SUMITOMO ELECTRIC INDUSTRIES, LTD. patent applications on February 20th, 2025
Patent Applications by SUMITOMO ELECTRIC INDUSTRIES, LTD. on February 20th, 2025
SUMITOMO ELECTRIC INDUSTRIES, LTD.: 14 patent applications
SUMITOMO ELECTRIC INDUSTRIES, LTD. has applied for patents in the areas of H01B7/08 (3), G01S13/89 (2), H05K1/02 (2), H01R12/77 (2), C03C25/105 (1) H01R12/771 (2), C03C25/105 (1), G01R31/088 (1), G01S7/4008 (1), G01S13/931 (1)
With keywords such as: signal, layer, unit, pattern, conductors, end, position, portion, disposed, and conductive in patent application abstracts.
Patent Applications by SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s): Katsushi HAMAKUBO of Osaka (JP) for sumitomo electric industries, ltd., Noriaki IWAGUCHI of Osaka (JP) for sumitomo electric industries, ltd., Miho IKEGAWA of Osaka (JP) for sumitomo electric industries, ltd., Chiaki TOKUDA of Osaka (JP) for sumitomo electric industries, ltd., Tatsuya KONISHI of Osaka (JP) for sumitomo electric industries, ltd.
IPC Code(s): C03C25/105, C03C25/1065, C03C25/285, C03C25/47, C03C25/475
CPC Code(s): C03C25/105
Abstract: a resin composition for optical fiber coating contains a photopolymerizable compound, a photopolymerization initiator, and surface-treated copper phthalocyanine particles, in which a content of the surface-treated copper phthalocyanine particles is 0.1% by mass or more and 10% by mass or less based on the total amount of the resin composition.
Inventor(s): Masato IZAWA of Osaka-shi, Osaka (JP) for sumitomo electric industries, ltd., Satoru SAKURAZAWA of Osaka-shi, Osaka (JP) for sumitomo electric industries, ltd., Isao KATO of Osaka-shi, Osaka (JP) for sumitomo electric industries, ltd., Shota SHIMIZU of Osaka-shi, Osaka (JP) for sumitomo electric industries, ltd., Takashi MAEHATA of Osaka-shi, Osaka (JP) for sumitomo electric industries, ltd.
IPC Code(s): G01R31/08, G01R31/11, G01R31/58
CPC Code(s): G01R31/088
Abstract: a detection device includes a signal output unit configured to output a 1-bit first digital signal representing a waveform of a predetermined pattern or a signal based on the first digital signal to a transmission line as a measurement signal, a signal reception unit configured to receive a response signal including a signal reflecting the measurement signal from the transmission line and convert the response signal into a 1-bit second digital signal, an operation unit configured to perform a logical operation of the second digital signal converted by the signal reception unit and a 1-bit third digital signal based on the predetermined pattern, and a detection unit configured to detect an abnormality of the transmission line, based on an operation result obtained by the operation unit.
Inventor(s): Hiroaki KAWANISHI of Osaka-shi, Osaka (JP) for sumitomo electric industries, ltd.
IPC Code(s): G01S7/40, G01S13/06, G01S13/89, G01S13/91
CPC Code(s): G01S7/4008
Abstract: a receiving apparatus mounted on a moving body includes: a receiving circuit that receives radio waves transmitted from a radio wave sensor attached to a structure installed on a road, and generates feature information including at least one of reception level, s/n ratio, and frequency of the received radio waves; a location detecting unit that detects a location of the moving body; and a recording unit that records the location of the moving body detected by the location detecting unit in association with the feature information generated by the receiving circuit on the basis of the radio waves received at the location of the moving body.
Inventor(s): Shigeki UMEHARA of Osaka-shi, Osaka (JP) for sumitomo electric industries, ltd.
IPC Code(s): G01S13/931, G01S7/06, G01S13/89
CPC Code(s): G01S13/931
Abstract: a radio-wave sensor installation assistance device includes: a target position determination unit that determines a target position to be irradiated with a radio wave emitted from a radio-wave sensor, in an image including a crosswalk; a candidate position designation unit that receives designation of a candidate position to install the radio-wave sensor; and a display control unit that causes a display device to display a radio-wave irradiation range of the radio-wave sensor so as to be superimposed on the image, the radio-wave irradiation range being determined based on the target position and the candidate position. the candidate position designation unit can receive an instruction of a movement of the designated candidate position. the display control unit changes the shape of the radio-wave irradiation range according to the instructed movement of the candidate position, with the target position being fixed.
Inventor(s): Shunsuke OKAMOTO of Osaka (JP) for sumitomo electric industries, ltd.
IPC Code(s): H01M50/586, H01M50/119, H01M50/129, H01M50/533
CPC Code(s): H01M50/586
Abstract: the lead wire for a nonaqueous electrolyte battery according to the present disclosure includes a conductor and an insulating film having one or more insulating layers and covering at least a part of an outer peripheral surface of the conductor, and a summation �(t�e) of a product of an average thickness t of each of the insulating layers and an elastic modulus ethereof at a temperature d in a temperature range of 70� c. or more and 130� c. or less is 0.6 mm�mpa or more.
Inventor(s): Tatsuo MATSUDA of Kanuma-shi (JP) for sumitomo electric industries, ltd., Chiaki KOJIMA of Kanuma-shi (JP) for sumitomo electric industries, ltd., Yasunori ASANO of Osaka-shi (JP) for sumitomo electric industries, ltd.
