Qualcomm incorporated (20250086889). MULTI-FRAME THREE-DIMENSIONAL (3D) RECONSTRUCTION
MULTI-FRAME THREE-DIMENSIONAL (3D) RECONSTRUCTION
Organization Name
Inventor(s)
Adithya Reddy Nallabolu of San Diego CA (US)
Gokce Dane of San Diego CA (US)
MULTI-FRAME THREE-DIMENSIONAL (3D) RECONSTRUCTION
This abstract first appeared for US patent application 20250086889 titled 'MULTI-FRAME THREE-DIMENSIONAL (3D) RECONSTRUCTION
Original Abstract Submitted
disclosed are systems and techniques for image processing. for example, a computing device can project a sample location (of a plurality of sample locations) of a block of a scene onto depth frames to determine pixel values for the sample location. each of the depth frames corresponds to a pose and includes a depth prediction value corresponding to the sample location. the computing device can read the depth prediction values of the depth frames at the pixel values for the sample location on each depth frame of the depth frames. the computing device can obtain 3d points of the depth prediction values in a three-dimensional (3d) space. the computing device can then generate weighted depth prediction values by assigning a weight to each depth prediction value of the depth prediction values. the computing device can update the sample location based on the weighted depth prediction values.