative slice from the pcf in response to the message for requesting the alternative slice; and transmitting, to a session management function (smf) corresponding to the at least one pdu session for the slice, a message for requesting a change in the slice including the identifier of the alternative slice.
Abstract: an electronic device is provided. the electronic device includes a temperature sensor, a communication circuit, memory storing one or more computer programs, and one or more processors operatively connected to at least one of the temperature sensor, the communication circuit, or the memory wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to measure a current temperature of the electronic device using the temperature sensor, identify a lowest configuration temperature and a highest configuration temperature of the electronic device from the memory, calculate a temperature coefficient, based on at least one of the measured current temperature of the electronic device, the identified lowest configuration temperature, or the identified highest configuration temperature, and control an operation of the communication circuit, based on the calculated temperature coefficient.
Abstract: embodiments of the disclosure provides to a method and device for provisioning pin subscription data in a wireless communication system supporting a personal iot network (pin). the method performed by a user equipment (ue) in a wireless communication system supporting the pin, the method comprises transmitting, to a mobility management function (amf), a registration request message including pin input information, and receiving, from the amf, a registration accept message including pin subscription data based on the pin input information, wherein the ue in the pin acts as at least one of a pin element with gateway capability (pegc) device and a pin element with management capability (pemc) device.
Abstract: an operation method in a wireless network includes: receiving, at a first apparatus, an association request from a second apparatus; in response to the association request, transmitting, from the first apparatus to the second apparatus, an association response including information about the second apparatus; and transmitting, from the first apparatus to the second apparatus, a physical layer protocol data unit (ppdu), which includes first information about whether first data is to be transmitted and second information about an apparatus that is to receive the first data transmitted via a resource unit capable of transmitting the first data.
20250212156. METHOD APPARATUS POSITIONING WIRELESS COMMUNICATION SYSTEM (Samsung Electronics ., .)
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure provides a method and apparatus for positioning and particularly provides a method executed by a first node in a communication system, including: acquiring configuration information related to a positioning-related first-type method; and performing a positioning-related operation based on the configuration information related to the positioning-related first-type method.
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. provided is a method for controlling an access and mobility management function (amf) for communicating with a satellite radio access network (ran), the method comprising the operation of: receiving a non access stratum (nas) message, which is received from a terminal and includes first location information about the terminal, and a next generation application protocol (ng-ap) message, which is received from the terminal and includes second location information about the terminal; requesting user data management (udm) for location information about the terminal on the basis of the first location information and the second location information; and receiving the location information about the terminal from the udm and transmitting same to the terminal.
20250212203. BEAM OPERATION SINGLE-TRP OR UPLINK MULTI-TRP (Samsung Electronics ., .)
Abstract: methods and apparatuses for beam operation for single transmit-receive point (trp) or uplink multi-trp. a method performed by a user equipment (ue) includes receiving a first unified transmission configuration indication (tci) state activation or deactivation medium access control (mac) control element (ce) for single trp operation and receiving a second unified tci state activation or deactivation mac ce for multiple-trp operation. the method further includes applying a first set of tci states and a second set of tci states and receiving, in a tci field of a beam indication downlink control information (dci), one or more tci states mapped to a tci codepoint from the first or second unified tci state activation or deactivation mac ce. the method further includes updating, based on the one or more tci states, at least one of the first set of tci states and the second set of tci states.
20250212204. ELECTRONIC DEVICE SCHEDULING DATA LINK METHOD OPERATING SAME (Samsung Electronics ., .)
Abstract: various embodiments of the disclosure relate to an apparatus and a method for scheduling a data communication link of an electronic device. the electronic device includes a communication circuit and a processor, and the processor is configured to perform scheduling for different time sections, based on a request for configuring an ndp scheduling with an external electronic device included in a cluster of nan, transmit or receive data to or from the external electronic device, based on a first scheduling information corresponding to a first time section generated through the scheduling, identify channels of the electronic device and the external electronic device allocated to a second time section different from the first time section, and in case that the electronic device and the external electronic device use an equal channel in the second time section, transmit or receive data to or from the external electronic device, based on the first scheduling information and a second scheduling information corresponding to the second time section generated through the scheduling. other embodiments are possible.
