Murata manufacturing co., ltd. (20250112623). HIGH-FREQUENCY MODULE
HIGH-FREQUENCY MODULE
Organization Name
murata manufacturing co., ltd.
Inventor(s)
Hidetaka Takahashi of Kyoto JP
HIGH-FREQUENCY MODULE
This abstract first appeared for US patent application 20250112623 titled 'HIGH-FREQUENCY MODULE
Original Abstract Submitted
in a high-frequency module, a first chip includes one of a plurality of first acoustic wave resonators of a first filter a mounting substrate. a second chip includes one of a plurality of second acoustic wave resonators of a second filter. the second chip is on a side of the first chip opposite to the mounting substrate side. the first chip has a first main surface on the second chip side and a second main surface on the mounting substrate side. the second chip includes a third main surface on the first chip side and a fourth main surface on a side opposite to the first chip side. a first circuit element related to the first filter is on the second main surface side of the first chip. a second circuit element related to the second filter is disposed on the fourth main surface side of the second chip.