Samsung Electronics Co., Ltd. patent applications on 2025-06-12
Patent Applications by Samsung Electronics Co., Ltd. on June 12th, 2025
Samsung Electronics Co., Ltd.: 262 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups - , or in a single subclass of ,, 3), H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application), 3), H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application), 2), H01L23/528 ({Geometry or} layout of the interconnection structure {( takes precedence; algorithms )}, 2), G06F1/1624 ({with sliding enclosures, e.g. sliding keyboard or display}, 2), H03M1/1014 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means ; optical analogue/digital converters ; coding, decoding or code conversion, specially adapted for particular applications, see the relevant subclasses, e.g. , , , , , , , , , , , ; ciphering or deciphering for cryptography or other purposes involving the need for secrecy ), 2), G06T5/73 (Deblurring; Sharpening, 2), G06T5/50 (using two or more images, e.g. averaging or subtraction, 2), G06F3/0659 ({Command handling arrangements, e.g. command buffers, queues, command scheduling}, 2), G06F9/3001 ({Arithmetic instructions}, 2)
With keywords such as: device, includes, including, electronic, housing, coupled, coupling, strap, groove, detachably in patent application abstracts.
Top Inventors:
- Yunho JEONG of Suwon-si KR (1 patents)
- Junghun KIM of Suwon-si KR (1 patents)
- Kwangyong LEE of Suwon-si KR (1 patents)
- Jaechul LEE of Suwon-si KR (1 patents)
- Hyejin JANG of Suwon-si KR (1 patents)
Collaborating organizations:
- The Texas A&M University System (1 patents)
- AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION (1 patents)
- Massachusetts Institute of Technology (1 patents)
- UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) (1 patents)
Patent Applications by Samsung Electronics Co., Ltd.
Abstract: an electronic device includes: a housing including a pin; and a strap detachably coupled to the housing. the strap includes: a coupling groove that includes a first end that surrounds the pin and a second end that is open toward a first surface of the strap; and a button including an inclined surface that is inclined with respect to the first surface of the strap and slidable relative to the pin. a first portion of the button is movable into or out of the coupling groove, wherein a gap between the first portion of the button and an inner surface of the coupling groove is expanded as the button moves in a first direction toward a second surface of the strap opposite to the first surface of the strap, and wherein the gap is reduced as the button moves in a second direction opposite to the first direction.
Abstract: a brush apparatus includes a core portion rotating around a length direction as an axis, a main body portion at least partially surrounding the core portion, a plurality of protrusion portions protruding from the main body portion, and a detection portion disposed in at least a part of the main body portion and the plurality of protrusion portions. the detection portion is formed of poly vinyl acetal (pva) including detection components that react with ceria.
Abstract: a dust collection device may include a support plate including an opening through which dust is introducible, a protruding rib extending downward from a circumference of the opening of the support plate, and an opening/closing device couplable to the support plate. the opening/closing device may include an opening/closing cover configured to open and close the opening of the support plate, while the opening/closing device is coupled to the support plate, and a cover rib protruding from an upper surface of the opening/closing cover and configured to contact the protruding rib while the opening of the support plate is closed by the opening/closing cover.
20250185862. CLEANER (Samsung Electronics ., .)
Abstract: a cleaner includes a case having an internal path formed therein and an intake motor to draw in air containing foreign substances into the case. the cleaner includes a dust collector on the internal path of the case through which the drawn air flows and rotatable to separate the foreign substances from the drawn air by rotating the drawn air, and a rotation body disposed further downstream than the dust collector in an airflow direction of the drawn air, to rotate by the air passing through the dust collector, and to rotate the dust collector by being combined with the dust collector.
20250185863. DUST COLLECTOR CLEANER HAVING SAME (Samsung Electronics ., .)
Abstract: a cleaner including an intake head to draw in foreign matter, a dust collector connected to the intake head, and a fan configured to generate an intake force within the dust collector. the dust collector may include a housing including an inlet and an outlet that are arranged facing a first direction from the inlet, a rotating body rotatable within the housing, a partition arranged between the housing and the rotating body, a first flow path formed between an inner side of the partition and the rotating body and configured to allow air entering through the inlet to be directed along the first direction, and a second flow path formed between an outer side of the partition and the housing and configured to allow air to be directed along a second direction opposite to the first direction.
20250185864. EXTENTSION TUBE VACUUM CLEANER COMPRISING SAME (Samsung Electronics ., .)
Abstract: a vacuum cleaner including: a main body; a cleaner head; a pipe structure connecting the main body and the cleaner head, the pipe structure including a main pipe connected to the cleaner head, and a first pipe connected to the main body and disposed within the main pipe to be slidable along the longitudinal direction of the main pipe; a support member disposed on the first pipe along the longitudinal direction of the first pipe, the support member including a rail groove formed at one end thereof; and connection cap mounted on an end of the first pipe which is opposite to the end connected to the main body.
20250185873. DISHWASHER METHOD CONTROLLING SAME (Samsung Electronics ., .)
Abstract: a dishwasher according to an embodiment of the disclosure may include: a cabinet; a tub disposed in the cabinet; a sump disposed below the tub; a deionizer comprising at least one electrode configured to produce soft water using raw water supplied from a water source, and supply the soft water to the sump; a plurality of flow paths including at least one pipe and/or at least one hose configured to allow the raw water, the soft water, and used water collected in the sump to flow; a plurality of valves disposed in each of the plurality of flow paths; and a controller including at least one processor, comprising processing circuitry, individually and/or collectively, configured to control the plurality of valves to allow the deionizer to be regenerated using the raw water or the used water, in at least one of a washing process or a rinsing process.
20250185878. SHOE CARE APPARATUS (Samsung Electronics ., .)
Abstract: provided is a shoe care apparatus including a door capable of simplifying an assembly process while reducing material cost. the shoe care apparatus includes: a main body; a care room provided inside the main body and accommodating shoes; and a door opening and closing the care room, wherein the door includes: a front panel forming a front surface of the door, and including a side trim provided on a rear surface of the front panel or a magnet provided on the rear surface of the front panel; a rear body forming a rear surface of the door; and a reinforcement plate positioned between the front panel and the rear body, and detachably coupled with the front panel, and the reinforcement plate includes: a recess portion accommodating at least one portion of the side trim; and a magnet coupling portion coupled with the magnet by a magnetic force of the magnet, and arranged in parallel to the recess portion.
20250185991. METHOD SYSTEM ESTIMATION ABDOMINAL FAT (Samsung Electronics ., .)
Abstract: the disclosure relates to studying physical properties of biological tissues, and for example, to a method and system for indirect estimation of the abdominal subcutaneous fat area and the abdominal visceral fat area. the technical result is reduced complexity and increased accuracy and speed of estimation of the abdominal subcutaneous fat area and the abdominal visceral fat area with portable devices. a method for determining the abdominal visceral fat area and the subcutaneous fat area in a body section in an abdominal region, comprises: using a device with ultra-wide band (uwb) radar applied to the body in the abdominal region, emitting radiation into the body and measuring parameters of reflected radiation; based on the reflected radiation measurement data obtained by the uwb radar, determining the abdominal subcutaneous fat area (asfa) in the body section, corresponding to the measurement point; acquiring anthropometric data and bio-electrical impedance value of the body; based on the bio-electrical impedance data of the body and the anthropometric data, determining total fat area (tfa) in the body section in the abdominal region; calculating the abdominal visceral fat area (avfa) in the body section from the determined total fat area and the abdominal subcutaneous fat area.
20250186290. MOTION ASSISTANCE APPARATUS (Samsung Electronics ., .)
Abstract: a motion assistance apparatus may include a base body configured to support the back of a user, a connection frame connected to the base body, a driving module connected to the connection frame and configured to generate power to assist motion of the user, a waist frame connected to the driving module, a waist belt connected to the waist frame, a leg frame including a frame body configured to receive the power from the driving module and rotate and a frame holder extending from the frame body, and a thigh fastener including a fastening frame disposed on the thigh of the user, a wearing strap connected to the fastening frame and capable of being in close contact with the thigh of the user, and a connection strap extending from the wearing strap and passing between the frame body and the frame holder.
20250186291. DEVICE CONTROLLING WALKING AID METHOD THEREFOR (Samsung Electronics ., .)
Abstract: a walking aid device and/or a control method therefor. according to an example embodiment, a method for controlling a walking aid device may include: obtaining sensor data from one or more sensors; obtaining a plurality of pieces of speed information on the basis of the sensor data; determining whether a walking aid device has reached a first state, on the basis of at least one of the plurality of pieces of speed information; determining a change control torque corresponding to the at least one of the plurality of pieces of speed information, on the basis of the determination result; and controlling the walking aid device with the change control torque.
20250186839. SYSTEM METHOD GENERATING WORKOUT ROUTINE (Samsung Electronics ., .)
Abstract: a system for generating an exercise routine, may include: a wearable electronic device including: a sensor; a first communication interface; first memory storing one or more first instructions; and at least one first processor configured to execute the one or more first instructions, wherein the one or more first instructions, when executed by the at least one first processor, cause the wearable electronic device to: collect exercise data corresponding to a plurality of exercise actions performed by a user wearing the wearable electronic device, based on biometric information of the user obtained from the sensor; and transmit the exercise data to an electronic device, using the first communication interface.
Abstract: disclosed are substrate processing apparatuses and methods. the substrate processing apparatus comprises a first process chamber including a first process space, a stage in the first process space and being configured to support a substrate, a stage driving mechanism configured to drive the stage to rotate about a first axis, a cleaning nozzle arm configured to supply a cleaning solution onto the stage, a gas supply unit configured to provide an inert gas to the first process space, and an airflow generator between the stage and the gas supply unit and being configured to generate a spiral-shaped rotating air current.
20250187051. CLEANING APPARATUS (Samsung Electronics ., .)
Abstract: a cleaning apparatus may include a cleaning chamber, a vacuum generator and an air injection module. the cleaning chamber may be configured to receive a tray, the tray may be configured to receive a plurality of objects. the vacuum generator may be configured to apply vacuum into the cleaning chamber and fix a lower surface of the tray. the air injection module may be configured to inject air to an upper surface of the tray to remove a contaminant from the objects. thus, the cleaning apparatus may have improved cleaning efficiency without a damage of the object.
20250187889. LIFT MOBILE ROBOT HAVING SAME (Samsung Electronics ., .)
Abstract: a lift includes: a lifting block; a lifting groove on a lower surface of the lifting block and including first and second inclined surfaces; a first moving block configured to slide relative to the first inclined surface of the lifting groove and including a first moving inclined surface corresponding to the first inclined surface; a second moving block configured to slide relative to the second inclined surface of the lifting groove and including a second moving inclined surface corresponding to the second inclined surface; a drive device configured to simultaneously move the first and second moving blocks away from each other so that the lifting block rises or closer to each other so that the lifting block descends; and a base plate below the first and second moving blocks and configured to support the first moving block and the second moving block to move in a straight line.
Abstract: disclosed herein are a multilayer structure, an exterior cover for an electronic device, and an electronic device including same. the multilayer structure may comprise: a first pigment layer containing tioand body pigment; a white layer containing tioon the first pigment layer, and a second pigment layer containing tioand body pigment on the white layer.
20250188607. METHOD MANUFACTURING THIN FILM (Samsung Electronics ., .)
Abstract: a method of manufacturing a thin film includes an operation of providing a substrate, a first cycle including an operation of forming a first atomic layer on the substrate by using an atomic layer deposition (ald) process using a first precursor, and a second cycle including an operation of forming a second atomic layer on the first atomic layer by using an ald process using the first precursor and a second precursor, wherein the first atomic layer includes a ferroelectric material layer or an anti-ferroelectric material layer, the first precursor includes a first central ion, the second precursor includes a second central ion, and the second central ion is included as a substitutional ion in a lattice including the first central ion, in the second atomic layer.
20250188667. FILTER MODULE, FILTER APPARATUS, CLOTHES TREATING APPARATUS (Samsung Electronics ., .)
Abstract: a filter module may comprise a filter case having a case opening and an inlet to allow water to enter the filter case, a filter mountable in the filter case through the case opening, and a sealing member that is deformable and is configured so that, with the filter mounted in the filter case, at least a portion of the sealing member is outside a perimeter of the case opening, and with the filter mounted in the filter case and the water entering the filter case through the inlet and thereby causing a hydraulic pressure in the filter case, the sealing member is deformed by the hydraulic pressure so as to seal a gap formed between the filter case and the filter.
20250188668. CLOTHES TREATING APPARATUS CLOTHES TREATING SYSTEM (Samsung Electronics ., .)
Abstract: a clothes treating apparatus may include: a housing including: a side frame, a support frame mounted on the side frame and including: a support upper surface portion, and a support forming portion protruding from the support upper surface portion to strengthen the support frame against bending and/or twisting, and a front frame mounted to a front side of the side frame, and including: a frame front surface portion facing forward, and a frame upper surface portion facing upward and supported by the support upper surface portion, and a drum inside the housing to accommodate laundry inside the drum.
20250188671. CLOTHING DRYER INCLUDING HEATER (Samsung Electronics ., .)
Abstract: the disclosure is intended to reduce flow resistance of air passing through a heater in a clothing dryer. to that end, a clothing dryer may include a drum, a heat exchanger, an inlet duct which air passed through the heat exchanger flows to be is introduced into the drum, a blower fan forming a flow of the air, and a heater in the inlet duct. the heater may include a housing comprising a lower side comprising a first open surface so as to form an inlet through which the air flowing in the inlet duct is introduced into the housing and an upper side comprising a second open surface so as to form an outlet through which the air introduced into the housing is discharged from the housing, at least one plate parallel to a direction in which the air flows through the housing and fixed to a front surface and a rear surface of the housing, and a coil passing through a hole formed in each plate of the at least one plate in a direction perpendicular to a face of the plate. an area of the second open surface may be larger than an area of the first open surface.
20250188672. DRYER CONTROL METHOD CONTROLLING DRYER (Samsung Electronics ., .)
Abstract: a dryer includes a case coupled to a water tank configured to store condensed water generated by a heat exchanger, a diaphragm coupled to the case, wherein a force according to a water level of the water tank is applied to the diaphragm, and a force sensor between the case and the diaphragm.
20250189140. RANGE HOOD INCLUDING CAMERA CONTROLLING METHOD THEREOF (Samsung Electronics ., .)
Abstract: a range hood and a controlling method thereof are provided. the range hood includes a camera, a communication interface, a fan, a filter for purifying air drawn into the range hood by driving the fan, memory storing one or more computer programs, and one or more processors communicatively coupled to the camera, the communication interface, the fan, the filter, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the range hood to transmit an image of a cooking object obtained through the camera to a server via the communication interface, based on a first correction coefficient obtained based on a type of food and a cooking method corresponding to the cooking object being received from the server, identify a usage time of the filter corresponding to the food based on the first correction coefficient and a running time of the fan, and identify when to replace the filter based on the usage time of the filter and a cumulative usage time of the filter.
Abstract: an air conditioner includes a detection sensor, an illuminance sensor, a light, an air conditioning module, at least one processor, and a memory storing instructions, when executed by the at least one processor individually or collectively, cause the air conditioner to determine whether an illuminance value detected by the illuminance sensor is greater than or equal to a first illuminance reference value, detect a human in a target space by using a sensor detection value of the detection sensor, and based on the detected illuminance value being greater than or equal to the first illuminance reference value and a human being detected in the target space, control the light in a first mode in which at least one of luminous intensity or a luminous intensity change pattern of the light is controlled based on a compressor frequency of the air conditioning module.
20250189162. AIR CONDITIONER CONTROLLING METHOD THEREFOR (Samsung Electronics ., .)
Abstract: an air conditioner is provided. the air conditioner includes an indoor unit including an indoor heat exchanger, an outdoor unit including a compressor configured to supply a refrigerant to the indoor heat exchanger, an indoor heat exchanger temperature sensor configured to detect a temperature of the indoor heat exchanger, an indoor humidity sensor configured to detect an indoor humidity, an indoor temperature sensor configured to detect an indoor temperature, memory storing instructions, and one or more processors, wherein the instructions, when executed by the one or more processors individually or collectively, cause the air conditioner to determine whether to perform a comfort operation to maintain the temperature of the indoor heat exchanger to be less than or equal to a dew point temperature, based on the indoor humidity and the indoor temperature during a dehumidifying operation, and adjust a frequency of the compressor based on the temperature of the indoor heat exchanger and the dew point temperature during the comfort operation.
20250189166. AIR CONDITIONER (Samsung Electronics ., .)
Abstract: an air conditioner includes a discharge blade configured to move between a guide position at which a direction of air blown from a blower fan and discharged to an outlet is controlled, and a closing position at which the outlet is closed, wherein the discharge blade includes a plurality of blade holes through which the air is discharged through the discharge blade at the closing position, wherein the discharge blade moves between the guide position and the closing position and controls an air flow from the blower fan to a discharge plate or the outlet. through this configuration, an air flow discharged to the outside of the housing can be controlled by operation of the discharge blade.
20250189185. ROTARY COMPRESSOR HOME APPLIANCE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a home appliance is provided. the home appliance includes a compressor configured to compress a refrigerant, and a heat pump including a heat exchanger configured to condense or evaporate the refrigerant using the refrigerant compressed by the compressor, wherein the compressor includes a case including a suction port and a discharge port, a compression device configured to compress the refrigerant introduced from the suction port, and a driving device disposed on one side of the compression device and configured to drive the compression device, and wherein the compression device includes a compression chamber providing a space in which the refrigerant is compressed, a suction hole communicating with the suction port, and an insulation chamber positioned outside the compression chamber to be spatially separated from the compression chamber.
20250189210. REFRIGERATOR (Samsung Electronics ., .)
Abstract: provided is a refrigerator including a main body including a storeroom, a door body arranged to open or close the storeroom, a decoration panel coupled to a front side of the door body, and a holder mounted on the front side of the door body to be coupled to the decoration panel. the door body includes a rear case defining a rear side of the door body, and a main case defining front and sides of the door body. the main case includes a front part defining the front side of the door body and having an installation groove in which to install the holder, side parts defining sides of the door body, and a rear coupler coupled to the rear case. the main case is formed by bending a single metal board.
Abstract: a measurement device includes a light source configured to emit a fundamental wave that is a femtosecond pulsed laser beam, a second harmonic generator configured to convert a portion of the fundamental wave into a first-second harmonic, a birefringent crystal configured to split an angle for the first-second harmonic, a wavelength selection element configured to block the fundamental wave and transmit therethrough the first-second harmonic and a second-second harmonic, a polarizer configured to polarize the first-second harmonic and the second-second harmonic to approximately same polarizations, and an image detector.
Abstract: disclosed is a magnetic field sensor device that measures a magnetic field, the magnetic field sensor device including a sensor unit that senses the magnetic field and generates sensing data, and a processing unit that generates magnetic field data based on the sensing data, wherein the sensor unit includes a sensor substrate, a center sensor positioned on a center of the sensor substrate on the sensor substrate, reference axis sensors arranged on the sensor substrate along a straight line passing through the center of the sensor substrate, and first circumference sensors arranged on the sensor substrate from the center along a circumference having a first radius, and the center sensor, the reference axis sensors, and the first circumference sensors measure magnetic field passing through the center sensor, the reference axis sensors, and the first circumference sensors, respectively.