20250212221. APPARATUS METHOD THEREOF WIRELESS COMMUNICATION SYSTEM (Samsung Electronics ., .)
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed in an apparatus and a method thereof in a wireless communication system are provided. the method may include determining a mode of a terminal and/or a base station, and performing at least one of transmitting an uplink channel, receiving a downlink channel, not transmitting an uplink channel, or not receiving a downlink channel based on the determined mode.
Abstract: an electronic device is provided. the electronic device includes wireless communication modules configured to transmit and receive a wireless signal, one or more processors operatively connected to the wireless communication modules, and memory electrically connected to the one or more processors and including instructions executable by the one or more processors wherein, the instructions when executed by the one or more processors, individually or collectively, cause the electronic device to perform a plurality of operations, wherein the plurality of operations includes an operation of executing a first application that uses a first communication not supporting a multi-link operation (mlo) and a second application that uses a second communication supporting the mlo, based on information about a plurality of links associated with the second communication, transmitting data associated with the second application through one or more first links among the plurality of links, and controlling, among the first links, a second link including a bandwidth overlapping an operating channel of the first communication.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically the present disclosure provides a method for providing broadcast service.
20250212296. DEVICE PROVIDING NOTIFICATION URGENT CALL, METHOD THEREFOR (Samsung Electronics ., .)
Abstract: a device providing a notification for an urgent call, and a method therefor are provided. the method comprises: receiving, from an sip server, an sip invite message for an urgent call, generated by a calling device; identifying, in response to receiving the sip invite message, that an urgent notification function for notifying a user of the urgent call based on the sip invite message is supported by the reception device; obtaining, in response to identifying that the urgent notification function is supported, urgent notification support information indicating that the urgent notification function is supported; transmitting, to the sip server, an sip response code for the sip invite message together with the urgent notification support information, the transmitted sip response code and urgent notification support information being provided from the sip server to the calling device; and outputting, in response to the identifying that the urgent notification function is supported, an urgent notification indicating that the sip invite message for the urgent call has been received.
20250212316. ELECTRONIC DEVICE INCLUDING SHIELD CAN (Samsung Electronics ., .)
Abstract: an electronic device includes: a housing; a printed circuit board (pcb) in the housing and including a board surface that include a shield area and a shield can assembly disposed along a circumference of the shield area and connected to the pcb, the shield can assembly forming a partition wall perpendicular to the board surface. the shield can assembly includes at least one first shield member extending in a first direction, a plurality of second shield members including a first portion extending in a second direction perpendicular to the first direction and a second portion extending in the first direction; and a shield cover connected to the at least one first shield member and the plurality of second shield members and covering the shield area. the at least one first shield member and the plurality of second shield members enclose at least a portion of the shield area.
20250212323. PRINTED CIRCUIT BOARD SEMICONDUCTOR PACKAGE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a printed circuit board includes a base board and a wiring structure arranged on a top surface and a bottom surface of the base board and inside the base board. the wiring structure includes a plurality of common potential plates spaced apart from each other in a vertical direction, the plurality of common potential plates each having a cut area, a pair of differential signal lines spaced apart from a first common potential plate selected from among the plurality of common potential plates, the pair of differential signal lines each including an entry portion arranged in the cut area, and a first reinforcement structure extending from a second common potential plate selected from among the plurality of common potential plates and vertically overlapping a portion of the entry portion.
20250212331. ELECTRONIC DEVICE INCLUDING INTERPOSER (Samsung Electronics ., .)
Abstract: an electronic device including an interposer is provided. the electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (ap) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (cp) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the cp.
20250212384. SEMICONDUCTOR DEVICES (Samsung Electronics ., .)
Abstract: a semiconductor device may include a bit line that extends in a first direction, a bit-line dielectric layer on a sidewall of the bit line, a channel layer in contact with the bit line, a word line that extends in a second direction that intersects the first direction, a gate capping layer in contact with a first sidewall of the word line, a gate dielectric layer in contact with the channel layer and a second sidewall of the word line, and a first dielectric structure that extends in the first direction. the first dielectric structure may include a dielectric material that is different from a dielectric material of the gate capping layer. the word line, the gate dielectric layer, and the gate capping layer may be in contact with an inner sidewall of the first dielectric structure.
