SEMICONDUCTOR DEVICE

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SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240282836 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract consists of a chip with a main surface, a main surface electrode, a terminal electrode, a sealing insulator, and a terminal film.

The chip has a main surface where the main surface electrode is located.
The terminal electrode is arranged on the main surface electrode.
A sealing insulator covers the periphery of the terminal electrode on the main surface, leaving a part of the terminal electrode exposed.
A terminal film covers the terminal electrode to provide protection and insulation.

Potential Applications: - This technology can be used in various semiconductor devices such as integrated circuits, transistors, and diodes. - It can be applied in electronic devices, communication systems, and power supplies.

Problems Solved: - Provides protection and insulation for terminal electrodes on semiconductor devices. - Ensures the reliability and longevity of the semiconductor device.

Benefits: - Enhances the performance and durability of semiconductor devices. - Improves the overall quality and functionality of electronic products.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be utilized in the manufacturing of high-performance electronic devices, leading to increased efficiency and reliability in various industries such as telecommunications, consumer electronics, and automotive.

Prior Art: Readers can explore prior patents related to semiconductor device packaging and insulation techniques to gain a deeper understanding of the evolution of this technology.

Frequently Updated Research: Stay informed about the latest advancements in semiconductor device technology, including new materials, manufacturing processes, and applications.

Questions about Semiconductor Device Technology: 1. How does the sealing insulator contribute to the protection of the terminal electrode? The sealing insulator covers the periphery of the terminal electrode, preventing external factors from damaging the terminal while still allowing a part of it to be exposed for connection purposes.

2. What are the key differences between this semiconductor device and traditional packaging methods? This semiconductor device offers improved protection and insulation for terminal electrodes, enhancing the overall reliability and performance of the device compared to conventional packaging methods.

Original Abstract Submitted

a semiconductor device includes a chip that has a main surface, a main surface electrode that is arranged on the main surface, a terminal electrode that is arrange on the main surface electrode, a sealing insulator that covers a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and a terminal film that covers the terminal electrode.