INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE

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INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE

This abstract first appeared for US patent application 20250014799 titled 'INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE

Original Abstract Submitted

an insulating chip includes: a first unit; and a second unit disposed on the first unit, wherein the first unit includes a first element insulation layer including a first element back surface and a first element head surface, a first insulation element embedded in the first element insulation layer, and a first connection electrode exposed from the first element back surface, the second unit includes a second element insulation layer including a second element back surface and a second element head surface, a second insulation element opposed to the first insulation element, and a second connection electrode exposed from the second element back surface, the first unit and the second unit are disposed so that the first element back surface is in contact with the second element back surface and the first connection electrode is electrically connected to the second connection electrode.