20250212388. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: in order to fulfill excellent performance and improved economic efficiency, it may be required to increase the integration degree of semiconductor devices. the electrical characteristics and product reliability of the semiconductor device may be improved by arranging an intermediate insulating layer between a channel layer and a gate insulating layer in a semiconductor device including a vertical channel transistor.
20250212389. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: provided is a semiconductor device including a lower conductive line extending in a first horizontal direction on a substrate, an isolating insulation pattern extending in a second horizontal direction perpendicular to the first horizontal direction on the lower conductive line, a mold line pattern on the isolating insulation pattern, a pair of upper conductive lines each having an inner wall in contact with a sidewall of the mold line pattern and a bottom surface in contact with a top surface of the isolating insulation pattern and linearly extending in the second horizontal direction, a gate dielectric layer covering a top surface of the mold line pattern and outer walls of the pair of upper conductive lines, and a channel structure contacting the lower conductive line and facing a first upper conductive line from among the pair of upper conductive lines with the gate dielectric layer therebetween.
20250212390. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: in order to fulfill excellent performance and economic efficiency, it is desired to increase the integration degree of semiconductor devices. according to the semiconductor device provided in the present inventions, in semiconductor device including a vertical channel transistor, a bit line is configured as a double layer to reduce the contact resistance with respect to a channel layer, and thus, the electrical characteristics and product performance of the semiconductor device may be improved.
20250212392. SEMICONDUCTOR MEMORY DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor memory device includes a conductive line elongated in a first direction, a superlattice layer disposed on the conductive line, a plurality of channel areas spaced apart from each other in the first direction on the superlattice layer and each connected to the conductive line, a back-gate electrode elongated in a second direction between a first channel area and a second channel area, and a pair of word lines arranged between the second channel area and a third channel area. the superlattice layer includes a first superlattice layer having a plurality of first oxide layers and a plurality of first compound layers that are alternately stacked on each other. the superlattice layer includes a second superlattice layer having a plurality of second oxide layers and a plurality of second compound layers that are alternately stacked on each other.
20250212393. SEMICONDUCTOR MEMORY DEVICE METHOD FABRICATING SAME (Samsung Electronics ., .)
Abstract: a semiconductor memory device comprises a bit line on a semiconductor substrate and extending in a first direction, a channel pattern on the bit line and including a horizontal part and a vertical part connected to an end of the horizontal part, a word line on the channel pattern and extending in a second direction that intersects the first direction, and a landing pad on the channel pattern. the landing pad includes a first part in contact with a portion of a sidewall of the vertical part included in the channel pattern and a second part in the first part. the vertical part extends in a third direction that intersects the first direction and the second direction.
Abstract: a memory device includes a plurality of memory blocks and a voltage generator. each of the plurality of memory blocks may include a plurality of word lines extending in a first direction of the memory device, a plurality of back gate lines that are each adjacent to a respective word line of the plurality of word lines, a plurality of bit lines extending in a second direction perpendicular to the first direction, and a shielding bit line arranged between the plurality of bit lines and under the plurality of bit lines. the back gate lines are electrically connected to the shielding bit line. the voltage generator may be configured to drive the shielding bit line and the plurality of back gate lines of each of the plurality of memory blocks at the same voltage level.
20250212395. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: provided is a semiconductor device and method of manufacturing same. the semiconductor device includes: a substrate including a first active area defined by a first device separation film; a bit line contact in the first active area; and a bit line extending in a first direction on the substrate, wherein the bit line including: a lower conductive layer on the substrate and surrounding at least a portion of a sidewall of the bit line contact; a metal silicide film on the lower conductive layer and the bit line contact; and an adhesive layer and a conductive layer that are sequentially arranged on the metal silicide film in a vertical direction perpendicular to the substrate, and wherein the adhesive layer including a tantalum (ta) alloy.