Abstract: an example metal storage device includes a storage body that defines a storage space and extends in a first direction, a heater connected to the storage body and applying heat to the storage space, and an ultrasonic measurement circuit combined with an outer surface of the storage body and transceiving an ultrasonic wave that propagates through the storage body as a medium. the ultrasonic measurement circuit includes an ultrasonic generator that generates the ultrasonic wave, and an ultrasonic receiver that receives the ultrasonic wave and spaced apart from the ultrasonic generator in the first direction and a second direction. the second direction intersects the first direction.
20250189370. SOLID-STATE IMAGING DEVICE (Samsung Electronics ., .)
Abstract: a solid-state imaging device includes a plurality of pixel blocks, wherein each pixel block of the plurality of pixel blocks includes a plurality of single-photon avalanche diode (spad) pixels configured for imaging, and at least one spad pixel of the plurality of spad pixels includes a detection circuit configured to detect a variation of light incident on the plurality of spad pixels.
20250189403. INDOOR IMAGE QUALITY EVALUATION SYSTEM IMAGE SENSOR (Samsung Electronics ., .)
Abstract: an indoor image quality evaluation system includes an imaging robot on which an image sensor to be evaluated is mounted and which autonomously travels, an indoor studio having a circulation path on which the imaging robot moves, subjects arranged along the circulation path, an adjustable light configured to provide different imaging environments for the subjects, and a management server configured to control the imaging robot, the adjustable light, and the image sensor.
Abstract: provided is a method of operating a device for detecting a damage to a switch included in a power management integrated circuit, the method including: measuring a first temperature of a switch included in a power management integrated circuit; detecting an input voltage applied to the switch; measuring a second temperature of the switch based on the detected input voltage being a power supply voltage; obtaining a first temperature change amount of the switch, based on the first temperature and the second temperature; comparing the first temperature change amount with a threshold temperature change amount; and selectively turning off the switch based on a result of the comparing.
Abstract: an electrode system and a complementary metal-oxide-semiconductor (cmos)-based device including the same are provided. the electrode system includes a light-emitting diode (led) display layer. a first photoconductive layer on the led display layer, a second photoconductive layer on the first photoconductive layer, and an electrode layer.
Abstract: a method for detecting a change in performance of a fingerprint sensor due to a protective material, and an electronic device supporting same are provided. the electronic device includes a display, a fingerprint sensor disposed below the display, memory storing one or more computer programs, and one or more processors communicatively coupled to the display, the fingerprint sensor, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to detect a specified trigger related to a performance test of the fingerprint sensor, control the fingerprint sensor to obtain a specified image, based on detecting the specified trigger, extract reference data configured in the memory, determine a state related to a protective material attachable onto the display, based on the specified image obtained through the fingerprint sensor and the reference data, determine whether performance of the fingerprint sensor has changed, based on the state related to the protective material, perform a specified operation based on whether the performance of the fingerprint sensor has changed.
20250189619. ELECTRONIC DEVICE LOCATION MEASUREMENT METHOD USING SAME (Samsung Electronics ., .)
Abstract: an electronic device is provided. the electronic device includes a communication circuit configured to communicate with an external electronic device, memory, storing one or more computer programs, including map information including location information of a plurality of access points (aps) in a specific area, and one or more processors communicatively coupled to the communication circuit and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to determine, based on the map information, at least one ap located within a certain distance from a first location of the electronic device among the plurality of aps as a first group, determine, based on a signal received from the ap in the first group, a first distance between an ap in the first group and the electronic device, determine, based on the map information, a second distance between the ap in the first group and the electronic device, determine an ap in which a difference between the first distance and the second distance is less than a certain level among at least one ap in the first group as a second group, and determine a second location of the electronic device by using an ap in the second group, wherein the first location is determined based on a signal broadcast by the plurality of aps in the specific area.
20250189649. METHOD DEVICE RANGING USING UWB COMMUNICATION (Samsung Electronics ., .)
Abstract: an ultra-wideband (uwb) device according to an embodiment disclosed herein comprises a uwb subsystem (uwbs) and a processor connected to the uwbs. the processor may: control to transmit a control message, including a first ranging round management list (rrml) parameter corresponding to a first session id and a second rrml parameter corresponding to a second session id, in a first ranging round within a first ranging block; perform contention-based ranging in a second ranging round mapped to the first session id within the first ranging block; and transfer data to an external uwb device on a plurality of ranging slots mapped to the second session id within the first ranging block.
20250189653. METHOD APPARATUS RADAR SIGNAL PROCESSING (Samsung Electronics ., .)
Abstract: a method of determining an elevation angle of a target object includes determining a first elevation angle with respect to the target object based on a first component of an initial radar signal received through an array antenna of a radar sensor, determining an angular window based on the first elevation angle, generating a second direction of arrival (doa) estimation spectrum by applying the angular window to a first doa estimation spectrum generated based on a second component of the initial radar signal, and determining a second elevation angle with respect to the target object based on the second doa estimation spectrum.
Abstract: a lensless imaging system includes a coded mask including at least one domain, and an image sensor configured to receive light that passes through the coded mask and generate an electrical signal for image generation based on the received light, where each of the at least one domain includes a plurality of sub-domains provided in a first pattern, each of the plurality of sub-domains includes a second pattern, and the plurality of sub-domains are configured to deflect incident light based on a combination of the first pattern and the second pattern.
20250189751. ELECTRONIC DEVICE INCLUDING CAMERA MODULE (Samsung Electronics ., .)
Abstract: according to certain embodiments, an electronic device comprises a housing; and a camera module disposed in an inner space of the housing and including: a barrel having an opening; and a plurality of lenses with aligned centers with an image sensor in an inner space of the barrel, wherein the plurality of lenses comprises at least one other lens and a first lens disposed closest to the opening and having a first outer diameter, wherein the first lens includes: a lens portion, forming an effective area of the first lens, the lens portion exposed to the opening; a connecting portion, forming a portion of an ineffective area of the first lens, extended from the lens portion and inclined at an angle in a first direction away from the lens portion; and a flange portion, forming another portion of the ineffective area of the lens portion, extended from the connecting portion in a second direction substantially perpendicular to a stack direction of the plurality of lenses, wherein the barrel includes: a head portion containing the opening and having a second outer diameter; a body portion extended from the head portion, accommodating the at least one other lens of the plurality of lenses, and having a third outer diameter greater than the second outer diameter; and an engaging portion formed in the inner space of the barrel and engaged with the flange portion, and wherein the first outer diameter of the first lens is greater than the second outer diameter of the head portion.
Abstract: an illuminating optical module according to an embodiment transmits a beam irradiated from a light source module to a sample, and may include: a first lens that receives a beam from the light source module; a second lens that receives the beam from the first lens; a field stop that is disposed between the first lens and the second lens and adjusts the amount of beam transmitted to the second lens; a third lens that transmits the beam transmitted from the second lens to the sample; and an aperture stop that is disposed on a path of the beam passing between the second lens and the third lens and adjusts a size of numerical aperture (na), wherein the aperture stop may make the beam transmitted to the sample have the same na in all parts of a field of view (fov).
20250189902. METHODS DETERMINING OVERLAYER REFERENCE WAVELENGTH (Samsung Electronics ., .)
Abstract: a method of determining an overlay reference wavelength, the method comprising: forming a pattern structure including a wafer and overlay keys on the wafer; obtaining first setup values of the pattern structure for first measurement wavelengths, respectively; selecting second measurement wavelengths among the first measurement wavelengths by filtering the first measurement wavelengths based on the first setup values; obtaining second setup values of the pattern structure for the second measurement wavelengths, respectively; and selecting a reference wavelength among the second measurement wavelengths based on the second setup values, wherein each of the first setup values is proportional to a deviation value of target sigma values of the overlay keys at a respective first measurement wavelength, and wherein each of the second setup values is inversely proportional to a deviation value of stack sensitivity values of the overlay keys at a respective second measurement wavelength.
20250190004. MEMORY DEVICE REDUCING LEAKAGE CURRENT (Samsung Electronics ., .)
Abstract: a memory device for reducing leakage current is provided. the memory device includes a function circuit including a plurality of semiconductor devices and a body bias generator that provides body bias voltages to body terminals of the plurality of semiconductor devices. the function circuit includes a first circuit, a second circuit, and first to fourth switches. the first switch is connected between the first circuit and a first node to which the body bias voltage is applied. the second switch is connected between the second circuit and a first node. the third switch is connected between the first circuit and a second node to which a supply voltage is applied. the fourth switch is connected between the second circuit and the second node. the switches are controlled by a control signal. the device threshold voltage is increased by the applied body bias voltage thereby reducing leakage current.
20250190006. CURRENT GENERATOR, SEMICONDUCTOR DEVICE, RECEIVER (Samsung Electronics ., .)
Abstract: a current generator may include an amplifier configured to receive a reference voltage through a first input terminal, receive a feedback voltage through a second input terminal, and generate an output voltage based on a difference of the reference voltage and the feedback voltage, a first resistor a second resistor, a first transistor, a second transistor configured to transfer a first current through a first terminal, and a third transistor having a gate connected to an output terminal of the amplifier, a first terminal connected to a power source, and configured to transfer a second current that is a mirror current of a first current through the second terminal.
Abstract: a display device is disclosed. the display device includes a display which can operate in landscape mode and in portrait mode, a stand for supporting the display, a connection assembly for connecting the display and the stand, a speaker on the back of the display, and a wave guide provided on the back of the display. the wave guide includes a first wave guide on the rear surface of the display and a a second wave guide on the rear surface of the display. when the display is in the landscape mode, the first wave guide is configured to output a sound of the speaker therethrough and when the display is in the portrait mode, the second waveguide is configured to output the sound of the speaker therethrough.
20250190015. ROLLABLE ELECTRONIC DEVICE (Samsung Electronics ., .)
Abstract: an electronic device may include: a first housing; a second housing configured to slide with respect to the first housing; a display including a first display area disposed on the first housing and a second display area extending from the first display area, the display being configured such that at least a portion of the second display area slides on the basis of the slide movement of the second housing; a first battery disposed on the first housing; a second battery disposed on the second housing and configured to slide on the basis of the slide movement of the second housing; a plate disposed on the second housing and providing a seating space of the second battery on the basis of the slide movement of the second housing; and a support member of which one end is connected to the first housing, of which the other end is connected to the plate, and which is formed to move on the basis of the slide movement of the second housing.
Abstract: an electronic device may comprise: a slidable display and at least one processor, comprising processing circuitry, individually and/or collectively, configured to: control the display to display a screen including content on the slidable display; confirm an event in which the slidable display automatically expands or contracts by a specified size, wherein the specified size can be determined on the basis of the event; control the display to display an object on the slidable display on the basis of the event to indicate the progress of expansion or contraction of the slidable display, wherein the size of the object can be determined on the basis of the specified size; and apply a visual effect indicating the progress to the object while expanding or contracting the slidable display by the specified size.
20250190018. WEARABLE DEVICE METHOD OBTAINING DATA ABOUT USER (Samsung Electronics ., .)
Abstract: a wearable device is provided. the wearable device includes a temperature sensor, a pupil recognition sensor, a brainwave sensor, a camera, memory storing one or more computer programs, communication circuitry, and one or more processors communicatively coupled to the temperature sensor, the pupil recognition sensor, the brainwave sensor, the camera, the communication circuitry and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the wearable device to obtain, through the temperature sensor, first data representing a temperature associated with a head of a user, contacted with the wearable device, recognize, based on the first data representing the temperature within a first reference range, a state of the user as an emergency state, based on recognizing the state of the user as the emergency state, store, in the memory, first content obtained from a second timing which is before predefined time from a first timing in which the state of the user is recognized as the emergency state through the camera, to a third timing after the predefined time from the first timing and information on a conscious state of the user obtained from the first timing to the third timing using the pupil recognition sensor or the brainwave sensor activated in response to the recognition of the emergency state, transmit, to a second wearable device contacted with a wrist, a first request to obtain second data associated with a heart rate of the user, transmit, to a first external electronic device, a second request to transmit information representing the emergency state of the user and the information on the conscious state of the user to a second external electronic device, based on the first data representing the temperature within a second reference range distinct from the first reference range, recognize the state of the user as a danger monitoring state, and based on recognizing the state of the user as the danger monitoring state, store, in the memory, second content obtained from a fourth timing in which the state of the user is recognized as the danger monitoring state through the camera, to a fifth timing after the predefined time from the fourth timing, provide information that warns of possible danger, transmit, to the second wearable device, the first request, receive, from the second wearable device, the second data in response to the first request, and identify, using the first data and the second data, whether the state of the user is changed from the danger monitoring state to the emergency state.
20250190039. SYSTEM CHIP METHOD OPERATING SAME (Samsung Electronics ., .)
Abstract: disclosed is a system-on-chip. the system-on-chip including at least one operation processing unit configured to process an instruction based on a driving voltage and a clock signal, a temperature management module configured to estimate a cooling coefficient and a heating coefficient associated with the at least one operation processing unit based on a temperature measured at the at least one operation processing unit, and determine an operating frequency of the clock signal to be sent to the at least one operation processing unit based on the cooling coefficient and the heating coefficient, and a dynamic voltage and frequency scaling (dvfs) module configured to output a control signal for adjusting the driving voltage and the clock signal based on the operating frequency.
Abstract: a wearable electronic device according to an embodiment of the disclosure may include a wireless communication module, a sensor module, a first recognition camera and/or a second recognition camera, and a processor operatively connected with the wireless communication module, the sensor module, the first recognition camera, and/or the second recognition camera, wherein the processor is configured to identify that a first controller and a second controller, each of which an led disposed therein, are detected within a designated space, through at least one of the first recognition camera and the second recognition camera, transmit, to the first controller, a control signal which causes the led disposed in the first controller to be operated at a first turn-on time, and transmit, to the second controller, a control signal which causes the led disposed in the second controller to be operated at a second turn-on time. various other embodiments are also possible.
20250190093. USER TERMINAL DEVICE DISPLAYING METHOD THEREOF (Samsung Electronics ., .)
Abstract: a user terminal device and a displaying method thereof are provided. the user terminal device includes a display configured to display a first screen on a display which is divided by a folding line into a first area and a second area, the second area being larger than the first area with reference to a folding line and including an exposure area that is exposed while the display is folded along the folding line such that the first area faces the second area, a detector configured to detect, while the first screen is displayed, a first folding interaction of folding the display such that the first area faces the second area and a second folding interaction of folding the display such that a first cover corresponding to the first area faces a second cover corresponding to the second area, and a controller configured to, in response to detecting the first folding interaction, display a second screen related to the first screen on the exposure area, and in response to the second folding interaction being detected, display a third screen related to the first screen on the first area or the second area.
Abstract: an example electronic device may include a touch sensor and a processor. based on a touch input at a plurality of contact points contacted on the touch sensor, the processor can identify the distance between the plurality of contact points and the center point of the plurality of contact points. based on a speed of the center point due to the movement of the contact points, the processor can obtain a probability that the touch input corresponds to a first designated gesture associated with the distance and a probability that the touch input corresponds to a second designated gesture associated with the movement of the center point. the processor can change at least one of the distance or the center point based on the probabilities.
Abstract: disclosed is a memory system which includes a memory device that includes a memory cell array and a notification circuit, and a memory controller that transmits a refresh management (rfm) command to the memory device, based on a number of occurrences of bank activation of a bank included in the memory cell array reaching a threshold. the memory controller controls a transmission frequency of the rfm command, based on a notification obtained through the notification circuit. the notification includes at least one of a row hammer risk for rows included in the bank or temperature information including a temperature range of the memory device.
20250190118. STORAGE DEVICE (Samsung Electronics ., .)
Abstract: a storage device includes a first buffer memory and a second buffer memory that are different from each other in at least one operation parameter, a non-volatile memory, and a storage controller connected to the first buffer memory, the second buffer memory, and the non-volatile memory and configured to perform communication with the first buffer memory, the second buffer memory and the non-volatile memory. each of the first buffer memory and the second buffer memory includes magnetic random access memory (mram) cells and a peripheral circuit configured to operate the mram cells according to the at least one operation parameter.
20250190135. MEMORY CONTROLLER STORAGE DEVICE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a storage device includes a memory device including memory blocks corresponding to physical zones; and a memory controller connected to the memory device is configured to, when receiving a zone reset command for a reset target zone, update a physical zone corresponding to the reset target zone among the physical zones to an invalid zone in a mapping table, and to trigger a block erase operation for a erase target memory block among memory blocks included in the invalid zone in a period in which a foreground operation corresponding to a foreground command is not performed, and wherein the memory controller is configured to, when receiving an additional foreground command in the period in which the block erase operation is performed on a current memory block, trigger an additional foreground operation corresponding to the additional foreground command after the block erase operation is completed.
20250190144. STORAGE DEVICE, BUFFER CHIP, METHOD OPERATING STORAGE DEVICE (Samsung Electronics ., .)
Abstract: provided is a storage device that simultaneously exchanges signals with at least one storage area, the storage device including a memory controller configured to generate at least one of a chip enable signal and a one command/address signal, a buffer chip configured to receive the chip enable signal, the command/address signal, and a data signal from the memory controller, and a memory device including at least one storage area configured to perform at least one of a write operation and a read operation, based on the command/address signal and the data signal received by the buffer chip.
20250190145. METHOD APPARATUS IN-MEMORY COMPUTATION (Samsung Electronics ., .)
Abstract: a method of controlling a memory module for a processing in-memory (pim) computation includes monitoring, based on a first command and an address, an open state of a pim row of a pim computation bank in the memory module corresponding to the address, generating a pim computation command signal when it is determined as a result of the monitoring that a pim row of each of pim computation banks included in the memory module is in an open state, and controlling the memory module so that a second command received while the pim computation command signal is generated is processed using a pim computation.
Abstract: a method of downloading firmware includes executing a debug mode by reading a complete signature, checking whether download steps of firmware have been completed, and executing the firmware based on the complete signature. the debug mode includes writing a start signature in response to a start operation of the download steps, writing a write signature in response to completion of the write operation of the firmware of the download steps, and writing the complete signature in response to all of the download steps being completed.
Abstract: a processing-in-memory (pim) device includes processing elements (pes), memory banks, control logic, and a command decoder. each of the pes includes a selection circuit configured to select a path from among a transmission path of memory data, a transmission path of pim data for a multiply-accumulate (mac) operation, and a transmission path of an instruction for an internal processor. the memory banks are configured to store data corresponding to the pes. the control logic is configured to generate a selection signal configured to cause the selection circuit to select the path to a memory bank among the memory banks. the command decoder is configured to decode a memory command for the memory bank and the control logic.
20250190216. SYSTEMS METHODS DATA PLACEMENT IN-MEMORY-COMPUTE (Samsung Electronics ., .)
Abstract: according to one embodiment, a memory module includes: a memory die including a dynamic random access memory (dram) banks, each including: an array of dram cells arranged in pages; a row buffer to store values of one of the pages; an input/output (io) module; and an in-memory compute (imc) module including: an arithmetic logic unit (alu) to receive operands from the row buffer or the io module and to compute an output based on the operands and one of a plurality of alu operations; and a result register to store the output of the alu; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the dram banks in accordance with the data layout; and control an imc module to perform one of the alu operations on the operands in accordance with the instruction.
