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Murata Manufacturing Co., Ltd. patent applications on December 12th, 2024

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Patent Applications by Murata Manufacturing Co., Ltd. on December 12th, 2024

Murata Manufacturing Co., Ltd.: 21 patent applications

Murata Manufacturing Co., Ltd. has applied for patents in the areas of H03H9/02 (2), H01F5/04 (2), H01F17/00 (2), H01L27/12 (2), H01L29/786 (2) H01F17/0013 (2), B65H19/12 (1), H01L29/7838 (1), H03H9/145 (1), H03H9/02157 (1)

With keywords such as: layer, surface, portion, direction, electrode, conductor, insulating, circuit, side, and member in patent application abstracts.



Patent Applications by Murata Manufacturing Co., Ltd.

20240409348. AUTOMATED GUIDED VEHICLE AND MANUFACTURING SYSTEM_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Hiroaki MAKINO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Atsushi OONO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): B65H19/12, B65H75/42

CPC Code(s): B65H19/12



Abstract: an automated guided vehicle includes a roll holder to hold a roll, a detector to acquire information on a roll holder passage region, including positions through which the roll holder passes when the automated guided vehicle travels, an illuminator to emit illumination light towards the roll holder passage region, and a traveler to travel and support the roll holder, the detector, and the illuminator.


20240409349. WINDING CORE HOLDING DEVICE AND AUTOMATED GUIDED VEHICLE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Hiroaki MAKINO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Atsushi OONO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): B65H19/30, B65H27/00

CPC Code(s): B65H19/30



Abstract: a winding core holder includes a holder main body, a lifter to raise and lower the holder main body, and a roller movably held relative to the holder main body, enabling the winding core to be placed and moved in the winding core axial direction. the roller includes a high-release surface with a higher release property than a surface of the holder main body.


20240409398. MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURING A MEMS DEVICE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Konsta HANNULA of Sipoo (FI) for murata manufacturing co., ltd., Jussi OKSANEN of Nummela (FI) for murata manufacturing co., ltd., Jussi AAV of Kalkkiranta (Sipoo) (FI) for murata manufacturing co., ltd.

IPC Code(s): B81C1/00, B81B7/00

CPC Code(s): B81C1/00269



Abstract: a mems device is provided that includes a cap layer and a device layer. the cap layer includes a cap wafer made of electrically insulating material, and the device layer includes at least one seismic element. moreover, the cap layer includes at least one silicon-filled portion at a first face of the cap layer facing the device layer, and at least one of said at least one silicon-filled portion includes a gap that locally increases distance from the cap layer to the at least one seismic element in the device layer.


20240410744. VIBRATION DEVICE AND ELECTRONIC DEVICE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Shozo OTERA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yutaka ISHIURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Jun ENDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Michio WADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): G01H11/08

CPC Code(s): G01H11/08



Abstract: a vibration device that includes a support member, an actuator, and a sensor that detects a force applied to a vibrated member and displacement of the vibrated member in a left-right direction. the support member includes a fixing portion, a vibration portion, and an elastically deformable portion connecting the fixing portion and the vibration portion. the actuator is attached to the fixing portion and the vibration portion. the sensor is attached to the elastically deformable portion. the elastically deformable portion has a first elastic modulus in the left-right direction, a second elastic modulus in a front-rear direction, and a third elastic modulus in an up-down direction. the first elastic modulus is smaller than the second elastic modulus. the third elastic modulus is smaller than the second elastic modulus.


20240411200. OPTICAL MODULATOR_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Satoki HAMAMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yasuhiro AIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): G02F1/225, G02F1/21

CPC Code(s): G02F1/2255



Abstract: an optical modulator includes an optical waveguide, first and second electrodes, and a first wiring electrode. the first electrode is on one side of the optical waveguide in a height direction of the optical modulator and extends along a portion of the optical waveguide. the second electrode is on another side of the optical waveguide in the height direction of the optical modulator. the first wiring electrode is on a side of the first electrode opposite to the optical waveguide in the height direction and is electrically connected to the first electrode. the first wiring electrode includes a wiring portion extending from an end portion in an extension direction of the first electrode when viewed along the height direction.


20240412907. INDUCTOR COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Takeru OZAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F5/04, H01F27/29, H01F27/34

CPC Code(s): H01F5/04



Abstract: an inductor component includes an element assembly, a coil conductor inside the element assembly, and an outer electrode on an outer surface of the element assembly and electrically connected to the coil conductor. the element assembly includes a lower surface and a side surface. the outer electrode has a lower portion at the lower surface and a side portion at the side surface continuously with the lower portion. the coil conductor includes conductor patterns which form parts of an annular path on virtual inner surfaces intersecting both the lower and side surfaces and lined up at intervals. when a distance a is a shortest distance between the coil conductor and a boundary portion between the lower and side portions and a distance b is a shortest distance between the coil conductor and an end portion of the lower portion opposite the boundary portion, b/a is from 0.2 to 0.6.


