ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

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ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250014992 titled 'ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

an electronic component includes a semiconductor layer that has a first principal surface and a second principal surface at an opposite thereto, a lower insulating layer that is formed on the first principal surface of the semiconductor layer, a resistance layer that is formed on the lower insulating layer and has a notched portion extending in a predetermined first direction from a portion of a peripheral edge thereof, an upper insulating layer that is formed on the lower insulating layer such as to cover the resistance layer, and an uneven structure that is formed in a predetermined region of the first principal surface of the semiconductor layer including at least a region directly below the resistance layer and the uneven structure includes a plurality of grooves disposed at equal intervals in a second direction that is a direction along the first principal surface and is orthogonal to the first direction and extend in parallel to the first direction and a projection portion that is a portion between two adjacent grooves.