20250190295. ELECTRONIC APPARATUS METHOD CONTROLLING THEREOF (Samsung Electronics ., .)
Abstract: an apparatus including: a sensor to detect information indicating a status of the electronic apparatus; a memory storing (i) a first neural network model and a second neural network model, pre-trained to classify an error type of the electronic apparatus, and (ii) one or more instructions; and a processor operatively coupled to the memory and configured to execute the one or more instructions stored in the memory that causes the electronic apparatus to acquire first error type information and second error type information by inputting the information indicating the status of the electronic apparatus into each of the first neural network model and the second neural network model, check an error category of the electronic apparatus based on the first error type information and second error type information, and control an operation of the electronic apparatus based on the error category.
20250190298. METHOD COMPUTING DEVICE RESPONDING MEMORY FAIL (Samsung Electronics ., .)
Abstract: a method of operating a computing device includes performing a pre-boot memory test on a memory by a bios (basic input/output system), recording, in a log, memory fail information generated as a result of performing the pre-boot memory test by the bios, and performing a page offline operation using the memory fail information, after an operating system (os) of the computing device is installed.
20250190309. FAULT RESILIENT STORAGE DEVICE (Samsung Electronics ., .)
Abstract: a storage device, and a method for operating a storage device. in some embodiments, the storage device includes storage media, and the method includes: determining, by the storage device, that the storage device is in a first fault state from which recovery is possible by power cycling the storage device or by formatting the storage media; determining, by the storage device, that the storage device is in a second fault state from which partial recovery is possible by operating the storage device with reduced performance, with reduced capacity, or in a read-only mode; and operating the storage device with reduced performance, with reduced capacity, or in the read-only mode.
20250190329. SYSTEM METHOD DEBUGGING HARDWARE (Samsung Electronics ., .)
Abstract: a system and method for debugging in hardware. in some embodiments, the system includes a processor, the processor including: a first memory configured to store an instruction; and a second memory configured to store a breakpoint bit, for the instruction, the processor being configured to: determine that the breakpoint bit is set, and based on determining that the breakpoint bit is set, to report an error.
20250190338. MEMORY DEVICE METHOD OPERATING SAME (Samsung Electronics ., .)
Abstract: a memory device and a method of operating the same are provided. the memory device includes an operation module including a plurality of operators configured to perform a data operation, a register configured to store a plurality of pieces of data, and a selection module configured to receive an operation mode input and map the plurality of pieces of data stored in the register to the plurality of operators based on the operation mode input.
20250190340. STORAGE DEVICE OPERATING METHOD THEREOF (Samsung Electronics ., .)
Abstract: an example embodiment provides a storage device including: a non-volatile memory including a plurality of zones configured to sequentially store data using a write pointer indicating a position to write data; and a storage controller configured to receive a plurality of task requests respectively including a logical block address and a write command, and perform a write operation corresponding to the write command of a first task request among the plurality of task requests to the non-volatile memory in response to a position of the write pointer matching a first logical block address corresponding to the first task request.
Abstract: a method of operating a memory device including a memory cell array and a memory circuit includes receiving a first command from a controller, determining, in response to the first command, whether first device information stored in the memory circuit has an error, receiving, in response to the determining that the first device information has the error, a reset command from the controller, and performing a refresh operation on the memory circuit in response to the reset command. the first device information includes information about an operation parameter and an operating frequency of the memory device.
Abstract: a storage device, including: a nonvolatile memory device including a plurality of memory cells; and a controller configured to, based on receiving an open zone command from an external host device: based on a number of free erase units from among a plurality of erase units included in the plurality of memory cells being greater than a threshold value, allocate at least two free erase units to a first-type zone, and based on the number of the free erase units being smaller than or equal to the threshold value, allocate the at least two free erase units to a second-type zone, wherein the controller is further configured to permit a random write based on a random logical address received from the external host device for the first-type zone, and to permit a zone write based on a sequential logical address received from the external host device for the second-type zone.
20250190348. PROCESSOR ELECTRONIC DEVICE INCLUDING SAME (Samsung Electronics ., .)
Abstract: a processor and an electronic device including the same are provided. the processor includes a first cache including a first cell array and a first peripheral circuit, the first peripheral circuit being electrically connected to the first cell array; and a second cache including a second cell array and a second peripheral circuit, the second peripheral circuit being electrically connected to the second cell array and different from the first peripheral circuit, each of the first cell array and the second cell array including magnetic random-access memory (mram) cells.
20250190356. SMART STORAGE DEVICE (Samsung Electronics ., .)
Abstract: a smart storage device is provided. the smart storage device includes a smart interface connected to a host device. an accelerator circuit is connected to the smart interface through a data bus conforming to a cxl.cache protocol and a cxl.mem protocol. the accelerator circuit is configured to perform acceleration computation in response to a computation command of the host device. a storage controller is connected to the smart interface through a data bus conforming to a cxl.io protocol. the storage controller is configured to control a data access operation for a storage device in response to a data access command of the host device. the accelerator circuit is directly accessible to the storage device through an internal bus connected directly to the storage controller.
Abstract: a memory device may include a first main memory configured to store an address mapping table, at least one second main memory configured to store data received from a host device, and a memory controller configured to, compressively convert a host physical address set received from the host device into a device physical address set indicating a range of physical addresses in the at least one second main memory associated with the host physical address set, generate at least one address mapping table entry based on the device physical address set, the at least one address mapping table entry associated with at least one device physical address subset associated with the device physical address set, and store the at least one address mapping table entry in the address mapping table of the first main memory.
20250190361. MEMORY DEVICE SYSTEM PERFORMING ADDRESS TRANSLATION (Samsung Electronics ., .)
Abstract: a memory system includes a host and a memory device. the host is configured to translate a virtual address into first physical address based on a first page size and issue a memory access request including the first physical address. the memory device is configured to receive the memory access request from the host, translate the first physical address into a second physical address based on a second page size that is smaller than the first page size in response to the memory request, and access memory cells using the second physical address.
Abstract: a smart memory module includes at least one memory device connected to at least one channel, a controller configured to control the at least one memory device, and a host interface circuit configured to perform peer-to-peer (p2p) communication with an external device, and to receive, from a host device, a live migration request. the controller is configured to perform, in response to the live migration request, a migration operation of transmitting buffer data to a target device through the p2p communication under a buffer-full condition.
Abstract: a computer system including a home node having global shared memory and remote nodes configured to access the global shared memory. the home node contains a modification tracker entry and a timestep count entry associated with each cache block. the home node is configured to: set a timestep counter value in the timestep count entry; modify a word in one of the cache blocks in response to a first write operation from one of the remote nodes; set a first modification tracker value in response to the first write operation; modify a word in the one of the cache blocks in response to a second write operation from one of the remote nodes; set a second modification tracker value in response to the second write operation; and perform a violation check in response to a configuration status register value being equal to the timestep counter value.
Abstract: a memory expander, an electronic device including the memory expander, and a method of operating the electronic device are provided. the memory expander includes a controller configured to perform a compression operation on data received from outside of the memory expander to generate compressed data and generate mapping data including a device physical address for the compressed data, and a first memory device including a volatile memory that is connected to the controller through a first channel and includes a first mapping data region where the mapping data is stored and a first compressed data region where the compressed data is stored.
Abstract: an apparatus may include a die including at least one circuit configured to receive a first byte mapped to a first lane of two or more lanes of a die-to-die system, receive a second byte mapped to a second lane of the two or more lanes of the die-to-die system, transmit, using one lane of the two or more lanes of the die-to-die system, a portion of the first byte, and transmit, using the one lane of the two or more lanes of the die-to-die system, a portion of the second byte. the one lane of the two or more lanes of the die-to-die system may be the first lane of the two or more lanes of the die-to-die system. the one lane of the two or more lanes of the die-to-die system may be a third lane of the two or more lanes of the die-to-die system.
Abstract: an apparatus may include a first device including at least one first die including a first interface, a memory media configured to store first information received using the first interface, and a compute element configured to perform, using the first information, a compute operation, and a second device including at least one second die including a second interface configured to receive second information, and a third interface coupled to the first interface and configured to send the first information, wherein the first information may be based on the second information. the at least one second die may include a second memory media configured to store at least a portion of the second information, and a second compute element configured to perform, using the at least a portion of the second information, a second compute operation.
Abstract: provided are systems, methods, and apparatuses for artificial intelligence query processing by processing-near-memory storage. in one or more examples, the systems, devices, and methods include receiving, at a first processing-near-memory (pnm) storage device, data and processing, at the first pnm storage device, first values from the data with transposed query values from the data. in one or more examples, the systems, devices, and methods include determining, at the first pnm storage device, a probability distribution of a result of the processing and generating, at the first pnm storage device, an activation value based on the probability distribution, the activation value indicating a correlation between units of text in a query associated with the data.
20250190481. SYSTEMS METHODS INFORMATION RETRIEVAL (Samsung Electronics ., .)
Abstract: provided are systems, methods, and apparatuses for systems and methods of memory efficient multi-vector information retrieval based on embeddings from a storage pipelined network. in one or more examples, the systems, devices, and methods include performing a first portion of a nearest neighbor search on a first subset of a set of media sources; performing a fetch process on the first subset that include identifying a first set of highest matching media sources from the first subset, transferring multi-vector representations of the first set of highest matching media sources from a storage drive to a memory, and performing a second ranking of the first set highest matching media sources. the systems, devices, and methods include performing, in parallel with the fetch process, a second portion of the nearest neighbor search on a second subset of the set of media sources.
Abstract: a matrix multiplication device including a weight memory circuit, an input matrix buffer, a first processing element array and a second processing element array is provided. the weight memory circuit stores a first pruned sub-matrix and a second pruned sub-matrix. the input matrix buffer receives an input matrix including a plurality of input elements, outputs a first plurality of input elements corresponding to a first plurality of residual weights of the first pruned sub-matrix, and outputs a second plurality of input elements corresponding to a second plurality of residual weights of the second pruned sub-matrix. the first processing element array receives the first plurality of residual weights and the first plurality of input elements, and outputs a first sub-output matrix. the second processing element array receives the second plurality of residual weights and the second plurality of input elements, and output a second sub-output matrix.
20250190631. SYSTEM METHOD VERIFYING DATA TRANSMISSION (Samsung Electronics ., .)
Abstract: a system and method for verifying data transmission. in some embodiments, a system includes: a memory, and a hashing circuit, wherein the hashing circuit is configured to calculate a hash value based on a received data set, the received data set being included in one or more received memory write commands.
Abstract: a method implemented on a computer and for simulating performance of a semiconductor device model includes, for the semiconductor device model, establishing a carrier distribution function that represents the distribution of carriers, obtaining a scattering term based on geometric scattering of the carriers, for the carrier distribution function, calculating a solution of the multi-subband boltzmann transport equation (msbte) that includes the scattering term, and outputting a performance value of the semiconductor device model corresponding to the solution of the msbte. geometric scattering of the carriers is scattering in a region where a shape of a cross-section of the semiconductor device taken in a direction perpendicular to a first direction changes.
Abstract: an apparatus and method for analyzing dynamic voltage drops in an integrated circuit are disclosed. the method includes providing a gate-level netlist including registers and combinational gates; identifying a first register bus included in a plurality of register buses, the first register bus comprised of one or more of the registers included in the netlist; determining whether a complexity of a first group of combinational gates forming at least one timing path associated with a first bit in the first register bus is less than or equal to a first threshold; assigning the first group of combinational gates to a first group of cells; assigning the first group of cells into a first bus group associated with the first register bus in response to the complexity of the first group of combinational gates being less than or equal to the first threshold; and providing the first bus group to a dynamic voltage drop analysis tool.
20250190671. DESIGN METHOD SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a method of designing a semiconductor device includes generating input data defining an integrated circuit, generating, based on the input data, layout data in which at least some selected standard cells among a plurality of standard cells stored in a library are disposed and connected, and analyzing timing of the integrated circuit using the layout data. the library stores physical information and timing information of each of the plurality of standard cells and, for at least one standard cell, first timing information generated from a first layout context, and second timing information generated from a second layout context having an area of an interconnection pattern smaller than an area of an interconnection pattern of the first layout context, are stored in the library. the second timing information, which is different from the first timing information, is applied to at least one selected standard cell among the selected standard cells.
Abstract: a language model updating method, performed by an electronic device includes, acquiring a first training sequence including at least one of text used for training or a token sequence corresponding to the text used for training; extracting a first general knowledge representation of the first training sequence using a first language model; using a second language model to extract a second general knowledge representation of the first training sequence and determine a plurality of prediction results corresponding to the first training sequence; and updating the second language model based on the first general knowledge representation, the second general knowledge representation, and the plurality of prediction results, wherein each of the first general knowledge representation and the second general knowledge representation include at least one of language patterns or semantic relationships, extracted from the first training sequence.
Abstract: an electronic device includes a processing-in-memory (pim) controller and pim configured to perform a pim operation in response to a pim request generated by the pim controller. the pim controller is configured to perform a non-linear function (nlf) operation among a plurality of requested operations, generate a pim request for the pim operation, and transmit the pim request to the pim.
Abstract: an example image processing method includes performing an image processing operation with respect to a plurality of input data stored in an input data buffer. based on performing the image processing operation being finished, an interrupt signal is transmitted. the interrupt signal indicates that the image processing operation with respect to the plurality of input data has been finished.
Abstract: a display device is disclosed. the display device may include a communication interface, a display, and at least one processor connected to the communication interface and the display and controls the display device, wherein at least one processor, individually and/or collectively, may be configured to, on receiving a first pattern image from an electronic device through the communication interface, control the display to display the first pattern image, on receiving a control signal from the electronic device through the communication interface, control the display to display a single-color image based on the control signal, and on receiving correction information for correction of the uniformity of the display device from the electronic device through the communication interface, control the display to display content based on the correction information.
20250191134. ELECTRONIC DEVICE METHOD PROCESSING IMAGE INCLUDING TEXT (Samsung Electronics ., .)
Abstract: an electronic device may comprise: at least one processor, comprising processing circuitry, and at least one camera. at least one processor, individually and/or collectively, may be configured to: acquire a plurality of images through at least one camera; generate a first image using the plurality of images; identify a character area in the first image based on identifying that the plurality of images is related to text; generate a second image in which the character area in the first image is enhanced; and generate an output image by blending the character area in the first image and a character area in the second image based on text attributes of the character area in the first image.
20250191146. GENERATIVE ADVERSARIAL NETWORKS TRANSFORMER-BASED DEHAZING (Samsung Electronics ., .)
Abstract: methods and systems for performing image dehazing, including: obtaining an input image; estimating a transmission map by providing the input image to a dehazing transformer model, wherein the dehazing transformer model is trained by performing a training process on a cyclic generative adversarial network (gan) comprising the dehazing transformer model; and generating an output image based on the transmission map, wherein an amount of haze included in the output image is less than an amount of haze included in the input image.
Abstract: a method for correcting a blur in media, may include: receiving an input image indicating a degraded document comprising text regions and non-text regions; generating a blur localization map from the input image to detect a presence of a plurality of blur regions in the text regions and the non-text regions; estimating a degree of blur in the text regions of the plurality of blur regions by generating a text blur estimation map, to deblur the text regions based on a corresponding level of degradations; and generating a blur attention map by fusing the blur localization map and the text blur estimation map to output a location and a strength of the blur in the text regions.
Abstract: disclosed are a method and system for generating suggestions to enhance illumination in a video stream including receiving one or more image frames corresponding to the video stream, identifying, based on the one or more image frames corresponding to the video stream, an object in focus and a corresponding position of the object, identifying one or more light characteristics surrounding the identified object in focus to identify a position of at least one light source illuminating the identified object in focus, identifying one or more frame quality features associated with the video stream based on at least one of the position of the object in focus or the position of the at least one light source, and identifying one or more adjustment parameters corresponding to the one or more frame quality features for generating suggestions for the user to enhance illumination of the identified object in focus in the video stream.
Abstract: a method includes obtaining a high dynamic range (hdr) image and generating low dynamic range (ldr) images based on the hdr image, where at least some of the ldr images are associated with different exposure levels. the method also includes generating tone-type weight maps based on the ldr images, where at least one of the ldr images is associated with two or more of the tone-type weight maps. the method further includes generating blending weights for the ldr images based on the tone-type weight maps, where the blending weights for at least one of the ldr images are based on at least two tone-type weight maps associated with at least two of the ldr images.
20250191158. INDOOR IMAGE QUALITY EVALUATION METHOD IMAGE SENSOR (Samsung Electronics ., .)
Abstract: an indoor image quality evaluation method includes a) setting an imaging scenario and capturing a master image, b) moving an imaging robot to an imaging position of the master image, c) matching the field of view of an image sensor s to the field of view of the master image, d) adjusting an imaging environment for a subject by using an adjustable light, e) capturing an image to be evaluated, by using the image sensor s, and f) evaluating the image to be evaluated by determining whether the image is of acceptable or unacceptable quality based on a degree of similarity between the image to be evaluated and the master image.
Abstract: an electronic device is provided. the electronic device includes memory storing one or more computer programs, and one or more processors communicatively coupled to the memory. the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to identify, based on an input to synthesize frames obtained based on a first period, information indicating a motion included in at least one of frames, obtain, based on identifying at least one light source from at least one of the frames based on the information, an image representing a motion of the at least one light source between the frames, by synthesizing the frames based on the motion of the at least one light source, and obtain, based on identifying a motion of an external object different from the at least one light source based on the information, an image with respect to the frames by synthesizing one or more frames sampled from the frames based on a second period longer than the first period.
Abstract: a method may include: obtaining at least one semantic parameter associated with the image; segmenting the at least one object based on the at least one semantic parameter to generate a first segmented object and a second segmented object; identifying a camera level of the electronic device; applying a ground mesh to the image based on the camera level; determining placements of the first segmented object and the second segmented object based on the at least one semantic parameter associated with the first segmented object, the second segmented object, and the ground mesh; determining a relative position of the first segmented object with respect to the second segmented object based on the determined placement of the first segmented object and the second segmented object; and displaying the at least one object on a screen of the electronic device based on the determined relative position.
20250191223. ELECTRONIC DEVICE METHOD VOXEL KEY POINT DETERMINATION (Samsung Electronics ., .)
Abstract: a processor-implemented method includes determining either one or both of a first voxel and a first key point of point cloud data, and by performing feature transformation on either one or both of the first voxel and the first key point through a neural network, determining either one or both of a second voxel and a second key point of the point cloud data, wherein a voxel feature of the first voxel is different from a voxel feature of the second voxel, a key point feature of the first key point is different from a key point feature of the second key point, and either one or both of the second voxel and the second key point are used for training of the point cloud data.
