MULTILAYER CERAMIC ELECTRONIC COMPONENT

Organization Name

Inventor(s)

MULTILAYER CERAMIC ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240249885 titled 'MULTILAYER CERAMIC ELECTRONIC COMPONENT

The abstract of the patent application describes a multilayer ceramic electronic component with ceramic layers containing Ca and Zr, external electrodes with Cu as a main component, and compound regions at the edge portions.

Ceramic layers contain Ca and Zr as main components
External electrodes include Cu as a main component
Compound regions at the edge portions in the lamination direction
First compound region joined with the first base electrode layer
Second compound region joined with the second base electrode layer
Compound regions not joined to each other

Potential Applications: - Electronic components manufacturing - Circuit board assembly - Aerospace industry for electronic systems

Problems Solved: - Improved electrical conductivity - Enhanced durability and reliability - Efficient integration in electronic devices

Benefits: - Higher performance in electronic applications - Increased lifespan of electronic components - Cost-effective manufacturing process

Commercial Applications: Title: Advanced Ceramic Electronic Components for Enhanced Performance This technology can be utilized in the manufacturing of various electronic components such as capacitors, resistors, and filters, catering to industries like telecommunications, automotive, and consumer electronics.

Questions about the technology: 1. How does the compound region at the edge portion enhance the performance of the electronic component? 2. What are the advantages of using Ca and Zr in the ceramic layers of the component?

Original Abstract Submitted

a multilayer ceramic electronic component includes ceramic layers including ca and zr as main components, first and second external electrodes including a first base electrode layer and second base electrode layer, and a plated layer covering a portion of the first and second base electrode layers, the first and second base electrode layers include cu as a main component, a multilayer body includes at an edge portion in a lamination direction a first compound region extending to a first end surface and a second compound region extending to the second end surface, the first compound region is joined with the first base electrode layer, the second compound region is joined with the second base electrode layer, and the first compound region and second compound region are not joined to each other.