20250212396. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes a bit line extending in a first direction on a substrate, first and second word lines extending in a second direction on the bit line, crossing the bit line, and spaced from each other in the first direction, and semiconductor patterns on the bit line spaced from each other in the first direction with the first and second word lines interposed therebetween, wherein the first word line includes a first portion and second portions protruding from the first portion and spaced apart from each other in the second direction, the second word line includes a first portion and second portions protruding in a direction, and one of the semiconductor patterns is interposed between the second portions of the first word line, and another one of the semiconductor patterns is interposed between the second portions of the second word line.
20250212397. SEMICONDUCTOR MEMORY DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor memory device includes a first structure on a substrate and including core regions and a first peripheral circuit region, and a second structure on the first structure and including cell array regions and a second peripheral circuit region. the second structure includes a first active pattern in each of the cell array regions and perpendicular to an upper surface of the first structure, a word line adjacent to one side of the first active pattern and extending in a first direction parallel to the upper surface of the first structure, a bit line in contact with a lower surface of the first active pattern and extending in a second direction intersecting the first direction, a second active pattern in the second peripheral circuit region and perpendicular to the upper surface of the first structure, and an anti-fuse gate electrode on one side of the second active pattern.
20250212398. SEMICONDUCTOR DEVICES (Samsung Electronics ., .)
Abstract: a semiconductor device may include a substrate, and an interconnection layer on the substrate. the interconnection layer may include an insulating layer, a conductive line, and a conductive contact, and the insulating layer may include an upper insulating layer on a lower insulating layer. the conductive contact may extend into a lower portion of the upper insulating layer and extend into the lower insulating layer, and the conductive line may be on the lower insulating layer and intersects the upper insulating layer. the upper insulating layer may include a low-k dielectric material.
Abstract: a semiconductor device includes a substrate, a stack structure having a plurality of spaced-apart gate electrodes therein and extending in a vertical direction perpendicular to an upper surface of the substrate, and a plurality of channel structures extending vertically within respective channel holes, which pass vertically through the stack structure. each of the channel structures includes: (i) a channel layer having a first crystal structure, and extending from adjacent an upper end to adjacent a lower end of a corresponding one of the channel holes, (ii) a protruding region extending from adjacent the upper end of each of the channel holes in the vertical direction, protruding from the channel layer toward a central axis of each of the channel holes, and having a second crystal structure, and (iii) a central pad layer extending inside the protruding region and having a third crystal structure, which is different from the first crystal structure.
20250212400. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes a substrate including a first plate portion and a second plate portion, a stack structure including interlayer insulating layers and gate electrodes alternately stacked on the substrate, a first block separation structure on the first plate portion and a second block separation structure on the first plate portion. each of the first and second block separation structures includes first separation regions, a cell array separation structure including a second separation region connected to the first separation regions and channel structures penetrating the stack structure, wherein the stack structure includes first stack structures separated by the first separation regions of the first block separation structure and extending in the first direction, second stack structures separated by the first separation regions of the second block separation structure, and at least one third stack structure separated from the first and second stack structures by the cell array separation structure.
20250212405. VERTICAL MEMORY DEVICES (Samsung Electronics ., .)
Abstract: a vertical memory device including gate electrodes on a substrate, the gate electrodes being spaced apart in a first direction and stacked in a staircase arrangement; a channel extending through the gate electrodes in the first direction; a first contact plug extending through a pad of a first gate electrode to contact an upper surface of the first gate electrode, the first contact plug extending through a portion of a second gate electrode, and the second gate electrode being adjacent to the first gate electrode; a first spacer between the first contact plug and sidewalls of the first gate electrode and the second gate electrode facing the first contact plug, the first spacer electrically insulating the first contact plug from the second gate electrode; and a first burying pattern contacting bottom surfaces of the first contact plug and the first spacer, the first burying pattern including an insulating material.