20250191247. METHOD SYNTHESIZING IMAGE, ELECTRONIC DEVICE SUPPORTING SAME (Samsung Electronics ., .)
Abstract: an example electronic device may include a camera module, a display module, and at least one processor, wherein the at least one processor, individually or collectively, is configured to identify one or more objects in a first image; determine, based on pixel values of regions corresponding respectively to the identified one or more objects, at least one map associated with the pixel values of first regions in the first image; generate a second image based on at least one among metadata of the first image, user input for determining the composition of the second image, and a three-dimensional model; change pixel values of at least some regions in the second image corresponding to the first regions, based on the at least one map that has been determined; obtain a third image by synthesizing a second image in which pixel values in the second regions in the first image have been changed; and display the third image, through the display module.
20250191255. METHOD DEVICE MAP BUILDING (Samsung Electronics ., .)
Abstract: disclosed are a map-building method, a map-building apparatus, an electronic device, and a non-transitory computer-readable storage medium, which relate to the field of artificial intelligence (ai). the map-building method includes generating a heat map based on first curves used to identify a map element of at least one local area and obtaining second curves using an ai network, based on the heat map, in which the second curves are used to identify a map element of the map, and the map-building method transforms a global map-building problem into a collective prediction problem and performs prediction based on image detection using the heat map as an input so that various cases are handled in an integrated manner, and the excessive use of a threshold value is avoided, thereby having excellent versatility.
20250191264. METHOD ELECTRONIC DEVICE DISPLAYING PARTICULAR USER (Samsung Electronics ., .)
Abstract: a method and electronic device for displaying particular user are provided. the method includes capturing, using a camera, one or more input image frames including the user, determining pixels associated with the user, extracting a plurality of features of the user, weighting each of the features based on an amount of information corresponding each of the plurality of features, generating identity information for the user based on the weighted plurality of features, determining whether the generated identity information matches with at least one identity information stored in a database, and displaying the plurality of pixels associated with the user when the generated identity information matches with the at least one identity information in the database.
20250191269. METHOD ELECTRONIC DEVICE RENDERED IMAGE GENERATION (Samsung Electronics ., .)
Abstract: a processor-implemented method includes generating a first rendered image having a first resolution by inputting target position information for a target viewpoint into a first model for a target object comprised in a three-dimensional (3d) scene, determining one or more reference images for the first rendered image from among a plurality of first images, wherein the plurality of first images is generated based on a plurality of original images in which the target object is captured from a plurality of different viewpoints, each of the plurality of original images has a second resolution, and each of the plurality of first images has the first resolution lower than the second resolution, and generating a second rendered image having the second resolution by inputting the first rendered image, the reference image, the target position information, and reference position information for the reference image into a second model.
Abstract: provided are an image processing circuit, a system-on-chip including the same, and a method of improving quality of a first image. the image processing circuit includes a tuning circuit configured to receive a segmentation map including pixel-by-pixel class inference information of the first image and a confidence map including confidence of the class inference information, determine classes of respective pixels of the first image, correction effects for each pixel of the image, and correction values indicating intensity of the correction effects based on the segmentation map and the confidence map, and generate a correction map based on the classes and the correction values of the respective pixels; and at least one correcting circuit configured to generate an enhanced image by applying correction effects according to the correction values to the respective pixels of the first image based on the correction map.
20250191341. METHOD APPARATUS TRAINING POINT CLOUD FEATURE PREDICTION (Samsung Electronics ., .)
Abstract: a processor-implement method includes masking at least a part of voxel data obtained from a point cloud to generate masked voxels, obtaining feature information about the masked voxels from unmasked voxels, which are not masked, through a backbone network, extracting a prediction feature vector from the feature information through a feature prediction model, determining a parameter of a teacher module based on a parameter of the backbone network, extracting a masking feature vector for the masked voxels through the teacher module, and training the backbone network by updating the parameter of the backbone network based on a similarity between the prediction feature vector and the masking feature vector.
20250191343. DEVICE METHOD DETECTION OBJECTS IMAGES (Samsung Electronics ., .)
Abstract: a method performed by an electronic device includes: obtaining an image captured by a sensor; detecting, in the image, a static object region corresponding to a static object of the image, wherein the detecting is performed by applying an object detection model to the image; determining whether to collect the image as part of a training dataset based on an accuracy level of the detected static object region; and determining a ground truth static object region for the static object of the image from space-occupancy information of the static object with respect to the image collected as part of the training dataset.
20250191386. METHOD APPARATUS OBJECT DETECTION (Samsung Electronics ., .)
Abstract: an object detection method including extracting voxel features of valid cells from voxel data corresponding to a point cloud obtained using a depth sensor, and generating object detection data using a transformer-based model for object detection based on the extracted voxel features, the valid cells including cells among a plurality of cells, included in the voxel data that includes point data, and a cell among the plurality of cells that does not include corresponding point data is not a valid cell.
20250191387. NATURAL LANGUAGE 3D DATA SEARCHING (Samsung Electronics ., .)
Abstract: a method includes incorporating information from multi-modal embeddings in an indexed point-cloud data structure with three-dimensional (3d) spatial information for a captured scene. the method also includes performing at least one of querying or retrieving 3d-point-cloud data based on a user input including at least one of natural language or image references. the method also includes enabling global scene understanding and local scene understanding using instance segmentation in conjunction with the multi-modal embeddings.
Abstract: a method includes obtaining, using at least one processing device of an electronic device, a sequence of images of a scene. the method also includes performing, using the at least one processing device, instance segmentation of the sequence of images to generate a sequence of segmented images. performing the instance segmentation includes (i) segmenting each of the images into semantic classes and (ii) separately identifying two or more objects in the scene associated with a common semantic class, where different semantic classes are associated with different types of image contents. the method further includes processing, using the at least one processing device, the sequence of segmented images to generate a final image of the scene. the sequence of segmented images is processed using one or more image processing operations determined using a natural language processing (nlp) engine.
20250191503. ELECTRONIC DEVICE OPERATION METHOD THEREOF (Samsung Electronics ., .)
Abstract: provided is an electronic device including: a projector, a memory storing one or more instructions, and at least one processor, comprising processing circuitry, individually and/or collectively, configured to execute the one or more instructions stored in the memory and to: obtain modeling information corresponding to a projection space from modeling information about a surrounding space, obtain projection object content by correcting a shape of standard object content, based on the modeling information corresponding to the projection space, determine an action of the projection object content, based on the modeling information corresponding to the projection space, and project, through the projector, projection content including the projection object content performing the determined action, onto the projection space.
20250191510. ELECTRONIC DEVICE CONTROLLING METHOD THEREOF (Samsung Electronics ., .)
Abstract: an example electronic device may include a display, memory storing a plurality of sample images and at least one processor configured to receive a control command for outputting a third gradation value which is greater than a preset first gradation value and less than a preset second gradation value, identify a sample image corresponding to the third gradation value from among the plurality of sample images, and control the display to display the identified sample image, and the sample image includes a first frame including a plurality of pixels arranged based on first arrangement information and a second frame including a plurality of pixels arranged based on second arrangement information, the first arrangement information and the second arrangement information include a position of a first type pixel corresponding to the first gradation value and a position of a second type pixel corresponding to the second gradation value, and the third gradation value is an average value of the a gradation value of the first frame and a gradation value of the second frame.
Abstract: an electronic device is provided. the electronic device includes memory storing one or more computer programs and a plurality of token sets corresponding to respective multiple emotions, and one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to, based on receiving a reference speech, identify an emotion corresponding to the reference speech among the plurality of emotions, obtain a token set corresponding to the identified emotion from among the plurality of token sets stored in the memory, input information on the reference speech and the obtained token set into a style encoder and obtain style information for outputting a synthesized speech of the identified emotion, based on a text being input, input the text into a decoder obtained on the basis of the style information and obtain a synthesized speech corresponding to the text, and output the synthesized speech corresponding to the text.
20250191593. Audio Codec Bitrate Using Directional Loudness (Samsung Electronics ., .)
Abstract: in one embodiment, a method includes accessing a window of audio that includes audio signals. the method further includes determining, for each of the audio signals, a power of that signal relative to a reference audio signal; determining, for each of the audio signals and based on the determined relative power of that signal, a gain to apply to the audio signal relative to the reference audio signal, where the gain depends on frequency and on directionality relative to a listener; and encoding the audio so that bandwidth is allocated based on directionality relative to the listener by allocating an amount of bandwidth to each of the audio signals based on their respective frequency-dependent and directionality-dependent determined gains.
20250191630. MEMORY DEVICE OPERATING METHOD MEMORY DEVICE (Samsung Electronics ., .)
Abstract: a memory device includes a bank that includes a plurality of rows, each row including memory cells and a set of count cells configured to store count data associated with the number of times each of the plurality of rows is accessed, and a row hammer management circuit configured to manage the count data of each row of the plurality of rows of the bank, and reset the count data corresponding to each row of the plurality of rows, in response a normal refresh operation being performed.
Abstract: a memory device includes at least one bank including memory cells, and a register corresponding to the at least one bank. the bank includes a plurality of rows that are arranged in a row direction, and a plurality of count cells, each of which stores count data associated with the number of times of access of each of the plurality of rows. the register stores an address and count data, which are associated with at least one row among the plurality of rows.
Abstract: a memory device includes a bank including memory cells. the bank includes rows arranged in a row direction, count cells, each storing row hammer count data associated with a number of times a corresponding row of the rows is accessed, and extended count cells, each storing information about one or more of extended row hammer count data associated with the number of times the corresponding row of the row is accessed or a number of times a row hammer refresh operation is executed on the corresponding row of rows.
20250191644. MEMORY DEVICE (Samsung Electronics ., .)
Abstract: a memory device comprises a cell chip including a memory cell array having a plurality of first lines and a plurality of second lines, first and second bonding pads adjacent to each other in a first region and electrically connected to the plurality of first lines, and third and fourth bonding pads adjacent to each other in a second region different from the first region and electrically connected to the plurality of second lines, and a logic chip electrically connected to the first, second, third, and fourth bonding pads of the cell chip. the first and second bonding pads are electrically connected to a third line among the plurality of first lines, and the third and fourth bonding pads are electrically connected to fourth and fifth lines among the plurality of second lines, respectively.
20250191648. MEMORY DEVICE METHOD OPERATING SAME (Samsung Electronics ., .)
Abstract: a memory device includes a bank comprising a plurality of memory cells connected to a plurality of wordlines and a plurality of column selection lines, a row hammer management circuit performing a read-modify-write (rmw) operation on count memory cells to read count data corresponding to an activated wordline among the plurality of wordlines, wherein the plurality of memory cells include the count memory cells configured to store the count data representing a number of access to the activated wordline, updating the read count data, and writing the updated count data in the count memory cells, and a control logic selecting a first count column selection line connected to the count memory cells from among the plurality of column selection lines based on writing characteristics of each of the plurality of column selection lines.
20250191657. STORAGE DEVICES METHODS OPERATING STORAGE DEVICES (Samsung Electronics ., .)
Abstract: a storage device, including a nonvolatile memory device and a storage controller configured to control the nonvolatile memory device. the nonvolatile memory device includes a memory cell array including a plurality of word-lines stacked on a substrate, a plurality of memory cells provided in a plurality of channel holes, and a word-line cut region dividing the plurality of word-lines into a plurality of memory blocks. the storage controller groups a plurality of target memory cells into outer cells and inner cells. the storage controller includes an error correction code (ecc) decoder configured to perform an ecc decoding operation by obtaining outer cell bits and inner cell bits during a read operation on the plurality of target memory cells, and applying different log likelihood ratio (llr) values to the outer cell bits and the inner cell bits.
Abstract: a memory device includes a memory cell array, a plurality of page buffer units connected to the memory cell array and connected in common to a combined sensing node, and a plurality of cache latches respectively corresponding to the plurality of page buffer units, the plurality of cache latches including a first cache latch and a second cache latch connected in common to the combined sensing node. in a first section of a data dumping operation on the first cache latch, first and second tri-state inverters included in the first cache latch are enabled to transmit data to the first cache latch, and third and fourth tri-state inverters included in the second cache latch are disabled. in a second section of the data dumping operation on the first cache latch, the third and fourth tri-state inverters are sequentially enabled to restore data previously stored in the second cache latch.
Abstract: a memory device may include a memory module including a memory cell array and a plurality of input/output circuits and a test logic circuit configured to perform a self-test on the memory module, wherein the test logic circuit may include a pattern generator configured to generate a pattern of the memory cell array including diagonal patterns with interval corresponding to a second value i based on a first value d, and i=2.
20250191753. Multi-Modal Insomnia Detection Using Wearable Device (Samsung Electronics ., .)
Abstract: in one embodiment, a method includes detecting, by each of multiple sensors of a wearable device worn by a user, corresponding insomnia-related signals during at least a predetermined duration; determining, for each of the insomnia-related signals, a set of insomnia-indicating signals by comparing each insomnia-related signal to a corresponding threshold; and determining, by a trained machine-learning model and based on the determined sets of insomnia-indicating signals, an insomnia condition of the user.
Abstract: a neutral beam and extreme ultraviolet (euv) light-generating device capable of generating euv light while generating a neutral beam. the neutral beam and euv light-generating device includes: an ion beam source configured to generate an ion beam and to output the ion beam in a first direction, a first electron beam source configured to generate a first electron beam incident on the ion beam, a second electron beam source configured to generate and output a second electron beam, and a first electromagnetic control device configured to control a traveling direction of the second electron beam to cause the second electron beam to collide head-on with the ion beam to generate a neutral beam and euv light.
Abstract: provided is a semiconductor device. the semiconductor device comprises a first active pattern extending in a first direction on a substrate, a second active pattern which extends in the first direction and is adjacent to the first active pattern in a second direction different from the first direction, a field insulating film placed between the first active pattern and the second active pattern, a first gate structure which crosses the first active pattern, extends in the second direction, and includes a first gate electrode and a first gate spacer, a second gate structure which crosses the second active pattern, extends in the second direction, and includes a second gate electrode and a second gate spacer, a gate separation structure placed on the field insulating film between the first gate structure and the second gate structure.
20250191960. SUBSTRATE PROCESSING APPARATUS (Samsung Electronics ., .)
Abstract: a substrate processing apparatus is provided. a substrate processing apparatus comprising a body portion, a substrate arrangement portion disposed on the body portion, a bonding portion disposed between the substrate arrangement portion and the body portion, connecting the substrate arrangement portion with the body portion, a first hole installed in the substrate arrangement portion, having a first diameter, a second hole installed in the bonding portion, having a second diameter larger than the first diameter, a first edge band installed in the second hole and installed to be in contact with a lower surface of the substrate arrangement portion, a side surface of the bonding portion, and an upper surface of the body portion and a lifting pin installed to extend through the first hole, the second hole and the first edge band.
Abstract: provided are a substrate stage inspection method and/or a semiconductor device manufacturing method using the same, in which a particle on a substrate stage is more accurately detected and tilt abnormality of the substrate stage is inspected. the substrate stage inspection method includes receiving data from a database (db), calculating a tilt of a substrate stage by using the data, adjusting the data such that an effect of the tilt is reduced, detecting a particle on the substrate stage based on the adjusted data, and inspecting tilt abnormality of the substrate stage.
20250191983. ELECTRONIC COMPONENT PACKAGE (Samsung Electronics ., .)
Abstract: provided is an electronic component package including a substrate including an insulating layer, a wiring layer including a first connection pad and a second connection pad, a protection layer disposed on the insulating layer and having an opening exposing at least a portion of each of the first connection pad and the second connection pad, and at least one protruded structure disposed on the protection layer; an electronic component disposed on the substrate and including a first electrode electrically connected to the first connection pad and a second electrode electrically connected to the second connection pad; and a molding material disposed on the substrate to mold the electronic component; wherein the protruded structures include a first protruded structure supporting the first electrode and a second protruded structure supporting the second electrode.
20250191986. SEMICONDUCTOR PACKAGES INCLUDING MOLDING GUIDE PATTERNS (Samsung Electronics ., .)
Abstract: a semiconductor package includes a package substrate, a lower molding guide pattern disposed over the package substrate and including a first portion and a second portion, a semiconductor chip disposed over an upper surface of the package substrate and over an upper surface of the first portion of the lower molding guide pattern, an upper molding guide dam over the second portion of the lower molding guide pattern, and a molding layer covering a side surface of the semiconductor chip and extending between the package substrate and a lower surface of the semiconductor chip, wherein the upper molding guide dam is disposed laterally with respect to the semiconductor chip.
20250191991. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a package substrate, an interposer on the package substrate, electrically connected to the package substrate, a first chip structure including a first semiconductor chip, first microbumps electrically connecting the first semiconductor chip to the interposer, and a first underfill portion on the interposer and respectively covering the first microbumps, a second chip structure including a second semiconductor chip spaced apart from the first semiconductor chip, second microbumps electrically connecting the second semiconductor chip to the interposer, and a second underfill portion on the interposer and respectively covering the second microbumps, a dam structure on the interposer and surrounding at least a portion of each of the first and second underfill portions, a buffer layer on the interposer, and covering at least portions of the dam structure, the first underfill portion, and the second underfill portion, and an encapsulant covering the buffer layer.
20250192006. INTEGRATED CIRCUIT DEVICE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: provided is an integrated circuit device and method of manufacturing same, the integrated circuit device including: a substrate including a memory cell area and a peripheral circuit area around the memory cell area; a cell transistor in the memory cell area; a peripheral circuit transistor in the peripheral circuit area; a capacitor structure including a lower electrode on the cell transistor, a dielectric film on a surface of the lower electrode, and an upper electrode on the dielectric film; a stacked plate structure covering the capacitor structure; and an interlayer insulating film covering the stacked plate structure in the memory cell area and covering the peripheral circuit transistor in the peripheral circuit area, wherein the stacked plate structure includes: a first plate layer including doped silicon germanium (sige); a middle layer conformally covering the first plate layer and including a metal silicide (mxsiy) including a metal (m); and a second plate layer conformally covering the middle layer and including the metal (m) of the metal silicide.
20250192012. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package including a redistribution line structure; a semiconductor chip on a first surface of the redistribution line structure; an under-bump structure that on a second surface of the redistribution line structure opposite to the first surface, the under-bump structure including a passivation layer and a conductive pattern layer; an electronic component above the under-bump structure; and an underfill member filling a space between the under-bump structure and the electronic component. the conductive pattern layer is spaced apart from one side surface of the electronic component in plan view and includes a bleeding prevention pattern. the bleeding prevention pattern includes at least one dam region that blocks the underfill member bleeding from the one side surface of the electronic component. the passivation layer includes at least one trench adjacent to the at least one dam region.
Abstract: a wiring substrate and semiconductor package including a protection layer, an under-bump pad including an upper part disposed on a top surface of the protection layer and a lower part penetrating the protection layer, a dielectric pattern disposed on the protection layer, and a conductive pattern disposed on the dielectric pattern. the lower part of the under-bump pad is exposed on a bottom surface of the protection layer, and the under-bump pad includes a recess region directed into a bottom surface of the under-bump pad from a top surface of the under-bump pad. the dielectric pattern covers a portion of the under-bump pad and fills the recess region. the conductive pattern includes a pad part disposed on a top surface of the dielectric pattern and a via part that vertically penetrates the dielectric pattern and is coupled to the top surface of the under-bump pad.
