SAMSUNG ELECTRONICS CO., LTD. (20250024690). MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
This abstract first appeared for US patent application 20250024690 titled 'MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Original Abstract Submitted
a memory chip includes a cell chip and a core-periphery chip, which are vertically stacked and are electrically connected to each other. the cell chip includes cell regions, each of which includes a memory cell layer. the core-periphery chip includes a core group region and a peripheral region which are adjacent to each other in a first direction. the core group region includes core regions arranged in a line in a second direction intersecting the first direction. each of the core regions includes a core bank including a core circuit, and a neural processing unit (npu) block including an npu.