20250212418. SEMICONDUCOTOR DEVICE ELECTRONIC SYSTEM INCLUDING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device includes a stacking structure disposed on a substrate and including a plurality of gate electrodes, a first channel structure penetrating the gate electrodes and including a first channel layer and a first ferroelectric layer including a vertical portion disposed between the first channel layer and a side surface of the stacking structure and a horizontal portion disposed on an upper surface of the stacking structure, a contact pad connected to the first channel structure, and a second channel structure connected to the contact pad. the contact pad includes a first portion contacting an upper surface of the first channel layer, a second portion penetrating the horizontal portion of the first ferroelectric layer and contacting an exterior surface of the first channel layer, and a third portion protruding from a bottom surface of the second portion and contacting the exterior surface of the first channel layer.
20250212419. MAGNETIC MEMORY DEVICE (Samsung Electronics ., .)
Abstract: a magnetic memory device includes a conductive line extended in a first direction and a magnetic track line provided on a top surface of the conductive line and extended in the first direction. the magnetic track line includes a domain injection portion and a line portion, which is extended from the domain injection portion in the first direction. the domain injection portion has a tapered shape in an opposite direction of the first direction. the conductive line has a linewidth in a second direction, and the first and second directions are parallel to the top surface of the conductive line and are perpendicular to each other. below the domain injection portion, a first linewidth of the conductive line remains constant in the opposite direction of the first direction.
20250212421. MAGNETIC MEMORY DEVICE METHOD FABRICATING SAME (Samsung Electronics ., .)
Abstract: a magnetic memory device includes: a substrate; a lower dielectric layer on the substrate; a plurality of lower electrode contacts in the lower dielectric layer, the plurality of lower electrode contacts being spaced apart from each other in a first direction parallel to a top surface of the substrate; a plurality of data storage patterns respectively on the plurality of lower electrode contacts, the plurality of data storage patterns being spaced apart from each other in the first direction; and a plurality of dielectric patterns on the lower dielectric layer between the plurality of data storage patterns, wherein the plurality of dielectric patterns include a metal element that is same or substantially same as that of the plurality of data storage patterns.
20250212425. INTEGRATED CIRCUIT DEVICE (Samsung Electronics ., .)
Abstract: an integrated circuit device includes a transistor on a substrate, and a capacitor structure connected to the transistor, where the capacitor includes a first electrode, a dielectric layer structure on the first electrode and in which a plurality of dielectric layers are stacked, and a second electrode on the dielectric layer structure, and where the plurality of dielectric layers include a first dielectric layer including a ferroelectric material in a rhombohedral crystal phase, and a second dielectric layer in a crystal phase different from the rhombohedral crystal phase of the first dielectric layer.
20250212445. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes a channel layer, a barrier layer positioned above the channel layer and including a material having a different energy band gap from an energy band gap of the channel layer, a gate electrode positioned above the barrier layer, a gate semiconductor layer positioned between the barrier layer and the gate electrode, a first source electrode positioned on a first side of the gate electrode, and a first drain electrode positioned on a second, opposite side of the gate electrode, the first source electrode and the first drain electrode each connected to the channel layer, a lower protection layer covering the barrier layer and the gate electrode, a first field dispersion plate connected to the first source electrode and positioned above the lower protection layer, and a first interlayer insulating layer positioned above the first field dispersion plate and the lower protection layer and including a first element of a first content (at %) in relation to the entire first interlayer insulating layer. the lower protection layer includes the first element of which a second content (at %) in relation to the entire lower protection layer is less than the first content (at %).
20250212446. HIGH ELECTRON MOBILITY TRANSISTOR (Samsung Electronics ., .)
Abstract: a high electron mobility transistor (hemt) includes an active region, in which a channel is formed, and a field region surrounding the active region. the hemt may include a channel layer; a barrier layer on the channel layer and configured to induce a two-dimensional electron gas (2deg) in the channel layer; a source and a drain on the barrier layer in the active region; and a gate on the barrier layer. the gate may protrude from the active region to the field region on the barrier layer. the gate may include a first gate and a second gate. the first gate may be in the active region and the second gate may be in the boundary region between the active region and the field region. a work function of the second gate may be different from a work function of the first gate.