20250192015. INTERPOSER SEMICONDUCTOR PACKAGE INCLUDING SAME (Samsung Electronics ., .)
Abstract: an interposer including a base layer, a redistribution structure on a first surface of the base layer and including a conductive redistribution pattern, a first lower protection layer on a second surface of the base layer, a lower conductive pad on the first lower protection layer, a through electrode connecting the conductive redistribution pattern and the lower conductive pad, a second lower protection layer on the first lower protection layer, including a different material than the first lower protection layer, and contacting at least a portion of the lower conductive pad, and an indentation formed in an outer edge region of the interposer to provide a continuous angled sidewall extending entirely through the second lower protection layer and through at least a portion of the first protection layer.
20250192016. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package comprises a first redistribution substrate including first interconnection layers sequentially stacked on each other, a semiconductor chip mounted on the first redistribution substrate, a mold layer disposed on the first redistribution substrate and surrounding the semiconductor chip, a second redistribution substrate disposed on the mold layer and including second interconnection layers sequentially stacked on each other, a connection terminal disposed beside the semiconductor chip to connect the first and second redistribution substrates to each other, and outer terminals disposed on a bottom surface of the first redistribution substrate. each of the first and second interconnection layers may include an insulating layer and a wire pattern in the insulating layer. the first redistribution substrate may have substantially the same thickness as the second redistribution substrate, and the first interconnection layers may be thinner than the second interconnection layers.
Abstract: an interposer including a first redistribution structure; a device stack structure on the first redistribution structure, the device stack structure including a first device die and a second device die on the first device die, and each of the first device die and the second device die including one or more integrated stack capacitor structures; a plurality of first connection members on the first redistribution structure; a molding material on the first redistribution structure, the molding material covering the device stack structure and the plurality of first connection members; and a second redistribution structure on the molding material.
Abstract: an interposer is provided. the interposer includes a first redistribution structure; a device die on the first redistribution structure, the device die having a first surface facing the first redistribution structure and a second surface which is opposite to the first surface; a plurality of first connection members on the second surface of the device die; an insulating member disposed on the second surface of the device die and covering first portions of side surfaces of the plurality of first connection members; a plurality of second connection members on the first redistribution structure; a molding material disposed on the first redistribution structure and covering each of the device die, second portions of the side surfaces of the plurality of first connection members, the insulating member, and the plurality of second connection members; and a second redistribution structure on the molding material.
20250192021. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: according to an example embodiment, provided is a semiconductor package, including: a package substrate including a plurality of wiring layers and a plurality of insulating layers covering a portion of the plurality of wiring layers and a semiconductor chip mounted on the package substrate. at least a first insulating layer, among the plurality of insulating layers, comprises a first insulating member filling first and second regions and wherein a second insulating member filling a third region. the first region has a first wiring layer, among the plurality of wiring layers, and has first sides corresponding to edges of the package substrate and second sides between the first sides corresponding to corners of the package substrate. the second region is disposed between the first sides of the first region and the edges of the package substrate. the third region is disposed between the second sides of the first region and the corners of the package substrate.
20250192029. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes lower conductive patterns on a substrate and horizontally spaced apart from each other, upper conductive patterns on the lower conductive patterns and horizontally spaced apart from each other, and a first via contact and a second via contact between the lower and upper conductive patterns and horizontally spaced apart from each other. the first via contact has a first width in a direction parallel to a top surface of the substrate. the second via contact has a second width in the direction that is wider than the first width. the second via contact includes a first metal pattern and a second metal pattern on the first metal pattern. the first metal pattern includes a same material as the first via contact, and the second metal pattern includes a different material from the first metal pattern and the first via contact.
20250192031. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes: a lower wiring including: a lower filling film, which extends in a first direction and includes a first portion having a first width in the first direction and a second portion, having a second width smaller than the first width in the first direction, on the first portion; and a lower barrier film which is disposed on a side wall and a bottom surface of the first portion, and is not disposed on a side wall of the second portion in a cross-sectional view of the first direction; and an upper wiring structure including: an upper via connected to the lower wiring; and an upper wiring extending in a second direction intersecting the first direction on the upper via, wherein the upper wiring structure further includes an upper barrier film, and an upper filling film in a trench defined by the upper barrier film, each of the upper via and the upper wiring comprises the upper barrier film and the upper filling film, and the upper via is not separated from the upper wiring by the upper barrier film, and is separated from the second portion of the lower filling film by the upper barrier film.
Abstract: a semiconductor chip with a dual chip-pad structure includes a chip body, a first chip-pad disposed on a first edge of a top surface of the chip body and a second edge of the top surface of the chip body, and a second chip-pad disposed along the second direction at a central portion of the top surface between the first edge of the top surface of the chip body and the second edge of the top surface of the chip body in the first direction. the second edge of the top surface is opposite to the first edge of the top surface in a first direction. the first chip-pad is disposed along a second direction perpendicular to the first direction. the first chip-pad includes a first signal pad coupled with the second chip-pad.
20250192036. SEMICONDUCTOR DEVICES (Samsung Electronics ., .)
Abstract: a semiconductor device including a first insulating structure on a substrate and including a first etch stop layer and a first interlayer insulating layer on the first etch stop layer, a second insulating structure on the first insulating structure and including a second etch stop layer and a second interlayer insulating layer on the second etch stop layer, a conductive line penetrating through the second insulating structure, and extending in a first direction parallel to an upper surface of the substrate, and a plurality of contacts penetrating through the first insulating structure and connected to the conductive line may be provided. the conductive line may include a protrusion extending below the second insulating structure and penetrating through the first interlayer insulating layer to be in contact with the first etch stop layer.
20250192040. SEMICONDUCTOR DEVICE METHOD FABRICATING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device may include a substrate, a lower power line buried in the substrate and extended in a first direction parallel to a bottom surface of the substrate, a source/drain pattern on the substrate, and a backside contact structure provided to penetrate the substrate and electrically connect the lower power line to the source/drain pattern. the backside contact structure may include a backside via pattern and a backside conductive contact, which are sequentially provided on the lower power line. a side surface of the backside conductive contact may be convex in an outward direction from an inner portion of the backside conductive contact toward an outside. a width of the backside conductive contact in the first direction may be the largest at a first level and may increase as a distance from the source/drain pattern increases in a direction toward the first level.
20250192042. INTEGRATED CIRCUIT DEVICE INCLUDING METAL WIRING LAYER (Samsung Electronics ., .)
Abstract: an integrated circuit device includes: a lower insulating film arranged on a substrate; a lower metal wiring layer passing through the lower insulating film; an upper insulating film arranged on the lower insulating film and the lower metal wiring layer; an upper metal wiring layer arranged on the upper insulating film; and a conductive contact plug passing through the upper insulating film in a vertical direction and disposed between the lower metal wiring layer and the upper metal wiring layer, wherein a first center of an uppermost portion farthest from the substrate, of the conductive contact plug, is shifted in a first direction, which is parallel to a main surface of the substrate, from a second center of a lowermost portion closest to the substrate, of the conductive contact plug.
20250192050. SEMICONDUCTOR MEMORY DEVICE (Samsung Electronics ., .)
Abstract: an example semiconductor memory device includes a first substrate, a first interlayer insulating layer covering the first substrate, a second substrate disposed on the first interlayer insulating layer, a second interlayer insulating layer covering an active surface of the second substrate, a third interlayer insulating layer covering an inactive surface of the second substrate, a power delivery network pattern disposed in the third interlayer insulating layer, an inner penetration via, a first outer penetration via, and a second outer penetration via. the inner penetration via extends through the second substrate and connects transistors with the power delivery network pattern. the first outer penetration via extends through at least one of the second interlayer insulating layer, the second substrate, and the third interlayer insulating layer. the second outer penetration via extends through the second interlayer insulating layer, the second substrate, and the third interlayer insulating layer.
20250192053. INTERCONNECT STRUCTURE, ELECTRONIC DEVICE INCLUDING SAME (Samsung Electronics ., .)
Abstract: an interconnect structure including a dielectric layer; a conductive wiring including a first cobalt-metal alloy within a trench structure of the dielectric layer; and a cobalt-containing auxiliary layer between the conductive wiring and the dielectric layer, wherein the cobalt-containing auxiliary layer includes cobalt or a second cobalt-metal alloy.
20250192060. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package according to example embodiment may include: a lower substrate including a lower wiring layer; an upper substrate disposed on the lower substrate and including an upper wiring layer; a first semiconductor chip having a lower surface disposed between an upper surface of the lower substrate and a lower surface of the upper substrate and electrically connected to the lower wiring layer; a second semiconductor chip disposed on the lower substrate to be spaced apart from the first semiconductor chip in a first direction and electrically connected to the lower wiring layer; and a third semiconductor chip disposed on the upper substrate and electrically connected to the upper wiring layer, wherein the upper substrate may include a through-hole exposing at least a portion of the first semiconductor chip.
20250192071. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a package body including a connection member having a first surface and a second surface opposite the first surface, and at least one semiconductor chip on the first surface of the connection member, a connection terminal on the second surface of the connection member, and connected to the at least one semiconductor chip through the connection member, and at least one magnet in the package body, the at least one magnet arranged to correspond to a warpage profile of the package body and configured to correct warpage of the package body by applying a force to the package body in response to an external magnetic field applied to the semiconductor package.
20250192082. SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS (Samsung Electronics ., .)
Abstract: a semiconductor package includes a first semiconductor chip including a substrate, a second semiconductor chip disposed on the first semiconductor chip, a conductive connector disposed between the first and second semiconductor chips, wherein the conductive connector electrically connects the first and second semiconductor chips with each other and a bonding layer disposed between the first and second semiconductor chips, wherein the bonding layer bonds the first and second semiconductor chips with each other and covers an upper sidewall of the conductive connector. the first conductive connector includes a first conductive pattern disposed at a lower portion of a trench on the substrate and includes a first metal, a second conductive pattern extending on the first conductive pattern in a vertical direction substantially perpendicular to an upper surface of the substrate and extending through an upper portion of the first conductive pattern and including a second metal and a third conductive pattern disposed between the first and second conductive patterns and contacts the first and second conductive patterns and including both the first and second metals.
20250192083. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package may include a semiconductor substrate defining a trench extending in a vertical direction from an upper surface of the semiconductor substrate, an insulating layer on the semiconductor substrate, a first through electrode penetrating the semiconductor substrate, a bonding pad in the trench, and a second through electrode. a first surface of the bonding pad may be in contact with the first through electrode and a second surface of the bonding pad, may be in contact with the second through electrode in contact. the second through electrode may be apart from the insulating layer in a horizontal direction. the vertical direction may be perpendicular to the upper surface of the semiconductor substrate. the first surface and second surface of the bonding pad may be opposite each other.
20250192085. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a logic die having a first planar area, a cache memory die on the logic die and having the first planar area, a main memory die stack structure on the cache memory die and including main memory dies stacked in a vertical direction and having a second planar area smaller than the first planar area, and a mold on the cache memory die and covering sidewalls of the main memory dies.
20250192086. CHIP-ON-FILM PACKAGE DISPLAY APPARATUS INCLUDING SAME (Samsung Electronics ., .)
Abstract: a chip-on-film (cof) package includes a semiconductor chip comprising a plurality of external connection pads for connecting to outside of the semiconductor chip; a conductive portion electrically connected to the plurality of external connection pads; a base film attached to a lower end of the conductive portion and having an upper surface and a lower surface opposite each other; and a protective layer covering the conductive portion on the upper surface of the base film. the protective layer covers sidewalls and a lower surface of the semiconductor chip, and the conductive portion comprises a plurality of conductive lines disposed on the upper surface of the base film, and a plurality of via structures formed integrally with the plurality of conductive lines and electrically connected to the plurality of external connection pads.
20250192094. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a package substrate, an encapsulation structure stacked on the package substrate, a plurality of conductive bumps disposed between the package substrate and the encapsulation structure, and an adhesive layer attaching the package substrate and the encapsulation structure to each other. the encapsulation structure includes a sealing member having an upper surface and a lower surface opposite to each other, a plurality of semiconductor chips sequentially arranged in the sealing member such that a front surface on which chip pads are formed faces the package substrate, and conductive wires extending from a lower surface of the sealing member to the chip pads of the plurality of semiconductor chips. the plurality of conductive bumps are disposed between the conductive wires and substrate pads of the package substrate.
20250192107. SYSTEMS METHODS HIGH BANDWIDTH MEMORY CONFIGURATIONS (Samsung Electronics ., .)
Abstract: provided are systems, methods, and apparatuses for high bandwidth memory configurations. in one or more examples, the systems, devices, and methods include positioning a first memory physical layer (phy) interface on a surface of a compute die and connecting a first memory to the first memory phy interface of the compute die via a first through-silicon via (tsv) connection. the systems, devices, and methods include connecting a second memory to a base die that connects to the compute die via a silicon interposer, positioning the compute die on the silicon interposer, and positioning the base die on the silicon interposer.
Abstract: a semiconductor package includes an interconnection chip between a first chip stack and a second chip stack, the interconnection chip including interconnection vias electrically connecting the first through-vias and the second through-vias to each other. the interconnection chip has a first surface in contact with the first chip stack, a second surface in contact with the second chip stack, and a third surface between the first surface and the second surface. the third surface of the interconnection chip includes a first portion extending from the first surface of the interconnection chip at a first inclination, and a second portion extending from the first portion to the second surface of the interconnection chip at a second inclination lower than the first inclination.
20250192109. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package includes a buffer die, memory die stack structures sequentially stacked on the buffer die in a vertical direction, each of which includes a base core die and middle core dies stacked on the base core die in the vertical direction, a first mold layer on the base core die of each of the memory die stack structures and on sidewalls of the middle core dies, and a second mold layer on the buffer die, on sidewalls of the base core dies, and on a sidewall of the first mold layer. the buffer die has a first planar area, the base core die has a second planar area smaller than the first planar area, and each of the middle core dies has a third planar area smaller than the second planar area.
Abstract: provided is a semiconductor device including a substrate including a through via, a first redistribution layer on a first surface of the substrate, a second redistribution layer on a second surface, opposite to the first surface, of the substrate, a semiconductor chip on a second surface of the second redistribution layer, and one or more capacitors included in at least one of the substrate, the first redistribution layer, and the second redistribution layer.
20250192127. SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE (Samsung Electronics ., .)
Abstract: disclosed is a semiconductor package comprising a connection substrate, a first processor chip on the connection substrate, a second processor chip on the connection substrate, a memory chip stack structure on the first processor chip, and a bridge structure on the first processor chip and the second processor chip. the bridge structure electrically connects the first processor chip and the second processor chip. the first processor chip includes a first through via that overlaps the memory chip stack structure.
20250192129. SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE SPACER (Samsung Electronics ., .)
Abstract: a semiconductor package includes: a base substrate; a first spacer disposed on the base substrate; a composite spacer disposed on the base substrate and laterally spaced apart from the first spacer; a plurality of first semiconductor chips stacked on the composite spacer; and a plurality of second semiconductor chips stacked on the first spacer, wherein a portion of the composite spacer includes a first device region, wherein a remaining portion of the composite spacer includes a buffer region, wherein the first device region includes a semiconductor device, wherein the buffer region does not comprise a semiconductor device, and the first spacer does not comprise a semiconductor device.
20250192131. SEMICONDUCTOR PACKAGE (Samsung Electronics ., .)
Abstract: a semiconductor package may include a first redistribution layer, a passive device disposed on a top surface of the first redistribution layer, a bridge structure disposed on the top surface of the first redistribution layer and laterally spaced apart from the passive device, a second redistribution layer disposed on and electrically connected to the passive device and the bridge structure, conductive structures disposed between the first redistribution layer and the second redistribution layer and laterally spaced apart from the passive device and the bridge structure, a first semiconductor chip mounted on a top surface of the second redistribution layer, and a second semiconductor chip mounted on the top surface of the second redistribution layer. the conductive structures may include a signal structure and a ground/power structure, which is laterally spaced apart from the signal structure and has a width larger than the signal structure.
20250192227. AMORPHOUS NITROGEN-RICH SOLID STATE LITHIUM ELECTROLYTE (Samsung Electronics ., .)
Abstract: a lithium ion conductor includes a compound of formula 1:
Abstract: an electronic device, according to one embodiment, may comprise: a housing comprising a plurality of side surfaces comprising a conductive part used for communication with an external electronic device; a printed circuit board in the housing; and a flexible printed circuit board comprising a first region making contact with the printed circuit board, a second region arranged on the conductive part, and a third region extending from the first region to the second region. the flexible printed circuit board may comprise: a first outer surface; a second outer surface opposite from the first outer surface; a plurality of layers between the first outer surface and the second outer surface; and a second conductive via arranged in the second region. the second conductive via may comprise: a first part making contact with the first outer surface; a second part making contact with the conductive part by protruding from the second outer surface; and a third part extending from the first part to the second part.
20250192417. ANTENNA STRUCTURE ELECTRONIC DEVICE INCLUDING SAME (Samsung Electronics ., .)
Abstract: according to various embodiments of the present disclosure, an electronic device includes a first plate and a second plate that is disposed so that a first slot structure is formed between at least one part thereof and the first plate. the electric device further includes a non-metallic first inner member that is coupled to the first plate and the second plate, and is disposed so that at least one part thereof faces the first slot structure. the electronic device further includes a first antenna pattern that is disposed on a different part of the first inner member facing in the opposite direction to the at least one part of the first inner member. various other embodiments are possible.
20250192421. WEARABLE ELECTRONIC DEVICE INCLUDING ANTENNA (Samsung Electronics ., .)
Abstract: a wearable electronic device is disclosed, including: abridge; a first and second rim; a first and second glass; a first and second temple that are foldable, a first printed circuit substrate within the first temple and including a wireless communication module; an flexible printed circuit substrate electrically connected to the first pcb, disposed in the first rim, the bridge, and the second rim, and including a feed part and a ground; a conductive pattern disposed in the first rim, the bridge, and the second rim; and a conductive stub electrically connected to the conductive pattern, wherein the conductive pattern includes a first part electrically connected to the feed part and extending through the first rim, the bridge, the second rim, and the first rim, and a second part electrically connected to the ground, wherein the conductive stub includes a first part electrically connected to the feed part.
Abstract: a first electronic device includes a first interface, a dummy load connected to the first interface, a first battery connected to the first interface and the dummy load, and a controller connected to the dummy load, where the controller is configured to receive power from a second electronic device through the first interface, identify a state of charge (soc) of the second electronic device based on a packet received from the second electronic device through the first interface, and based on identifying that the soc of the second electronic device is larger than a predetermined value and that the first battery is fully charged, conduct a direct current (dc) having a predetermined magnitude to the dummy load.
Abstract: a wireless power transmission device is provided. the wireless power transmission device includes a power source, a first power amplifier configured to provide a first radio frequency (rf) signal based on a driving voltage provided from the power source, a transmission coil configured to be used to transmit power to an outside based on the first rf signal, a matching circuit configured to provide impedance matching between the transmission coil and the first power amplifier, and a bias circuit configured to provide a bias voltage to the matching circuit, wherein an input terminal of the bias circuit is connected to a first terminal of a first transistor included in the first power amplifier, wherein an output terminal of the bias circuit is connected to a second terminal of a second transistor included in the matching circuit, and wherein the bias circuit is configured to provide the bias voltage to the second terminal of the second transistor based on the first rf signal at the first terminal of the first transistor.