20240412910. INDUCTOR COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Takeru OZAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F17/00, H01F5/04

CPC Code(s): H01F17/0013



Abstract: an inductor component includes an element body made of an insulator and a coil conductor inside the element body. the coil conductor includes conductor patterns on a plurality of respective virtual inner surfaces arranged at intervals in an axial direction of the coil conductor to form a portion of an annular track, and a coupling conductor electrically coupling two adjacent conductor patterns among the conductor patterns. at least one conductor pattern among the conductor patterns includes a first conductor pattern and a second conductor pattern that are arranged in the axial direction and are in contact with each other. in a section including an axis of the coil conductor, a center of the first conductor pattern in a direction orthogonal to the axial direction is present at a position different from a position of a center of the second conductor pattern in the direction orthogonal to the axial direction.


20240412911. ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Daisuke OTSUKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoshifumi MAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F17/00, H01F41/04

CPC Code(s): H01F17/0013



Abstract: an electronic component includes a base body having first and second planes, and a ridge portion connecting the first and second planes; and a conductive member continuously on at least a part of the first plane and at least a part of the ridge portion. the first plane has a first contact surface that is in contact with the conductive member, and the ridge portion has a second contact surface that is in contact with the conductive member and in a cross section orthogonal to each of the first plane and the second plane and intersecting the conductive member, the first contact surface, and the second contact surface.


20240412919. COIL COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Kota TAKAYAMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F27/30, H01F27/24, H01F27/28, H01F27/29

CPC Code(s): H01F27/306



Abstract: a groove for receiving an end portion of a wire is on a mounting surface of a flange. the groove extends in a direction in which an inner end surface and an outer end surface of the flange are linked with each other. the groove has a bottom surface sandwiched between first and second sides extending in the direction in which the inner end surface and the outer end surface are linked with each other. the first side is located closer to an extending position of the wire from a winding core than is the second side. the distance between the first side and the second side on the inner end surface is narrower and that on the outer end surface is wider. the angle of the first side with respect to an axial direction is smaller than that of the second side with respect to the axial direction.


20240413036. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Atsushi KUROKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hisatoshi KAWABATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akira FUJIHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hiroshi YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01L23/36, H01L23/00, H01L23/31, H01L23/488

CPC Code(s): H01L23/36



Abstract: a device layer is on a first surface which is one surface of a first insulating layer. the device layer includes a transistor including source regions and drain regions, a source contact electrode connected to a source contact region on surfaces of the source regions, a drain contact electrode connected to a drain contact region on surfaces of the drain regions, wires, and vias. an insulating member is bonded to a second surface of the first insulating layer opposite to the first surface. a conical surface whose apex is located on the second surface, whose central axis is a straight line perpendicular to the second surface, and whose generatrix is a half-line extending toward the insulating member at an angle of 45� with respect to the central axis is defined as a criterion conical surface.


20240413083. SEMICONDUCTOR DEVICE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Atsushi KUROKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hiroshi YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akira FUJIHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01L23/528, H01L21/768, H01L23/532, H01L27/12, H01L29/45, H01L29/786

CPC Code(s): H01L23/5283



Abstract: a first insulating layer containing a silicon oxide is disposed on a surface of an insulating member. a transistor is disposed over a part of an area of a first insulating layer. a second insulating layer covers the first insulating layer and the transistor. a first wiring is disposed on the second insulating layer. a through-hole extends through the second insulating layer and the first insulating layer from a lower surface of the first wiring to the insulating member. at least a part of an outer edge of the through-hole overlaps the first wiring in a plan view. the first wiring includes a lower layer that is in contact with the second insulating layer, and the lower layer is formed from ta, w, a ta compound, or a w compound.


20240413243. High Voltage Switching Device_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Abhijeet Paul of Poway CA (US) for murata manufacturing co., ltd., Simon Edward Willard of Irvine CA (US) for murata manufacturing co., ltd., Alain Duvallet of San Diego CA (US) for murata manufacturing co., ltd.

IPC Code(s): H01L29/78, H01L21/74, H01L21/84, H01L27/12, H01L29/06, H01L29/08, H01L29/10, H01L29/40, H01L29/423, H01L29/66, H01L29/786

CPC Code(s): H01L29/7838



Abstract: a high-voltage switching device that can be fabricated in a standard low-voltage process, such as cmos, and more specifically soi cmos. embodiments include integrated circuits that combine, in a unitary structure, a fet device and an integrated, co-fabricated modulated resistance region (mrr) controlled by one or more voltage-drop modulation gates (vdmgs). the vdmgs are generally biased independently of the gate of the fet device, and in such a way as to protect each vdmg from excessive and potentially destructive voltages. in a first embodiment, an integrated circuit high voltage switching device includes a transistor structure including a source, a gate, and an internal drain; an mrr connected to the internal drain of the transistor structure; at least one vdmg that controls the resistance of the mrr; and a drain electrically connected to the mrr. each vdmg at least partially depletes the mrr upon application of a bias voltage.