20250212485. POWER SEMICONDUCTOR DEVICES (Samsung Electronics ., .)
Abstract: a power semiconductor device includes a substrate having a first conductivity-type. a drift layer is on the substrate and has the first conductivity-type. a well region is on the drift layer and has a second conductivity-type. a source region is on the well region and has the first conductivity-type. a gate electrode is in a gate trench penetrating the source region and the well region. a gate insulating layer is between the gate electrode and the well region. a drain electrode is on a lower surface of the substrate. a lower surface of the gate electrode has a first width and an upper surface has a second width greater than the first width. a side surface of the gate electrode has a step portion where a width of the gate electrode changes. the step portion is positioned at a lower level than a lower surface of the source region. 29
20250212489. SEMICONDUCTOR DEVICES (Samsung Electronics ., .)
Abstract: a semiconductor device may include a substrate, bottom electrodes disposed on the substrate, a supporting pattern disposed between the bottom electrodes, when viewed in a plan view, an upper electrode covering the bottom electrodes and the supporting pattern, a dielectric layer disposed between the bottom electrodes and the upper electrode and between the supporting pattern and the upper electrode and a first conductive contact connected to the upper electrode. the upper electrode comprises a metal layer, a first hydrogen diffusion barrier layer, and a first semiconductor layer, which are sequentially stacked on the dielectric layer. the first conductive contact is spaced apart from the first hydrogen diffusion barrier layer.
20250212490. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device may include a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns, which are vertically stacked to be spaced apart from each other, a source/drain pattern connected to the semiconductor patterns, a gate electrode on the semiconductor patterns, a backbone structure on a side surface of the gate electrode, and a first air gap pattern interposed between the backbone structure and each of the semiconductor patterns. the gate electrode may be extended to face a top surface, a side surface, and a bottom surface of each of the semiconductor patterns, and the first air gap pattern may be provided on an opposite side surface of each of the semiconductor patterns.
20250212503. INTEGRATED CIRCUIT DEVICE (Samsung Electronics ., .)
Abstract: an integrated circuit device may include semiconductor regions; an insulating wall extending in a first lateral direction and passing in a vertical direction between a pair of semiconductor regions adjacent to each other in a second lateral direction among the semiconductor regions, a pair of nanosheet stacks overlapping the pair of semiconductor regions in the vertical direction and facing frontside surfaces of the pair of semiconductor regions, a pair of source/drain regions, and a backside contact. each nanosheet stack may include a nanosheet having one end contacting a sidewall of the insulating wall in the second lateral direction. a contact end portion of the backside contact may be connected to one of the pair of source/drain regions. a contact sidewall of the backside contact may contact the insulating wall. the second lateral direction may be perpendicular to the first lateral direction.
20250212509. INTEGRATED CIRCUIT DEVICE (Samsung Electronics ., .)
Abstract: an integrated circuit device may include a first transistor including first nanosheets having a first width in a first horizontal direction, a first gate structure surrounding the of first nanosheets and extending on a first side of the first nanosheets in a second horizontal direction perpendicular to the first horizontal direction, and first source/drain regions on opposite sides of the first nanosheets in the first direction; and a second transistor above the first transistor and including second nanosheets above the first nanosheets and having a second width equal to the first width in the first horizontal direction, a second gate structure surrounding the second nanosheets and on a second side of the second nanosheets in the second horizontal direction, and second source/drain regions on both sides of the second nanosheets in the first horizontal direction.
20250212511. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes first, second, and third power rails extending in a first direction on a substrate and sequentially spaced apart in a second direction intersecting the first direction. a fourth power rail extends in the first direction on the substrate between the first and third power rails. a first well of a first conductive type is displaced inside the substrate between the first and third power rails. cells are continuously displaced between the first and third power rails and share the first well. the first and third power rails are provided with a first voltage, the second power rail is provided with a second voltage different from the first voltage, the fourth power rail is provided with a third voltage different from the first voltage and the second voltage, and the cells are provided with the third voltage from the fourth power rail.