20250192644. DRIVING UNIT WEARABLE DEVICE (Samsung Electronics ., .)
Abstract: a driving unit of a wearable device (e.g., walking assist device) may include: an auxiliary frame capable of supporting a user's body so as to assist the body movement of a user; a motor housing capable of accommodating a motor capable of supplying power to the auxiliary frame; and a heat dissipation channel capable of discharging heat generated from the motor to the outside of the motor housing.
20250192677. VOLTAGE CONVERTER OPERATING METHOD VOLTAGE CONVERTER (Samsung Electronics ., .)
Abstract: disclosed is a conversion device that includes a first regulator converting an input voltage of an input node into a first output voltage in a first mode and providing the first output voltage to an output node, a second regulator converting the input voltage of the input node into a second output voltage in a second mode and providing the second output voltage to the output node, a first resistor and a second resistor connected in series between the output node and a ground node, and an error amplifier receiving a feedback voltage of a node between the first resistor and the second resistor and a reference voltage, amplifying a difference between the feedback voltage and the reference voltage to generate an error voltage, providing the error voltage to the first regulator in the first mode, and providing the error voltage to the second regulator in the second mode.
Abstract: an output driver includes: a selection circuit configured to selectively output either a first pull-up driving signal or a pulse signal, in response to a received first control signal, a first pull-up driver circuit configured to provide a first supply voltage to a first node electrically connected to a data pin, in response to the first pull-up driving signal or the pulse signal received from the selection circuit, a second pull-up driver circuit configured to provide a second supply voltage having a second level, which is less than or equal to a first level of the first supply voltage, to the first node, in response to a second pull-up driving signal, a first decoupling capacitor, and a capacitance optimization circuit configured to change a capacitance of a decoupling capacitor having a first terminal electrically connected to a third node to which the first supply voltage is applied.
Abstract: a analog-to-digital conversion circuit includes a plurality of time interleaved analog-digital converters (ti-adcs), a timing calibrator configured to calculate calibration values of the plurality of ti-adcs based on correlation values between target samples output from target ti-adcs and adjacent samples of adjacent ti-adcs in two respective cycles and output codes for calibrating time skews of the plurality of ti-adcs based on the calibration values and a plurality of calibration parameters, and a clock phase adjuster configured to adjust phases of a plurality of clock signals based on the codes.
Abstract: an adc circuit including: adcs to perform conversion operations in a time-interleaving manner; and a control logic circuit connected to the adcs, wherein the control logic circuit is configured to: calculate a correlation value between data output from the adcs a first number of times using a first number of bits among each bit of the data; calibrate a sampling timing of at least some of the adcs, based on a first cumulative correlation value, which is obtained by accumulating correlation values calculated the first number of times; calculate the correlation value between the data a second number of times by using a second number of bits in each of the data; and calibrate the sampling timing of the at least some of the adcs, based on a second cumulative correlation value, which is obtained by accumulating correlation values calculated the second number of times.
20250192803. SYSTEMS METHODS COMPRESSION ARTIFICIAL INTELLIGENCE (Samsung Electronics ., .)
Abstract: provided are systems, methods, and apparatuses for compression of artificial intelligence models. in one or more examples, the systems, devices, and methods include categorizing data based on an analysis of a distribution of the data, generating compressed data based on the data and on a compression algorithm that is selected based on the categorization, and storing the compressed data in a storage device. in one or more examples, the systems, devices, and methods include identifying an address associated with compressed data based on a request for the compressed data, determining a decompression algorithm based on the address, and decompressing the compressed data using the determined decompression algorithm.
Abstract: an operating method of a storage device, the storage device including a page type table, a parity table, and a non-volatile memory device, and the method including receiving a write request of first data from a host device, generating a first inside parity and a first outside parity, based on the first data, storing the first outside parity in the parity table, obtaining first reliability type information of a first page for storing the first data, by referring to the page type table, generating a first flexible parity, based on the first inside parity and the first reliability type information, generating first encoding data, based on the first data and the first flexible parity, and storing the first encoding data in the non-volatile memory device.
Abstract: an electronic device is disclosed. the electronic device includes: a plurality of antennas including a first antenna, a second antenna, a third antenna, and a fourth antenna. the electronic device includes first up-converting circuitry including a first input terminal configured to obtain a first signal on a baseband, a first output terminal configured to output a first radio frequency (rf) signal having a first phase, a second output terminal configured to output the first rf signal having a second phase, and a third output terminal configured to output the first rf signal having a third phase, the first rf signal being converted from the first signal. the first phase, the second phase, and the third phase are different from each other. the electronic device includes: second up-converting circuitry including a second input terminal configured to obtain a second signal on a baseband, a fourth output terminal configured to output a second rf signal having a fourth phase, a fifth output terminal configured to output the second rf signal having a fifth phase, and a sixth output terminal configured to output the second rf signal having a sixth phase, the second rf signal being converted from the second signal. the fourth phase, the fifth phase, and the sixth phase are different from each other.
Abstract: a method performed by an open radio access network (o-ran) distributed unit (o-du) in a wireless communication system, the method includes: generating a control plane message comprising user equipment (ue) scheduling information; and transmitting the control plane message to an open radio access network (o-ran) radio unit (o-ru). the control plane message further includes section extension information. the section extension information comprises bit masking information indicating antennas to be combined.
Abstract: the disclosure relates to a 5g or 6g communication system supporting a higher data transmission rate. a method includes: determining a plurality of physical characteristics associated with the ue for at least one of an indoor and/or outdoor environment; configuring a measurement process for at least one wireless communication channel based on the plurality of determined physical characteristics; generating a csi feedback based on the configured measurement process and a characteristic of the at least one wireless communication channel; applying the generated csi feedback to perform model inference with potential adjustments of one or more wireless communication parameters; determining the cqi based on the generated csi feedback and the configured measurement process; and applying the potential adjustments of the one or more wireless communication parameters of the ue to enhance the performance of the ue , based on the determined cqi and the plurality of determined physical characteristics.
Abstract: an operation method of a wireless communication device includes receiving initial reference signals based on sweeping of a first beam pair subset, the initial reference signals including first and second reference signals received via first and second reception beams, the first reception beams and the second reception beams being included in the first beam pair subset and having different polarizations, measuring first received powers of the first reference signals and second received powers of the second reference signals, determining a first beam pair for receiving first data based on the first received powers and the second received powers, updating the first beam pair subset based on the first received powers or the second received powers, determining a second beam pair for receiving second data based on received powers of new reference signals for the updated beam pair subset, and receiving the second data based on the second beam pair.
20250192899. MEASUREMENT CALIBRATION (Samsung Electronics ., .)
Abstract: apparatuses and methods for measurement for calibration. a method performed by a user equipment (ue) includes receiving information about k non-zero-power channel state information reference signals (nzp csi-rss), k>1, and a calibration report and measuring, based on the information, the k nzp csi-rss. the method further includes determining, based on the measurement, a calibration offset for each of the k nzp csi-rss and transmitting the calibration report including at least one indicator indicating the calibration offset for each of the k nzp csi-rss. each of the k nzp csi-rss is associated with a csi-rs port. the calibration offset corresponds to at least one of a delay offset (do), a frequency offset (fo), and a phase offset (po).
Abstract: an example method performed by a terminal in a wireless communication system may include receiving configuration information related to a control resource set (coreset), wherein the configuration information includes a coreset group identifier corresponding to each coreset; identifying a first coreset associated with a first coreset group and a second coreset associated with a second coreset group on the basis of the coreset group identifier; receiving downlink control information (dci) including a transmission configuration indicator (tci) field based on one of the first coreset and the second coreset; and, based on a codepoint of the tci field corresponding to multiple tci states, applying a first tci state among the multiple tci states to a channel associated with the first coreset, and applying a second tci state to a channel associated with the second coreset.
Abstract: a server device comprising a communication circuitry to receive user interface information from a controller of a home appliance, and transmitting the user interface information to a user terminal device; and a processor to convert the user interface information into an image based on a user input received from the user terminal device, and control the communication circuitry to transmit the image to the controller of the home appliance.
20250193051. METHOD PERFORMED NETWORK NODE NETWORK NODE (Samsung Electronics ., .)
Abstract: a method performed by a network node is provided. the method includes obtaining a first channel estimation value of a channel between the network node and a user equipment, by performing frequency-domain channel estimation based on a decorrelation signal related to reference signal symbols received from the user equipment, determining whether a channel type of the channel is a high-speed train channel, and in accordance with a determination that the channel type of the channel is the high-speed train channel adjusting frequency offset of the channel, and obtaining a second channel estimation value based on the adjusted frequency offset and the first channel estimation value.
Abstract: a method of operating an electronic device includes receiving, from a base station, a signal including a new radio physical downlink shared channel (nr pdsch) demodulation reference signal (dmrs), performing depatterning by multiplying the received signal by an orthogonal cover code (occ) matrix, calculating a compressed minimum mean square error (mmse) weight matrix, based on the received signal, restoring an original mmse weight matrix from the calculated compressed mmse weight matrix, and performing linear mmse (lmmse)-based channel estimation based on the original mmse weight matrix and the depatterned received signal.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for configuring artificial intelligence/machine learning (ai/ml) traffic transport in a wireless communications network is disclosed. the method comprising receiving, by a policy control function (pcf), from a unified data repository (udr), a notification of an update of ai/ml transport configuration information; determining, by the pcf, whether an ai/ml protocol data unit (pdu) session or a transport policy are impacted by the update; and notifying by the pcf, a session management function (smf) that a sm policy is updated, wherein the smf is configured to reconfigure the pdu session based on the updated sm policy.
Abstract: a method for controlling communication protocols within a network based on at least one smart contract, includes: executing the at least one smart contract to regulate communication between a set of devices in the network; based on an execution of the at least one smart contract: detecting one or more devices from the set of devices restricted to establish communication within the network; and enforcing one or more routing protocols, based on at least one of a term or a condition, which is specified in the at least one smart contract.
20250193118. CONGESTION CONTROL WIRELESS NETWORKS (Samsung Electronics ., .)
Abstract: a destination station (sta) in a wireless network, comprising: a memory; and a processor coupled to the memory, the processor configured to: receive, from a source sta via a router, a plurality of packets, the router being located between the destination sta and a source sta; determine a congestion prediction to the source sta based on packet arrival times of the plurality of packets; compare the congestion prediction with a first threshold; generate a congestion prediction signal based on the comparison, wherein the congestion prediction signal indicates an operation mode of the source sta; and transmit, to the source sta via the router, the congestion prediction signal.
20250193158. HOMOMORPHIC ENCRYPTION OPERATION METHOD DEVICE (Samsung Electronics ., .)
Abstract: provided is a homomorphic encryption (he) operation method. the he operation method includes receiving an encrypted input query hyperdimensional vector (hv) from a client based on an he technique, performing a hyperdimensional computing process including a similarity search operation on the encrypted input query hv, and transmitting a result of the hyperdimensional computing process to the client.
Abstract: according to various embodiments, an electronic device comprises: memory storing instructions; and at least one processor, comprising processing circuitry, connected to the memory. the instructions, when executed by at least one processor individually and/or collectively, may cause the electronic device to: receive a user credential through a first authentication application running in a secure area, and perform a user authentication procedure in the first authentication application in the security area on the basis of the user credential; control the first authentication application in the security area to issue an access token based on the user authentication procedure being successfully completed in the first authentication application within the security area; and transmit the access token issued by the first authentication application in the security area to an external electronic device through a second authentication application running in a non-secure area.
20250193336. IMAGE PROJECTION DEVICE METHOD OPERATING SAME (Samsung Electronics ., .)
Abstract: the disclosure relates to an image projection device and method that corrects an image to be projected onto multiple surfaces forming a defined angle considering a viewing position. the image projection device may output an image to be projected onto a projection area including an image display area where an image is to be substantially displayed in a projection surface including at least two surfaces bent at a defined angle with respect to a corner. the image projection device may receive a control signal for changing a view point of viewing the projection area from a remote control device and update pixel values of the image to be projected, corresponding to projection points of the projection area in response to the control signal.
20250193353. ELECTRONIC APPARATUS CONTROL METHOD THEREOF (Samsung Electronics ., .)
Abstract: an electronic apparatus includes: a video projector; a first sensor; a second sensor; a memory configured to store one or more instructions; and at least one processor, comprising processing circuitry, operatively connected to the video projector, the first sensor, the second sensor, and the memory. at least one processor, individually and/or collectively, is configured to execute the one or more instructions and is configured to: acquire projection distance information to a projection surface based on sensing data acquired through the first sensor, acquire illuminance information based on the sensing data acquired through the second sensor, acquire gain information for each region included in the projection surface based on the projection distance information and the illuminance information, correct the gain information for each region based on correlation information between the projection distance information and image quality information and correlation information between the illuminance information and the image quality information, acquire an output video by correcting the input video based on the corrected gain information for each region, and control the video projector to project the output video onto the projection surface.
Abstract: an electronic apparatus is provided. the electronic apparatus includes: a projector configured to project an image with a specified resolution, a camera, and at least one processor, comprising processing circuitry, connected to the projector and the camera and configured to control the electronic apparatus, wherein at least one processor, individually and/or collectively, is configured to: perform keystone correction for a first image, control the projector to project an image of the specified resolution in which the keystone-corrected first image is included in one area and a second image is included in a remaining area to a projection area, obtain a captured image by photographing the projection area and an external area of the projection area through the camera, adjust a pixel value of the second image based on first pixel information corresponding to the remaining area in the captured image and second pixel information corresponding to the external area of the projection area, and control the projector to project an image of the specified resolution in which the keystone-corrected first image is included in the one area and the second image with the adjusted pixel value is included in the remaining area to the projection area.
Abstract: an electronic device includes: a base panel; a layer panel; memory storing at least one instruction; and at least one processor, wherein the at least one instruction, when executed by the at least one processor, causes the electronic device to: obtain a first frame image in a first frame and a second frame image in a second frame before the first frame, generate a base image corresponding to the base panel in the first frame and a layer image corresponding to the layer panel in the first frame and based on a motion between the first frame image and the second frame image, generate a corrected base image based on the motion between the first frame image and the second frame image, and display the corrected base image on the base panel and display the layer image on the layer panel.
Abstract: an example wearable electronic device may include glass; a display which displays a virtual object through the glass; a first sensor disposed in a first region of the wearable electronic device; a second sensor disposed in a second region of the wearable electronic device; a memory; and at least one processor, wherein the memory stores at least one instruction which, when executed, causes the wearable electronic device to control the display to display a virtual object at a first location through the glass; acquire movement information of the first region through the first sensor and acquire movement information of the second region through the second sensor; and control the display to display the virtual object at a second location different from the first location based on the movement information of the first region and the movement information of the second region.
Abstract: an image decoding method includes obtaining, second feature data from a bitstream for first feature data of a current image, obtaining quantization data and probability data by applying the second feature data to a neural network, modifying the probability data, based on sample values of the quantization data, obtaining quantized first feature data by applying entropy decoding, based on the modified probability data, on bits included in the bitstream, obtaining dequantized first feature data by dequantizing the quantized first feature data based on the sample values of the quantization data, and reconstructing the current image by performing neural network-based decoding on the dequantized first feature data. the first feature data having been obtained by performing neural network-based encoding on the current image.
Abstract: an image decoding method may include: receiving a bitstream generated as a result of encoding an image sequence; obtaining, from a sequence parameter set of the bitstream, a first tool set index indicating a tool allowed to decode the bitstream among a plurality of tools; obtaining, from the sequence parameter set, tool flags based on the tool flags, identifying a tool that has been used to encode the image sequence among the plurality of tools; and reconstructing the image sequence based on the identified tool, wherein values of the tool flags are set according to a value of the first tool set index.
20250193484. REFRIGERATOR CONTROLLING METHOD THEREOF (Samsung Electronics ., .)
Abstract: a refrigerator includes a main body including a storage compartment, at least one door coupled to the main body to open or close the storage compartment, a display configured to display content, the at least one door having the display, a door sensor configured to detect whether the at least one door is opened or closed, and a processor configured to determine whether the content being played on the display is a stop target in response to detecting that the at least one door is opened; pause the content being played in response to determining that the content being played is the stop target, and resume playing the paused content from a paused point in response to detecting that the at least one door closed.
20250193497. ELECTRONIC APPARATUS OPERATING METHOD THEREOF (Samsung Electronics ., .)
Abstract: an electronic apparatus identifies a representative genre of a content, based on information about the content; performs at least one of video image quality control or audio sound quality control on the content by setting at least one of video image quality or audio sound quality for playing the content to a preset value, based on the identified representative genre; identifies a partial genre of the content, based on analysis of a scene including at least one of a video frame or an audio frequency corresponding to at least a part of the content played; and performs at least one of the video image quality control or the audio sound quality control on the content by assigning a weight to the preset value, based on the identified partial genre.
20250193505. OVEN ADJUSTABLE BRIGHTNESS OVEN OPERATION METHOD THEREOF (Samsung Electronics ., .)
Abstract: an oven includes a cooking chamber, a camera configured to obtain an image of an inside of the cooking chamber, at least one lamp disposed adjacent to the camera, one or more processors comprising processing circuitry, and a memory storing one or more instructions. the one or more instructions, when executed by the one or more processors individually or collectively, cause the oven to obtain, from the camera, an exposure value according to an automatic exposure (ae) operation of the camera, compare the obtained exposure value with a preset reference exposure value, and adjust a brightness level of the at least one lamp so that the obtained exposure value corresponds to the preset reference exposure value, based on a result of comparing the obtained exposure value with the preset reference exposure value.
20250193506. CAMERA MODULE ELECTRONIC APPARATUS INCLUDING SAME (Samsung Electronics ., .)
Abstract: a camera module according to an embodiment may comprise: a lens; an image sensor configured to convert light incident through the lens into an electrical signal and comprises a connection pad; and a printed circuit board electrically connected to the image sensor. the printed circuit board may comprise: a plurality of layers; and a first via penetrating at least some of the plurality of layers. the connection pad and the first via may be electrically connected to each other by a wire.
Abstract: an electronic device includes: a camera; a first conductive pattern separated from the camera by a first distance; a second conductive pattern separated from the camera by a second distance, the second distance; and a communication processor to transmit a data signal to an external electronic device and to receive a control signal from the external electronic device. the communication processor transmits a first data signal to the external electronic device by controlling the first conductive pattern and the second conductive pattern in a first time period indicated by the control signal transmitted from the external electronic device; transmits a second data signal to the external electronic device by controlling the second conductive pattern in a second time period; and adjust a strength of the first data signal to be lower than a preset strength.
20250193533. FLICKER CORRECTION METHOD ELECTRONIC DEVICE THEREFOR (Samsung Electronics ., .)
Abstract: a control method of an electronic device includes: acquiring an image of a subject device; detecting a flickering phenomenon from the image; attempting to establish a communication connection with the subject device; in a state in which the communication connection with the subject device is successful, requesting display information from the subject device; receiving the display information from the subject device; and adjusting, by the subject device, a scan rate of a display based on the display information.
