Qualcomm incorporated (20250068227). DISTRIBUTED THERMAL MANAGEMENT ARCHITECTURE
DISTRIBUTED THERMAL MANAGEMENT ARCHITECTURE
Organization Name
Inventor(s)
Louis Louie of San Diego CA (US)
Ronald Alton of Oceanside CA (US)
Sumarlin William of San Diego CA (US)
Vinayak Nana Mehetre of Bangalore (IN)
DISTRIBUTED THERMAL MANAGEMENT ARCHITECTURE
This abstract first appeared for US patent application 20250068227 titled 'DISTRIBUTED THERMAL MANAGEMENT ARCHITECTURE
Original Abstract Submitted
thermal management aspects include a serial databus; a central processing unit (cpu); a graphics processing unit (gpu); a neural signal processor (nsp); an always on subsystem (aoss); the serial databus, the cpu, the gpu, the nsp and the aoss are implemented on a system on a chip; wherein the cpu includes a first plurality of thermal sensors and a first plurality of controllers, each of the first plurality of thermal sensors is coupled to each of the first plurality of controllers; wherein the nsp includes a second plurality of thermal sensors and a second plurality of controllers, each of the second plurality of thermal sensors is coupled to each of the second plurality of controllers; and wherein the aoss includes a third plurality of thermal sensors and a third plurality of controllers, each of the third plurality of thermal sensors is coupled to each of the third plurality of controllers.