CHIP ELECTRONIC COMPONENT

Organization Name

Inventor(s)

Masakiyo Nagatomo of Nagaokakyo-shi (JP)

CHIP ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240282489 titled 'CHIP ELECTRONIC COMPONENT

The abstract describes a chip electronic component with a ceramic body containing a semiconductor ceramic with an oxide including Ti and Ba, and a solid metal electrode in ohmic contact with the ceramic body. The component must meet specific size and stress criteria.

The chip electronic component includes a ceramic body with a semiconductor ceramic containing Ti and Ba oxide.
A solid metal electrode is located at one end of the ceramic body and is in ohmic contact with it.
The component must satisfy a specific size ratio of surface area to volume and have a film stress of 140 MPa or higher.

Potential Applications: - This technology could be used in various electronic devices requiring high-performance ceramic components. - It may find applications in telecommunications, aerospace, and automotive industries.

Problems Solved: - Provides a reliable and efficient electronic component with specific size and stress requirements. - Ensures stable performance in demanding electronic applications.

Benefits: - Enhanced reliability and performance in electronic devices. - Improved efficiency and durability in harsh environments.

Commercial Applications: Title: Advanced Ceramic Chip Electronic Component for High-Performance Applications This technology could be utilized in the manufacturing of advanced electronic devices, leading to improved performance and reliability in various industries.

Questions about the technology: 1. How does the specific composition of the ceramic body contribute to the performance of the chip electronic component? - The composition of the ceramic body, including Ti and Ba oxide, enhances the conductivity and stability of the component. 2. What are the key factors that determine the size ratio and film stress requirements for the chip electronic component? - The size ratio and film stress requirements are crucial for ensuring optimal performance and reliability in electronic applications.

Original Abstract Submitted

a chip electronic component includes a ceramic body that includes a semiconductor ceramic including an oxide including ti and ba, and a solid metal electrode at an end of the ceramic body and in ohmic contact with the ceramic body. the chip electronic component satisfies: a/v≥3.3 (mm/mm), where a (mm) is a surface area of the solid metal electrode, and v (mm) is a volume of the ceramic body, and a film stress of the solid metal electrode is about 140 mpa or more.