20250193546. IMAGE SENSOR (Samsung Electronics ., .)
Abstract: an image sensor comprises a row driver, a first row line which is connected to the row driver, first to fourth pixels connected to the first row line, first to fourth column lines connected to the first to fourth pixels and configured to receive respective first to fourth output signals from the first to fourth pixels, a boosting circuit connected to the first to fourth column lines, a second row line connected to the boosting circuit, first and second boosting drivers connected, respectively, to first and second terminals of the second row line. the boosting circuit may adjust voltage of the first and second output signals based on a first boosting enable signal received from the first boosting driver and may adjust a voltage of the third and fourth output signals based on a second boosting enable signal received from the second boosting driver.
20250193551. UNIT PIXEL IMAGE SENSOR INCLUDING SAME (Samsung Electronics ., .)
Abstract: a unit pixel includes a first photoelectric conversion unit configured to generate first charges in response to a first incident light, a first transfer transistor connected between the first photoelectric conversion unit and a first node, a connecting transistor connected between a second node and the first node, a second photoelectric conversion unit configured to generate second charges in response to a second incident light, a second transfer transistor connected between a second photoelectric conversion unit and a third node, a switch transistor connected between the third node and the second node, a source follower connected to the first node, a selection transistor connected to the source follower, an overflow transistor connecting the first photoelectric conversion unit and a power supply voltage, and a comparator configured to turn on the overflow transistor.
20250193565. WEARABLE ELECTRONIC DEVICE COMPRISING SPEAKER MODULE (Samsung Electronics ., .)
Abstract: a wearable electronic device according to an embodiment includes a housing including a front member that faces a first direction, a rear member that faces a second direction opposite to the first direction, and a side member that surrounds a space between the front member and the rear member, a display disposed inside the housing and viewable through the front member, and a speaker module accommodated in the housing and coupled to an inner surface of the rear member. the speaker module includes a speaker frame including first coupling parts coupled to the rear member, a speaker unit including a magnet, a voice coil, and a diaphragm, and a yoke that includes second coupling parts coupled to the rear member and that is coupled to one surface of the magnet to surround at least a portion of an outer surface of the speaker frame.
20250193566. SPEAKER ASSEMBLY ELECTRONIC DEVICE COMPRISING SAME (Samsung Electronics ., .)
Abstract: an electronic device is provided. the electronic device includes a foldable housing including a hinge, a first housing coupled to the hinge, and a second housing coupled to the hinge and foldable relative to the first housing about the hinge, a first display supported by the first housing, and a second display supported by the second housing, wherein the second housing includes a first display support member configured to support the first display, a second display support member configured to support the second display, and a speaker assembly coupled between the first display support member and the second display support member with sealing members to define a speaker volume.
20250193569. WEARABLE ELECTRONIC DEVICE COMPRISING MICROPHONE MODULE (Samsung Electronics ., .)
Abstract: a wearable electronic device is provided. the wearable electronic device includes a housing including a first surface facing an outside of the wearable electronic device, a second surface opposite to the first surface, and a microphone hole formed between the first surface and the second surface, a support disposed on the second surface and including a microphone chamber at least partially facing the microphone hole, an antenna structure positioned on the second surface, a connecting member disposed on the second surface and including a first connection area electrically connected to the antenna structure and a second connection area extending from the first connection region and disposed on the support, and microphone disposed on the second surface and configured to obtain an external sound of the wearable electronic device through the microphone hole and the microphone chamber.
Abstract: an electronic device for controlling audio settings of an audio device, based on contextual information of an image, and an operation method thereof, may be provided. the electronic device may detect at least one object from an image captured via a camera; identify a main object of interest to a user, from among the at least one object that is detected; obtain context information of the main object of interest; and control, based on the obtained context information, audio settings of the audio device for obtaining or outputting an audio signal, the audio device including at least one from among a microphone and a speaker.
20250193603. ELECTRONIC APPARATUS INCLUDING PLURALITY SPEAKERS (Samsung Electronics ., .)
Abstract: a foldable electronic apparatus according to various embodiments of the disclosure may comprise: a foldable housing having a plurality of sub-housings and at least one hinge and folds and unfolds; a foldable display disposed on a first surface, oriented in a first direction, of the foldable housing and folds and unfolds according to the folding and unfolding of the foldable housing; a plurality of speakers arranged in at least two of the plurality of sub-housings of the foldable housing and configured to output multi-channel sound having a plurality of audio channels; and a sound processor electrically connected to each of the plurality of speakers. the sound processor may be configured to detect the folding state of the foldable housing, calculate the respective relative positions of the plurality of speakers based on the folding state, and control the electronic apparatus to output the plurality of audio channels to the plurality of speakers, respectively, on the basis of the calculated respective relative positions of the plurality of speakers.
20250193605. ELECTRONIC DEVICE METHOD OUTPUTTING SOUND (Samsung Electronics ., .)
Abstract: an electronic device including a speaker array including a plurality of speaker units, a memory and one or more processors. the plurality of speaker units include a plurality of tweeter units that output high-range sound signals of a critical frequency or above and a plurality of mid-range units that output low-range and mid-range sound signals below the critical frequency. the one or more processors are configured to execute the at least one instruction to control the plurality of tweeter units to, by using a beaming forming method for high-range sound signals, directionally output right (r) channel signals toward a right ear of a user and directionally output left (l) channel signals toward a left ear of the user, and control the plurality of mid-range units to, by using a psychoacoustic model for the low-range and mid-range sound signals, output the r-channel signals and the l-channel signals.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method and an apparatus for providing a dual subscriber identity module (sim) function even in a terminal with a single embedded universal integrated circuit card (euicc) mounted are provided. a method and an apparatus for installing, activating, and managing a plurality of profiles are provided, so that even a terminal with a single euicc mounted may provide a dual sim function in a communication system. the method includes the following embodiments to achieve the foregoing aspect, a method in which an euicc receives a command involving a profile state change from a local profile assistant (lpa), registers a proactive command, and notifies a modem of logical interface information for obtaining the proactive command, a method in which the euicc determines whether to perform polling on a specific logical interface by combining predetermined information, such as the logical interface information received from the mode, the state of a logical interface collected and possessed by the modem, and the number of an interface on which a corresponding message is received, and a method in which the modem receives and processes the proactive command by performing polling on the logical interface.
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). a handover method for a terminal according to one embodiment of the present disclosure may include: receiving, from a source cell, a message including information on one or more target cells for performing a fast handover; and performing a fast handover by reusing a radio bearer based on the received information.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to various embodiments of the disclosure, a method performed by an electronic device may include: identifying a chs group (chg) event including a connected hybrid stream (chs) event; identifying at least one subevent included in the chs event; transmitting a data packet within a period of a first subevent among the at least one subevent; and receiving a feedback signal based on the data packet within the period of the first subevent.
Abstract: a method performed by the base station in a wireless communication system according to various embodiments of the present disclosure may comprise: in case that a packet data control protocol (pdcp) service data unit (sdu) is unable to be delivered from a pdcp layer to a lower layer, storing the pdcp sdu in a buffer; in case that the size of the pdcp sdu stored in the buffer is equal to or greater than a preconfigured threshold capacity, including information indicating a tcp congestion situation in a field within the header of a first transmission control protocol (tcp) acknowledgement (ack) transmitted by a terminal to a server; transmitting, to the server, a second tcp ack including information indicating the tcp congestion situation; and receiving, from the server, a tcp packet including information indicating that the tcp congestion situation has been identified.
Abstract: a 5-generation (5g) or 6-generation (6g) communication system for supporting higher data rates after the 4-generation (4g) communication system, such as long term evolution (lte) is provided. a method performed by a session management function (smf) in a wireless communication system is provided. the method includes configuring capacity information of a user plane function (upf) based on at least one of information regarding a control message processing capability of the upf or resource status information regarding control message processing, and controlling a flow of control messages to be transmitted to the upf based on the capacity information of the upf.
Abstract: a method for handling network access during by a user equipment (ue) in a wireless communication system, may include: identifying an initiation of a handover from a 3gpp network to a non-3gpp network; determining whether the handover is initiated during an ongoing call at the ue, or an always-on packet data unit (pdu) session at the ue; suspending at least one suspended real-time transport protocol (rtp) packet on the 3gpp network to prevent transmission of at least one service request to the 3gpp network during the handover based on the handover being initiated during the ongoing call at the ue, and configuring a status of the always-on pdu session as inactive for the 3gpp network to prevent the transmission of the at least one service request to the 3gpp network during the handover based on the handover being initiated during the always-on pdu session at the ue.
20250193754. SATELLITE SWITCH MOBILITY (Samsung Electronics ., .)
Abstract: the disclosure provides a method performed by a user equipment (ue) in a wireless network. the ue receives, from a base station, a configuration associated with a satellite switch. the ue performs the satellite switch with re-synchronization from a source satellite to a target satellite based on the configuration. the ue generates a satellite switch completion indication. the ue transmits, to the base station, the satellite switch completion indication. the satellite switch completion indication is generated based on a determination that uplink synchronization is obtained for the target satellite due to the satellite switch with re-synchronization.
20250193756. SEAMLESS ROAMING WIRELESS NETWORKS (Samsung Electronics ., .)
Abstract: a station (sta) in a wireless network, comprising a memory and a processor coupled to the memory, the processor configured to: transmit, to a first access point (ap) via a first link, a first frame that requests a switch from the first ap to a second ap, wherein the first ap and the second ap form a seamless roaming domain and the first link is established between the sta and the first ap; receive, from the first ap, a second frame that includes information for communicating with the second ap, wherein the second link is established between the sta and the second ap; and switch to the second ap using the information for communicating with the second ap.
Abstract: provided in the present disclosure are a method and a device for providing a service to a user device by using a network slice in a communication system. a method according to one embodiment of the present disclosure can comprise the steps of: receiving, from a second network function device, management function configuration information about a first core network slice, including the quota of a first core network slice; reporting status information about the first core network slice to a third network function device on the basis of the management function configuration information; receiving, from the third network function device, parameters for controlling the status of the first core network slice; and controlling access of a terminal that is to use the first core network slice, on the basis of the status information about the first core network slice and the parameters for control.
20250193790. POWER SAVING OPERATIONS RELAY NETWORKS (Samsung Electronics ., .)
Abstract: a first station (sta) in a wireless network, comprising a memory and a processor coupled to the memory, the processor configured to transmit, to a second sta, a first frame that requests the second sta operate as a relay node that relays communication between the first sta and a third sta; receive, from the second sta, a second frame that accepts the request in the first frame; transmit, to the second sta, a third frame that includes a request for a setup of a target wake time (twt) schedule or a twt agreement between the first sta and the second sta; receive, from the second sta, a fourth frame that accepts the request in the third frame; and transmit, to the third sta via the second sta, one or more frames based on the twt schedule or the twt agreement established between the first sta and the second sta.
Abstract: a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes transmitting, to a base station, capability information indicating that a wake-up receiver (wur) is supported at the ue, receiving configuration information regarding a synchronization signal for the wur or a wake-up signal (wus) via master information block (mib) or system information block (sib), based on the capability information, identifying a bandwidth part (bwp) indicated by the configuration information, and receiving the synchronization signal for the wur or the wus on the identified bwp.
20250193806. ELECTRONIC DEVICE INTEGRATED CONTROL METHOD MLO TAS (Samsung Electronics ., .)
Abstract: an electronic device is provided. the electronic device includes at least one wireless communication circuitry configured to transmit and receive wireless signals, memory storing one or more computer programs, and one or more processors communicatively coupled to the at least one wireless communication circuitry and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to verify a time-averaged specific absorption rate (sar) (tas) backoff regulation value allocated to a multi-link operation (mlo) for a time window, and based on the tas backoff regulation value, determine a link combination to be used during the time window, and wherein the link combination has a highest total data throughput sum among link combination candidates each comprising links used in the mlo.
20250193808. POWER HEADROOM REPORTING WIRELESS COMMUNICATIONS SYSTEMS (Samsung Electronics ., .)
Abstract: a ue includes a transceiver configured to receive a message including an index “servcellindex” of one or more serving cells. the ue also includes a processor operably coupled to the transceiver, configured to generate, for a power headroom (ph) report (phr), a first bitmap that indicates presence of a ph field in the phr for a serving cell configured with servcellindex i. the processor is also configured to sequentially index the one or more serving cells for which a corresponding bit in the first bitmap is set to 1 and a pcell. the processor is also configured to generate, for the phr, a second bitmap that indicates presence of a pcmax,f,c for assumed pusch field in the phr for the sequentially indexed pcell and one or more serving cells. the transceiver is also configured to transmit, to a bs, the phr including the first bitmap and the second bitmap.
20250193855. SLOT FORMAT LOW POWER SIGNALS (Samsung Electronics ., .)
Abstract: apparatuses and methods for slot formats with low power signals. a method of a user equipment (ue) in a wireless communication system includes receiving a set of higher layer parameters and determining whether a first slot format is included in the set of higher layer parameters. the method further includes determining, based on the set of higher layer parameters, a set of slots for receiving a low power signal by a low-power receiver (lr) of the ue. when the first slot format is included in the set of higher layer parameters, the method further includes determining, based on the first slot format, whether a slot in the set of slots is an uplink slot, a flexible slot, or a downlink slot and receiving the low power signal based on a determination that the slot in the set of slots is not an uplink slot.
Abstract: a method of a wireless communication device, includes compensating for a first phase of a first training symbol and a second phase of a second training symbol following the first training symbol, based on a reference carrier frequency offset (cfo) corresponding to one of a plurality of subcarriers of a received frame in a time domain; calculating residual cfos respectively for the plurality of subcarriers of the received frame, based on the reference cfo; compensating for phase differences between the first training symbol and the second training symbol for each of the plurality of subcarriers, based on the residual cfos in a frequency domain; and estimating at least one of noise power and signal-to-noise ratio (snr) of the received frame, based on the first training symbol and the second training symbol after compensating for the phase differences between the first training symbol and the second training symbol.
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. disclosed are a method and device for reporting signals and information wherein when a terminal arbitrarily determines the number of panels to be used in uplink communication and performs or intends to perform uplink transmission by using multiple panels simultaneously, relevant information is reported to a base station to enable the base station to control or schedule uplink communication in consideration of multi-panel operations of the terminal.
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transfer rates. specifically, the present discourse provides a method of receiving, by a terminal, transmission configuration indicator (tci) state information in a wireless communication system, the method comprising the steps of: receiving information on a tci state from a base station; obtaining a parameter relating to at least one of an uplink transmission beam and a downlink reception beam on the basis of the received information on the tci state; and transmitting or receiving data to or from the base station on the basis of the determined parameter.
20250193891. RESOURCE MANAGEMENT UE-INITIATED REPORTING (Samsung Electronics ., .)
Abstract: methods and apparatuses for resource management for user equipment (ue)-initiated reporting. a method performed by a ue includes receiving first information related to a physical uplink control channel (pucch) for transmission of an indicator to indicate transmission of a beam report, receiving second information related to a physical uplink shared channel (pusch) for transmission of the beam report, and determining a pucch resource based on the first information. the method further includes determining, based on the indicator or the determined pucch resource and the second information, a pusch resource, transmitting the indicator via the pucch resource, and transmitting the beam report via the pusch resource.
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure discloses a method and a device in a wireless communication system. according to an embodiment of the present disclosure, there is provided a method performed by a terminal in a wireless communication system, comprising: receiving, a frequency domain configuration of a control resource set (coreset), determining a frequency domain area where a control resource set (coreset) is located, wherein the frequency domain area where the coreset is located comprises at least a part of the frequency domain area of coreset determined based on the received frequency domain configuration of the coreset; and monitoring a physical downlink control channel (pdcch) based on the determined frequency domain area where the coreset is located.
20250193899. METHOD APPARATUS RECEIVING DOWNLINK CONTROL INFORMATION (Samsung Electronics ., .)
Abstract: the present disclosure relates to a pre-5th-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th-generation (4g) communication system such as long term evolution (lte). the present disclosure provides a method and apparatus of receiving downlink control information (dci). the method may include: a user equipment (ue) determines a number of detections corresponding to a dci detection ability of the ue and a number of detections corresponding to a dci format; the ue reduces the number of detections corresponding to the dci format, wherein the reduced number of detections corresponding to the dci format is smaller than or equal to the number of detections corresponding to the dci detection ability; and the ue receives the dci according to the reduced number of detections corresponding to the dci format. according to the method and apparatus of the present disclosure, a complexity of a procedure of receiving the dci can be reduced.
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. the present disclosure relates to an operation of a terminal and a base station in a wireless communication system. specifically, the present disclosure relates to a method for transmitting and receiving data and reference signals in a wireless communication system, and an apparatus capable of performing same according to one embodiment of the present disclosure, a method by a terminal of a communication system is provided. the method comprises the steps of: transmitting terminal capability information to a base station; receiving downlink control information (dci) including resource allocation information related to a physical downlink shared channel (pdsch) from the base station; and receiving the pdsch from the base station on the basis of the resource allocation information, wherein if the terminal capability information does not indicate that the terminal supports pdsch scheduling without scheduling constraint, the resource allocation information is determined on the basis of the scheduling constraint, wherein the scheduling constraint is a constraint on frequency resource allocation of a pdsch related to an enhanced dmrs type.
Abstract: an electronic device and a method are provided. the electronic device includes communication circuitry configured to receive signals from at least one user equipment (ue), and a processor, wherein the processor may be configured to determine a reception quality of a signal obtained through the communication circuitry, obtain an offset corresponding to a channel characteristic of the signal, determine, based on the offset indicating a signal quality difference corresponding to a difference between a reception dimension (rx dimension) at signal reception and a target rx dimension and the reception quality, an expected reception quality corresponding to the target rx dimension, pre-schedule the target rx dimension and a frequency resource to the at least one ue, determine an expected throughput for the at least one ue based on the expected reception quality, determine the target rx dimension, and receive or transmit data from or to the ue.
20250193923. RELAY OPERATION MULTIPLE AP COORDINATION (Samsung Electronics ., .)
Abstract: a relay station (sta) in a wireless network, associates with a first access point (ap) on the first channel; associates with a second ap on the first channel; performs a first communication on the first channel with the first ap in a first service period; and performs a second communication on the first channel with the second ap in a second service period, wherein the first communication is a relaying operation between a first sta and the first ap and the second communication is a relaying operation between a second sta and the second ap.
Abstract: a wearable device is provided. the wearable device includes at least one communication circuit, memory storing one or more computer programs, at least one sensor, and one or more processors communicatively coupled to the at least one communication circuit, the memory, and the at least one sensor, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the wearable device to identify, using the at least one sensor, that a user wearing the wearable device is in a designated state, in response to identifying that the user is in the designated state, identify a first contact list among contacts stored in the memory and identify, using the at least one communication circuit, a second contact list obtained from a first external electronic device connected to the wearable device, transmit, using the at least one communication circuit, a first signal for an outgoing call to the second external electronic device corresponding to a third contact among pluralities of contacts included in the first contact list and the second contact list, to the second external electronic device, and transmit, using the at least one communication circuit, a second signal causing the first external electronic device to transmit a third signal for an outgoing call to a third external electronic device corresponding to a fourth contact among the pluralities of contacts, to the first external electronic device.