IPC Code(s): H01R12/77, H01B7/08
CPC Code(s): H01R12/771
Abstract: an electrical-connector-equipped flat cable includes a first flat cable including a first signal line and a first ground line, a first ferrule holding a first front end region, a second flat cable including a second signal line and a second ground line, a second ferrule holding a second front end region, and a shell disposed so as to surround the first ferrule and the second ferrule. the shell includes a frame body and a plate, the frame body being disposed outside the first ferrule and the second ferrule, the plate being disposed between the first ferrule and the second ferrule and electrically connected to the frame body. the plate includes a main body portion and a coupling portion electrically connected to each of the main body portion, the first ground line, and the second ground line.
Inventor(s): Chiaki KOJIMA of Kanuma-shi (JP) for sumitomo electric industries, ltd., Tatsuo MATSUDA of Kanuma-shi (JP) for sumitomo electric industries, ltd., Masaki SUZUKI of Osaka-shi (JP) for sumitomo electric industries, ltd.
IPC Code(s): H01R12/77, H01B7/08
CPC Code(s): H01R12/771
Abstract: an electrical-connector-equipped cable includes a flat cable and a connector. the flat cable includes a plurality of conductors arranged side by side, and a first dielectric covering the plurality of conductors to expose a distal end portion of each of the plurality of conductors. the connector holds the distal end portion of each of the plurality of conductors to expose a distal end surface of each distal end portion to an outside. a first opening is provided in the connector. the first opening exposes the distal end portion of at least one first conductor of the plurality of conductors. the distal end portion of the first conductor is positioned in the first opening, and a second dielectric is provided between a wall defining the first opening and the first conductor.
Inventor(s): Chiaki KOJIMA of Kanuma-shi (JP) for sumitomo electric industries, ltd., Tatsuo MATSUDA of Kanuma-shi (JP) for sumitomo electric industries, ltd., Taisuke NAGASAKI of Osaka-shi (JP) for sumitomo electric industries, ltd.
IPC Code(s): H01R13/6471, H01R12/71, H01R13/03
CPC Code(s): H01R13/6471
Abstract: an electrical-connector-equipped cable includes a cable and a connector. the cable includes a plurality of conductors and a first dielectric covering the plurality of conductors to expose a distal end portion of each of the plurality of conductors. the connector includes a plurality of second dielectrics each holding the distal end portion of each of the plurality of conductors to expose a distal end surface of each of the plurality of conductors to an outside. the plurality of second dielectrics are formed such that extending directions of the plurality of second dielectrics and the plurality of conductors change while maintaining distances between the plurality of conductors.
Inventor(s): Kazuhiro MIYATA of Osaka (JP) for sumitomo electric industries, ltd., Koji NITTA of Osaka (JP) for sumitomo electric industries, ltd., Shoichiro SAKAI of Osaka (JP) for sumitomo electric industries, ltd., Satoshi KIYA of Shiga (JP) for sumitomo electric industries, ltd.
IPC Code(s): H05K1/02, H05K3/00, H05K3/18
CPC Code(s): H05K1/0242
Abstract: a printed wiring board includes: a dielectric layer having a main surface; and a conductive pattern. the conductive pattern includes a metal layer that is disposed on the main surface, an electroless plating layer that is disposed on the metal layer, and an electrolytic plating layer that is disposed on the electroless plating layer. an average thickness of the metal layer is 2.1 �m or more and 9.0 �m or less. maximum height roughness of a surface of the metal layer opposed to the main surface is 5.0 �m or less.
20250063661. PRINTED WIRING BOARD_simplified_abstract_(sumitomo electric industries, ltd.)
Inventor(s): Kenji TAKAHASHI of Osaka (JP) for sumitomo electric industries, ltd., Shoichiro SAKAI of Osaka (JP) for sumitomo electric industries, ltd., Satoshi KIYA of Shiga (JP) for sumitomo electric industries, ltd.
IPC Code(s): H05K1/11, H05K1/02, H05K3/42
CPC Code(s): H05K1/115
Abstract: a printed wiring board includes: a first conductive pattern; a dielectric layer that is disposed to cover the first conductive pattern; a second conductive pattern that is disposed on the dielectric layer; and a plating layer. a thickness of the dielectric layer is 50 �m or more and 500 �m or less. a hole from which the first conductive pattern is exposed is formed in the dielectric layer. an aspect ratio of the hole is 0.5 or more and 2.0 or less. the plating layer is disposed on at least an inner wall surface of the hole and the first conductive pattern exposed from the hole, and electrically connected to the second conductive pattern. a thickness of the plating layer disposed on the first conductive pattern exposed from the hole is greater than a thickness of the second conductive pattern.
SUMITOMO ELECTRIC INDUSTRIES, LTD. patent applications on February 20th, 2025
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- C03C25/105
- C03C25/1065
- C03C25/285
- C03C25/47
- C03C25/475
- CPC C03C25/105
- Sumitomo electric industries, ltd.
- G01R31/08
- G01R31/11
- G01R31/58
- CPC G01R31/088
- G01S7/40
- G01S13/06
- G01S13/89
- G01S13/91
- CPC G01S7/4008
- G01S13/931
- G01S7/06
- CPC G01S13/931
- H01M50/586
- H01M50/119
- H01M50/129
- H01M50/533
- CPC H01M50/586
- H01R12/77
- H01B7/08
- CPC H01R12/771
- H01R13/6471
- H01R12/71
- H01R13/03
- CPC H01R13/6471
- H05K1/02
- H05K3/00
- H05K3/18
- CPC H05K1/0242
- H05K1/11
- H05K3/42
- CPC H05K1/115