Murata manufacturing co., ltd. (20250007482). TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
Organization Name
murata manufacturing co., ltd.
Inventor(s)
Patrick Turner of Portola Valley CA US
Mike Eddy of Santa Barbara CA US
Ventsislav Yantchev of Sofia BG
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
This abstract first appeared for US patent application 20250007482 titled 'TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
Original Abstract Submitted
a bulk acoustic resonator device is provided that includes a bulk acoustic resonator chip having a substrate; a piezoelectric layer attached to the substrate either directly or via one or more intermediate layers; and a first conductor pattern on the piezoelectric layer, the first conductor pattern comprising an interdigitated transducer (idt). moreover, an interposer is provided having a surface facing the piezoelectric layer and having a second conductor pattern on the surface of the interposer. a conductive metal bump is between the piezoelectric layer and the interposer that electrically connects the first conductor pattern to the second conductor pattern; and a cover is bonded both to the substrate and to a portion of the surface of the interposer. the cover seals an interior of the bulk acoustic resonator chip.