SHINKAWA LTD. Patent Application Trends in 2024
SHINKAWA LTD. Patent Filing Activity
SHINKAWA LTD. patent applications in 2024
Error creating thumbnail: File missing
Top 10 Technology Areas
- H01L24/78 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2924/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- Count: 3 patents
- Example: 20240105673. BONDING APPARATUS AND ALIGNMENT METHOD simplified abstract (SHINKAWA LTD.)
- H01L24/85 ({using a wire connector (wire bonding in general)
- H01L2224/78353 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/78753 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L21/67144 ({Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates})
- Count: 2 patents
- Example: 20240120219. BONDING APPARATUS AND BONDING METHOD simplified abstract (SHINKAWA LTD.)
- H01L24/75 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20240014167. SUBSTRATE HOLDER AND BONDING SYSTEM simplified abstract (SHINKAWA LTD.)
- H01L21/603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/85051 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
- B23K3/082 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- Count: 1 patents
- Example: 20240082941. FLUX TRANSFER APPARATUS simplified abstract (SHINKAWA LTD.)
- H01L2224/75983 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240063170. MOUNTING HEAD simplified abstract (SHINKAWA LTD.)
- H01L2224/75502 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240063170. MOUNTING HEAD simplified abstract (SHINKAWA LTD.)
- H01L2224/75282 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240063170. MOUNTING HEAD simplified abstract (SHINKAWA LTD.)
- H01L2224/75252 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240063170. MOUNTING HEAD simplified abstract (SHINKAWA LTD.)
- H01L21/67721 ({the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames ()
- H01L21/6838 (for supporting or gripping (for conveying)
- H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions)
- H01L21/67138 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se)
- G01R31/58 (Testing of lines, cables or conductors (testing of electric windings)
- Count: 1 patents
- Example: 20240175941. ELECTRIC CIRCUIT ABNORMALITY DETECTION DEVICE simplified abstract (SHINKAWA LTD.)
Top Inventors
- Osamu KAKUTANI (2 patents)
- Kohei SEYAMA (2 patents)
- Shinsuke FUKUMOTO (2 patents)
- Yoshiyuki OGATA (1 patent)
- Shigeru HAYATA (1 patent)
- Toru MAEDA (1 patent)
- Yuichiro NOGUCHI (1 patent)
- Hiroaki Yoshino (1 patent)
- Shinsuke TEI (1 patent)
- Hikaru MIURA (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Pages with broken file links
- SHINKAWA LTD.
- Companies
- CPC G06T7/001
- CPC G06T7/74
- CPC H01L24/743
- CPC G06T2207/30148
- CPC H01L2224/743
- CPC H01L24/78
- CPC H01L24/85
- CPC H01L2224/78001
- CPC H01L2224/78304
- CPC H01L2224/78353
- CPC H01L2224/78702
- CPC H01L2224/78753
- CPC H01L2224/85123
- CPC H01L2224/8518
- CPC H01L2224/859
- CPC H01L2924/40
- CPC B23K20/004
- CPC B23K20/106
- CPC B23K2101/40
- CPC H01L2224/78621
- CPC H01L2224/78701
- CPC H01L21/67144
- CPC H01L21/67259
- CPC H01L21/67294
- CPC H01L21/68714
- CPC H01L24/75
- CPC B23K1/0016
- CPC B23K3/087
- CPC H01L2224/75984
- CPC H01L2224/75744
- CPC H01L2224/75755
- CPC H01L2224/7598
- CPC H01L21/681
- CPC H01L21/67248
- CPC H01L21/603
- CPC H01L24/745
- CPC H01L24/48
- CPC H01L2224/4809
- CPC H01L2224/49177
- CPC H01L2224/7855
- CPC H01L2224/85051
- CPC B23K20/005
- CPC B23K20/10
- CPC B65G49/061
- CPC B65G43/08
- CPC B65G47/917
- CPC B65G2201/0297
- CPC H01L2224/85047
- CPC H01L2224/78901
- CPC G01R31/58
- CPC H01L21/67138
- CPC H01L22/12
- CPC H01L21/6838
- CPC H01L21/67721
- CPC H01L2224/75252
- CPC H01L2224/75282
- CPC H01L2224/75502
- CPC H01L2224/75983
- CPC B23K3/082
- Patent Trends by Company in 2024