Abstract: in an electronic device and a method for operating the electronic device according to various embodiments, the electronic device comprises: a communication circuit configured to transmit and/or receive data through at least one link created between an external electronic device and the electronic device; and at least one processor, comprising processing circuitry, operatively connected to the communication circuit, wherein at least one processor, individually and/or collectively, may be configured to: confirm the delay time of the data transmitted or received through the at least one link; determine whether to activate a new link based on a comparison result between the confirmed delay time and the delay time required to perform a service related to the data; based on the determination to perform the activation of the new link, determine a data rate required for the new link based on the confirmed delay time, the required delay time, and a data rate of the at least one link; control the electronic device to transmit a link setup request message including information indicating the determined data rate to the external electronic device; and activate the new link based on reception of a response message transmitted by the external electronic device.
20250193973. COOKING APPARATUS (Samsung Electronics ., .)
Abstract: a cooking apparatus including a plurality of physically separated glasses and a coupling member coupling the plurality of glasses. the cooking apparatus includes a first glass forming a first region, a second glass forming a second region separated from the first region, and the coupling member configured to couple the first glass and the second glass. where the coupling member includes an upper flange configured to cover a portion of an upper surface of the first glass and a portion of an upper surface of the second glass to divide the first region and the second region, a lower flange configured to support a portion of a lower surface of the first glass and a portion of a lower surface of the second glass, and a column configured to connect the upper flange and the lower flange.
Abstract: an electronic device is provided. the electronic device includes a display, a communication module, memory storing one or more computer programs, and one or more processors communicatively coupled to the communication module, the display, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to identify at least one internet of things device capable of interworking in relation to playback of content through the communication module, display a settings screen comprising pieces of controllable attribute information about the identified internet of things device on the display, store pieces of attribute information to be applied to the identified internet of things device among the pieces of controllable attribute information, and control the identified internet of things device to perform an operation according to the stored attribute information, based on the playback of the content.
Abstract: a multilayer wiring substrate includes insulating layers sequentially stacked on each other, each having an upper surface and a lower surface opposite to the upper surface, circuit layers sequentially stacked and respectively provided in the insulating layers, and each having wirings, and lower substrate pads included in the bottommost circuit layer and exposed from the lower surface of the insulating layers, each of the lower substrate pads being electrically connected to the wirings of a circuit layer above the lower substrate pad, the lower substrate pads including a signal ball landing pad. at least one circuit layer includes a ground conductive layer at a higher vertical level than the signal ball landing pad and having an opening in a region corresponding to the signal ball landing pad, and a signal pattern within the opening and electrically connected to the signal ball landing pad.
20250194006. MEMORY MODULE ELECTRONIC DEVICE ASSEMBLY INCLUDING SAME (Samsung Electronics ., .)
Abstract: disclosed is a memory module comprising a module printed circuit board including a chip region and a pad region and a memory chip provided on the module printed circuit board in the chip region. the module printed circuit board includes a board including a first surface and a second surface disposed opposite to each other, a first pad provided on the first surface in the pad region, and a second pad provided on the second surface in the pad region. the first pad is disposed farther from the chip region than the second pad.
20250194011. PRINTED CIRCUIT BOARD SEMICONDUCTOR PACKAGE HAVING SAME (Samsung Electronics ., .)
Abstract: the invention provides a printed circuit board and a semiconductor package having the same, the printed circuit board includes traces disposed on respective upper and lower surfaces of the base layers and disposed on different vertical levels from a lowermost layer to an uppermost layer, and through vias connecting traces disposed on different vertical levels to each other and each extending in a vertical direction to pass through at least one of the base layers. the through vias include a first through via connecting the traces at the lowermost layer and the uppermost layer to each other, and a second through via connecting respective traces at adjacent intermediate layers between the lowermost layer and the uppermost layer to each other. the first through via passes through the inside of the second through via in the vertical direction, and the first through via is insulated from the second through via.
20250194021. ELECTRONIC DEVICE COMPRISING FIXING MEMBER (Samsung Electronics ., .)
Abstract: an electronic device, according to an embodiment of the present disclosure, may comprise: a first support having a flat plate shape; a first circuit board disposed on one surface of the first support; a fixing member comprising a fastener disposed on the first support at a position adjacent to the first circuit board and including a slit extending in one direction; and a flexible printed circuit board (fpcb) disposed at least partially in an s-shape or zigzag shape through the slit, and having one end connected to the first circuit board. in an embodiment, the fixing member may be configured to maintain the position or shape of one end of the flexible printed circuit board relative to the first circuit board by supporting the flexible printed circuit board.
20250194031. ELECTRONIC DEVICE COMPRISING STIFFENER (Samsung Electronics ., .)
Abstract: the electronic device according to an embodiment includes a first housing, a second housing rotatable with respect to the first housing, a hinge structure, a display, a heat dissipation sheet, a stiffener disposed between a portion of the display and the hinge structure and providing rigidity to the display, and a fixing structure pressed by the hinge structure in a folded state. the stiffener is flat in an unfolded state in which the first direction and the second direction are the same, and at least a portion of the stiffener is bent by the force applied to the fixing structure from the hinge structure in the folded state. in addition to this, various embodiments are possible.
20250194035. ELECTRONIC DEVICE COMPRISING ACOUSTIC MODULE (Samsung Electronics ., .)
Abstract: an electronic device, includes: a housing including a front surface, a rear surface, a side surface surrounding an inner space between the front surface and the rear surface, and a sound hole; a display; a front frame in the inner space and including an acoustic duct; a printed circuit board (pcb) including a first substrate surface, a second substrate, and an opening overlapping the acoustic duct; an acoustic module including a microphone overlapping the opening; and a waterproof assembly between the pcb and the front frame and overlapping the opening, and configured to transmit sound to the microphone from the acoustic duct through the opening. the waterproof assembly includes: a vibrating membrane; a compressible first sealing member on the vibrating membrane and facing the pcb; and a compressible second sealing member between the vibrating membrane and the first sealing member and having different physical properties than the first sealing member.
Abstract: an electronic device according to an embodiment comprises: a housing; a first bracket including a through hole; a first display movable with respect to the first bracket; a printed circuit board; a fan disposed between the printed circuit board and the first bracket; and a heat dissipation member comprising a thermally conductive material including a first region attached to one side of the first display facing one side of the first bracket, and a second region attached to the other side of the first bracket and facing the fan, wherein a portion of the heat dissipation member passes through the through hole between the first region and the second region and is transformable according to movement of the first display with respect to the first bracket.
Abstract: a semiconductor device may include a first lower separation pattern including a first portion, the first portion including a first lower separation region and a first upper separation region on the first lower separation region; a first source/drain pattern and a second source/drain pattern on both sides of the first upper separation region; a common source/drain contact plug on the first and second source/drain patterns and the first upper separation region, and electrically connected to the first and second source/drain patterns; a first conductive via electrically connected to the common source/drain contact plug and on the common source/drain contact plug; and a first wiring pattern electrically connected to the first conductive via and on the first conductive via.
20250194073. SEMICONDUCTOR DEVICE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: a method of manufacturing a semiconductor device includes forming a bit line on a substrate. a first mold layer is formed on the bit line and includes mold openings. a channel layer is formed in the mold openings and covers the bit line and the first mold layer. a partial area of the channel layer is processed with a neutral beam to change an oxygen vacancy concentration of the partial area. a second mold layer is formed covering the channel layer. the second mold layer and a portion of the channel layer covering an upper surface of the first mold layer are removed. a gate insulating layer covering a sidewall of the channel layer and a word line covering a sidewall of the gate insulating layer are formed. a plurality of insulating patterns is formed filling the mold openings. a contact layer connected to the channel layer is formed.
20250194076. SEMICONDUCTOR DEVICES (Samsung Electronics ., .)
Abstract: a semiconductor device includes a bit line disposed on a substrate and extending in a first horizontal direction, a word line disposed at a higher vertical level above a top surface of the substrate than the bit line and extending in a second horizontal direction crossing the first horizontal direction, a channel layer extending in a vertical direction on a side wall of the word line and including a first side wall facing the word line and a second side wall opposite to the first side wall, a first capping liner disposed on the second side wall of the channel layer and including silicon nitride, and a first buried insulating layer disposed on a side wall of the first capping liner.
20250194078. SEMICONDUCTOR DEVICES HAVING CHANNEL STRUCTURES (Samsung Electronics ., .)
Abstract: a semiconductor device includes an information storage structure on a substrate;
20250194084. SEMICONDUCTOR DEVICE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device includes a substrate including a memory cell region and a peripheral circuit region, the memory cell region having a first active region and the peripheral circuit region having a second active region, a capacitor structure formed in the memory cell region and including a lower electrode connected to the first active region, an upper electrode surrounding the lower electrode, and a capacitor dielectric film disposed therebetween, a lower insulating film disposed in the memory cell region and the peripheral circuit region and covering the capacitor structure, a first interlayer insulating film including a first lower interlayer insulating film and a first upper interlayer insulating film sequentially stacked on the lower insulating film, and a wiring line disposed in the first interlayer insulating film and electrically connected to the capacitor structure, in which the first upper interlayer insulating film includes a first material including a benzene ring.
Abstract: a ferroelectric gate stack may include a semiconductor layer, a conductor layer facing the semiconductor layer, a plurality of ferroelectric layers spaced apart from each other between the semiconductor layer and the conductor layer, a tunnel dielectric layer between a first ferroelectric layer and a second ferroelectric layer among the plurality of ferroelectric layers, and an interface layer between the semiconductor layer and the first ferroelectric layer.
20250194099. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: disclosed is a semiconductor device comprising a capacitor. the capacitor includes a bottom electrode, a first sub-dielectric layer on the bottom electrode, a second sub-dielectric layer on the first sub-dielectric layer, and a top electrode on the second sub-dielectric layer. the second sub-dielectric layer includes a first antiferroelectric layer on the first sub-dielectric layer, a second antiferroelectric layer on the first antiferroelectric layer, and a first ferroelectric layer between the first antiferroelectric layer and the second antiferroelectric layer. each of the first and second antiferroelectric layers includes zirconium oxide that is doped with a first element. the first sub-dielectric layer includes zirconium oxide that is not doped with the first element.
20250194105. MAGNETIC MEMORY DEVICE (Samsung Electronics ., .)
Abstract: a magnetic memory device includes a substrate having top and bottom surfaces, a first active region on the top surface of the substrate, the first active region including a lower channel pattern and a lower source/drain pattern, a second active region stacked on the first active region, the second active region including an upper channel pattern and an upper source/drain pattern, a gate electrode on the lower and upper channel patterns and extending in a first direction, a lower interconnection layer on the bottom surface of the substrate, a magnetic tunnel junction pattern and a spin-orbit torque line in the lower interconnection layer, a first lower contact electrically connecting the lower source/drain pattern to the magnetic tunnel junction pattern, and a second lower contact electrically connecting the upper source/drain pattern to the spin-orbit torque line.
20250194110. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device includes a cell structure including a cell region, a connection region, and a peripheral circuit connection region, wherein the peripheral circuit connection region includes an inner region and an outer region surrounding the inner region, and the cell structure includes a plug passing through a stack insulating layer in the inner region, a conductive base layer spaced apart from the plug in a horizontal direction in the outer region, a cover insulating layer located on an upper surface of the conductive base layer; and a common source layer having a portion on an upper surface of the cover insulating layer.
20250194177. SEMICONDUCTOR DEVICE METHOD MANUFACTURING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device includes a channel layer having a first energy band gap, a barrier layer on the channel layer, the barrier layer including a material having a second energy band gap that is different from the first energy band gap of the channel layer, a gate electrode on the barrier layer, a gate semiconductor layer between the barrier layer and the gate electrode, and at least one dislocation blocking layer in the channel layer, the at least one dislocation blocking layer including a plurality of dislocation blocking patterns extending in the channel layer and in a first direction parallel with a bottom surface of the channel layer, where the plurality of dislocation blocking patterns are arranged at irregular intervals along the first direction.
20250194181. SEMICONDUCTOR DEVICES METHODS FABRICATING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device is provided. the semiconductor device includes a substrate, an active pattern extending in a first horizontal direction on the substrate, a gate electrode extending in a second horizontal direction different from the first horizontal direction on the active pattern, a source/drain region on at least one side of the gate electrode, a source/drain contact extending into the source/drain region and including a filling layer and a barrier layer along a sidewall of the filling layer, and a silicide layer between the source/drain region and the filling layer, the silicide layer including a first sidewall in contact with the filling layer and a second sidewall in contact with the source/drain region, wherein the barrier layer is not between the filling layer and the source/drain region.
20250194186. SEMICONDUCTOR DEVICE METHOD FABRICATING SAME (Samsung Electronics ., .)
Abstract: a semiconductor device including an active pattern on a substrate, a source/drain pattern on the active pattern; a channel pattern on the active pattern and connected to the source/drain pattern and including a first semiconductor pattern, and a gate electrode running across the channel pattern and extending in a first direction may be provided. a first width is a maximum width in the first direction of the source/drain pattern. a second width is a maximum width in the first direction of the first semiconductor pattern. a ratio of the second width to the first width may be in a range of about 0.9 to about 1.1.
20250194214. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: various example embodiments provide a semiconductor device including a channel layer, a barrier layer on the channel layer and including a material having an energy band gap different from that of the channel layer, a gate electrode on the barrier layer, a gate semiconductor layer between the barrier layer and the gate electrode, and a source electrode and a drain electrode on opposite sides of the gate electrode and penetrating at least a portion of the barrier layer and the channel layer to cover a side surface of the barrier layer and a side surface of the channel layer.
20250194215. INTEGRATED CIRCUIT DEVICE (Samsung Electronics ., .)
Abstract: provided are an integrated circuit device and a method of manufacturing the same. the integrated circuit device includes a plurality of device isolation films spaced apart from each other, a gap-fill insulating film located between the plurality of device isolation films, a plurality of gate lines disposed above the gap-fill insulating film, a plurality of source/drain regions including a first source/drain region and a second source/drain region, each of the plurality of source/drain regions located between the plurality of gate lines, a backside contact provided below the first source/drain region, the backside contact extending through the gap-fill insulating film and electrically connected to the first source/drain region, and a gate protective film provided below the first source/drain region and being in contact with an upper sidewall of the backside contact. at least a portion of a sidewall of the gate protective film is surrounded by the gap-fill insulating film.
20250194217. INTEGRATED CIRCUIT DEVICE (Samsung Electronics ., .)
Abstract: an integrated circuit device includes a fin-type active region disposed on a substrate and extending in a first horizontal direction, a gate line disposed on the fin-type active region and extending in a second horizontal direction intersecting the first horizontal direction, the gate line including, a connection protrusion portion including a protrusion top surface at a first vertical level from the substrate, and a main gate portion including a recess top surface extending in the second horizontal direction from the connection protrusion portion, the recess top surface being at a second vertical level lower than the first vertical level, a gate contact disposed on the gate line and connected to the connection protrusion portion, a source/drain region disposed on the fin-type active region and disposed adjacent to the gate line, and a source/drain contact disposed on the source/drain region.
20250194233. INTEGRATED CIRCUIT DEVICE (Samsung Electronics ., .)
Abstract: an integrated circuit device includes a base substrate layer, a sheet separation wall extending in a first horizontal direction on the base substrate layer, a pair of nanosheet stack structures spaced apart from each other with the sheet separation wall therebetween in a second horizontal direction different from the first horizontal direction, the pair of nanosheet stack structures each including a plurality of nanosheets, a pair of source/drain regions spaced apart from each other with the sheet separation wall therebetween in the second horizontal direction, wherein the pair of source/drain regions are electrically connected to the pair of nanosheet stack structures, respectively, and a pair of gate electrodes extending in the second horizontal direction on the pair of nanosheet stack structures, wherein opposing side surfaces of the sheet separation wall in the second horizontal direction include a round portion having a convex shape between the pair of source/drain regions.
20250194240. SEMICONDUCTOR DEVICE (Samsung Electronics ., .)
Abstract: a semiconductor device may include a substrate including active regions; gate structures including first and second gate structures intersecting first and second active regions, channel layers on the active regions, surrounded by the gate structures; source/drain regions, connected to channel layers, including a first source/drain region in which the first active region is recessed, having a first conductivity-type, and a second source/drain region in which the second active region is recessed, having a second conductivity-type; internal spacers between the first gate structure and the first source/drain region and between the second gate structure and the second source/drain region, each of the first internal spacers including a spacer insulating film between a spacer dielectric layer and the gate structure, and a thickness of the first internal spacers may be greater than a thickness of the second internal spacers.
20250194375. ELECTRONIC DEVICE COMPRISING DISPLAY PANEL POSITIONED CAMERA (Samsung Electronics ., .)
Abstract: an electronic device is provided. the electronic device includes a camera, a display panel including a first region disposed on the camera and a second region surrounding at least a portion of the first region, wherein the first region includes an emission layer including a plurality of pixels uniformly spaced apart from each other, an encapsulation layer on the emission layer, and an opaque metal layer below the emission layer, wherein the opaque metal layer includes a plurality of openings disposed between the plurality of pixels, wherein each of the plurality of openings includes a periphery including first portions, each having a first radius of curvature, spaced apart from each other, and second portions, each having a second radius of curvature shorter than the first radius of curvature, positioned between the first portions of the periphery, and wherein each of the first portions of the periphery faces each of pixels positioned along the periphery.
Abstract: an electronic device according to an embodiment of the present disclosure may comprise: housings and a display unit, the display unit comprising a display panel, a protective layer, a metal layer, and a plurality of adhesive layers, and at least a portion of the display unit being bendable at a bending section, wherein the metal layer comprises a first metal layer, including a first bending region and a second bending region disposed at the bending section of the display unit, and a second metal layer disposed at one end and the other end of the first metal layer, and the one end and the other end of the first metal layer at which the second metal layer is disposed may spaced apart from the second bending region.
Abstract: an organometallic compound represented by formula 1:
Abstract: an organometallic compound represented by formula 1:
20250194438. INFORMATION READING METHOD SELF-SELECTING MEMORY DEVICE (Samsung Electronics ., .)
Abstract: provided are information reading methods of a self-selecting memory device, which includes a first electrode, a second electrode, and a memory layer therebetween, the memory layer including a chalcogenide-based material, having ovonic threshold switching characteristics, and configured to have a threshold voltage that changes to a set threshold voltage or a reset threshold voltage higher than the set threshold voltage according to polarity and intensity of a voltage applied to the memory layer. an information reading method may include reading a data value stored in the memory layer by applying, to the memory layer as a read voltage, a voltage lower than the set threshold voltage.
Abstract: provided are a memory device and a method of implementing a multi-level memory using the memory device. the memory device includes first and second electrodes, a self-selecting memory layer, and a memory layer. the first and second electrodes are arranged apart from each other. the self-selecting memory layer is provided between the first and second electrodes, includes a chalcogenide-based material, has ovonic threshold switching characteristics, and has a threshold voltage variable according to a polarity and a magnitude of a voltage applied thereto. the memory layer is provided between the second electrode and the self-selecting memory layer and has resistance characteristics variable with a voltage applied thereto. multi-level resistance states may be implemented by varying the polarity and magnitude of a voltage applied between the first and second electrodes.