20250212535. IMAGE SENSOR ELECTRONIC APPARATUS INCLUDING IMAGE SENSOR (Samsung Electronics ., .)
Abstract: an image sensor includes a plurality of pixels arranged two-dimensionally and each having a size less than or equal to a diffraction limit. each of the plurality of pixels includes a sensing layer including two or more photodiodes, and a surrounding material filling an area around the first, second, and third photodiodes. the two or more photodiodes include first, second, and third photodiodes that selectively absorb lights in red, green, and blue wavelength bands, respectively. an anti-reflection layer (arl) is located on a surface of the sensing layer. the arl lowers reflectance of light incident on the sensing layer.
20250212542. IMAGE SENSOR (Samsung Electronics ., .)
Abstract: an image sensor is provided. the image sensor includes: a first substrate including a first surface and a second surface opposite each other, and a plurality of photoelectric conversion elements between the first surface and the second surface; and a color filter provided on the second surface of the first substrate and including a first color filter, a second color filter, and a third color filter. the first color filter is provided on 36 photoelectric conversion elements among the plurality of photoelectric conversion elements. the 36 photoelectric conversion elements are arranged in six columns extending in a first direction and in six rows extending in a second direction that crosses the first direction. floating diffusion regions of 12 photoelectric conversion elements among the 36 photoelectric conversion elements are connected to each other.
20250212546. IMAGE SENSOR INCLUDING STACKED CAPACITORS (Samsung Electronics ., .)
Abstract: an image sensor including: a substrate having a first surface and a second surface that are opposite to each other; a first capacitor disposed on the first surface, wherein the first capacitor includes a first lower electrode, a first dielectric layer, and a first upper electrode that are sequentially stacked; a second capacitor disposed on the first capacitor, wherein the second capacitor includes a second lower electrode, a second dielectric layer, and a second upper electrode that are sequentially stacked; and a first contact plug penetrating the first lower electrode, the first dielectric layer, the first upper electrode, the second lower electrode, the second dielectric layer and the second upper electrode and contacting both the first upper electrode and the second upper electrode.
Abstract: a multi-use transfer mold and a method of manufacturing a display apparatus are provided. the multi-use transfer mold includes a transfer substrate and a plurality of grooves provided in the transfer substrate, wherein each of the grooves includes a transfer area for accommodating a transfer micro-light-emitting device and a preliminary area for accommodating a preliminary micro-light-emitting device, wherein the preliminary area is connected to the transfer area.
Abstract: provided are a light-emitting diode (led) device, a method of manufacturing the led device, and a display apparatus including the led device. the led device includes a light-emitting layer having a core-shell structure, a passivation layer provided to cover a portion of a top surface of the first semiconductor layer, a first electrode provided on the light-emitting layer, and a second electrode provided under the light-emitting layer. the light-emitting layer includes a first semiconductor layer, an active layer, and a second semiconductor layer. the first electrode is provided to contact the first semiconductor layer, and the second electrode is provided to contact the second semiconductor layer.
20250212596. LIGHT EMITTING DEVICE DISPLAY DEVICE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a method of producing a light emitting device includes: forming a light emitting layer including a semiconductor nanoparticle on a first electrode; forming an electron transport layer including a metal oxide nanoparticle on the light emitting layer; forming a thin film conductor on the electron transport layer; placing the electron transport layer, the thin film conductor, and an acid material together in a space defined by a container; and keeping the defined space at a post-treatment temperature of greater than or equal to about 40� c. and less than or equal to about 200� c. the light emitting layer is configured to emit a first light when a voltage is applied, a thickness of the thin film conductor is greater than or equal to about 1 nm and less than 100 nm, and the acid material includes a polymeric acid, a non-polymeric carboxylic acid compound, or a combination thereof.
20250212695. SEMICONDUCTOR DEVICE METHOD FABRICATING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device includes a substrate that includes a cell region and a peripheral region, a plurality of data storage patterns on the cell region and each including a bottom electrode, a magnetic tunnel junction pattern, and a top electrode that are sequentially stacked, and a magnetic shield layer at the cell region and between the data storage patterns. the magnetic shield layer has a top surface that is recessed toward the substrate between the data storage patterns.