SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2025
SAMSUNG ELECTRONICS CO.,LTD. Patent Filing Activity
SAMSUNG ELECTRONICS CO.,LTD. patent applications in 2025
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Top 10 Technology Areas
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20250046721. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME (SAMSUNG ELECTRONICS CO.,LTD.)
- H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20250046721. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME (SAMSUNG ELECTRONICS CO.,LTD.)
- G06F3/061 (Digital input from, or digital output to, record carriers {, e.g. RAID, emulated record carriers or networked record carriers})
- G06F3/0659 ({Command handling arrangements, e.g. command buffers, queues, command scheduling})
- G06F3/0673 ({Single storage device})
- G06T7/001 ({using an image reference approach})
- Count: 1 patents
- Example: 20250045909. OVERLAY MEASUREMENT DEVICE AND OVERLAY MEASUREMENT METHOD (SAMSUNG ELECTRONICS CO.,LTD.)
- G06T7/70 (Determining position or orientation of objects or cameras (camera calibration)
- Count: 1 patents
- Example: 20250045909. OVERLAY MEASUREMENT DEVICE AND OVERLAY MEASUREMENT METHOD (SAMSUNG ELECTRONICS CO.,LTD.)
- G06T2207/20132 (Special algorithmic details)
- Count: 1 patents
- Example: 20250045909. OVERLAY MEASUREMENT DEVICE AND OVERLAY MEASUREMENT METHOD (SAMSUNG ELECTRONICS CO.,LTD.)
- G06T2207/30148 (Subject of image; Context of image processing)
- Count: 1 patents
- Example: 20250045909. OVERLAY MEASUREMENT DEVICE AND OVERLAY MEASUREMENT METHOD (SAMSUNG ELECTRONICS CO.,LTD.)
- H01L23/5383 ({Multilayer substrates ()
- Count: 1 patents
- Example: 20250046721. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME (SAMSUNG ELECTRONICS CO.,LTD.)
Emerging Technology Areas
- G06N3/0464 (Convolutional networks [CNN, ConvNet])
- Count: 1 patents
- Example: 20250053792. DISPLAY DEVICE AND OPERATING METHOD THEREOF (SAMSUNG ELECTRONICS CO.,LTD.)
- H10F39/804 (No explanation available)
- Count: 1 patents
- Example: 20250098355. CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO.,LTD.)
- H10F39/811 (No explanation available)
- Count: 1 patents
- Example: 20250098355. CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO.,LTD.)
- H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass)
- H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/73203 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/16238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/14131 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups)
Top Inventors
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- CHINAM KIM (1 patent)
- DO-HAN KIM (1 patent)
- CHANGMIN LEE (1 patent)
- Junyeob KIM (1 patent)
- Jiyun JUNG (1 patent)
- Jisun Kim (1 patent)
- Choongbin YIM (1 patent)
- Jongkook KIM (1 patent)
- Chengtar WU (1 patent)
- Hoyoung TANG (1 patent)
Patent Categories
Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
SAMSUNG ELECTRONICS CO.,LTD. Inventor States 2025 - Up to February 2025
Categories:
- Pages with broken file links
- SAMSUNG ELECTRONICS CO.,LTD.
- Companies
- CPC G06F3/061
- CPC G06F3/0659
- CPC G06F3/0673
- CPC G06T7/001
- CPC G06T7/70
- CPC G06T2207/20132
- CPC G06T2207/30148
- CPC H01L23/5383
- CPC H01L21/4857
- CPC H01L21/56
- CPC H01L23/3128
- CPC H01L23/49816
- CPC H01L23/49827
- CPC H01L24/08
- CPC H01L25/105
- CPC H01L24/16
- CPC H01L2224/08235
- CPC H01L2224/16227
- CPC H01L23/5286
- CPC H10D84/83
- CPC H10D30/43
- CPC H10D30/6735
- CPC H10D30/6757
- CPC H10D62/121
- CPC G06F21/572
- CPC H04L9/0656
- CPC H04L9/0825
- CPC H01L27/14621
- CPC B82Y20/00
- CPC H01L24/32
- CPC H01L24/14
- CPC H01L24/73
- CPC H05K1/0213
- CPC H05K1/181
- CPC H01L25/18
- CPC H01L2224/14131
- CPC H01L2224/16238
- CPC H01L2224/32225
- CPC H01L2224/73203
- CPC H01L2924/1431
- CPC H10B80/00
- CPC H10F39/811
- CPC H10F39/804
- CPC G06N3/0464
- Patent Trends by Company in 2025