20240413344. SECONDARY BATTERY_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Hironobu KUBOTA of Kyoto (JP) for murata manufacturing co., ltd., Takeshi HAYASHI of Kyoto (JP) for murata manufacturing co., ltd., Kazuki FUKUI of Kyoto (JP) for murata manufacturing co., ltd., Takashi KASASHIMA of Kyoto (JP) for murata manufacturing co., ltd., Takuya NAKASHIMA of Kyoto (JP) for murata manufacturing co., ltd.

IPC Code(s): H01M4/62, C07F7/18, C07F7/21, H01M4/02, H01M4/36, H01M10/0525

CPC Code(s): H01M4/625



Abstract: a secondary battery is provided and including an electrode containing an electrode active material and a conductive material, in which at least a part of the conductive material is covered with a covering material, and a covering amount of the covering material is 0.0008 mmol/mor more and 0.06 mmol/mor less.


[[20240413367. ELECTROLYTE SUBSTRATE FOR SOLID OXIDE FUEL CELL, SINGLE CELL FOR SOLID OXIDE FUEL CELL, SOLID OXIDE FUEL CELL STACK, AND METHOD FOR MANUFACTURING ELECTROLYTE SUBSTRATE FOR SOLID OXIDE FUEL CELL_simplified_abstract_(murata manufacturing co., ltd.)]]

Inventor(s): Hiroaki YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Seiji FUJITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01M8/1226, H01M8/12, H01M8/1253, H01M8/2425

CPC Code(s): H01M8/1226



Abstract: an electrolyte substrate for solid oxide fuel cells that includes: an electrolyte layer containing sintered scandia-stabilized zirconia or sintered yttria-stabilized zirconia; and a first barrier layer on a first main surface of the electrolyte layer, and a second barrier layer on a second main surface of the electrolyte layer, each of the first barrier layer and the second barrier layer containing sintered ce(x)o, where x is any one of sm, gd, and y, wherein in a cross-sectional view in a thickness direction of the first barrier layer and the second barrier layer, pores are present with an area percentage of 24% to 72% in each of the first barrier layer and the second barrier layer.


20240413391. SOLID-STATE ELECTROLYTE FOR SOLID-STATE BATTERY, SOLID-STATE BATTERY, AND BATTERY PACKAGE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Daisuke ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01M10/0562

CPC Code(s): H01M10/0562



Abstract: a solid-state electrolyte that includes: a first solid-state electrolyte part and a second solid-state electrolyte part. the first solid-state electrolyte part has a perovskite structure having a lattice constant that is an integer multiple of a value of greater than or equal to 3.8 Å and less than or equal to 4.1 Å. the second solid-state electrolyte part has an antiperovskite structure having a lattice constant that is an integer multiple of a value of greater than or equal to 3.8 Å and less than or equal to 4.1 Å.


20240413665. WIRELESS POWER TRANSFER SYSTEM_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Hiromasa SAEKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masaya TAMURA of Toyohashi-shi (JP) for murata manufacturing co., ltd., Yoshinobu TAMURA of Toyohashi-shi (JP) for murata manufacturing co., ltd., Suzuka AKAI of Toyohashi-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H02J50/12, H01P7/06, H02J50/70

CPC Code(s): H02J50/12



Abstract: a wireless power transfer system includes a cavity resonator entirely surrounded by an electromagnetic wave shielding member having appropriate conductivity and frequency selectivity; at least one power reception unit; at least one power transmission unit; and at least one resonator (e.g., a resonant network). in an equivalent circuit of the wireless power transfer system from a power transmission circuit of the power transmission unit to a power reception circuit of the power reception unit, n (n≥2) resonators including the cavity resonator are connected in series via an inverter on a power transmission route from the power transmission circuit to the power reception circuit.


20240413755. SCALABLE POWER SUPPLY SYSTEM_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yoshihiro FUJIWARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tatsuya HOSOTANI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H02M3/158, H02M1/00, H02M1/32, H02M3/157

CPC Code(s): H02M3/1584



Abstract: a signal extension circuit is electrically connected between an mpu and a drive circuit and outputs a second drive signal generated by adjusting a phase of a first drive signal. a low-voltage malfunction prevention circuit is connected between the input end of the drive circuit and the output ends of the mpu and the signal extension circuit. the first drive signal is a three-state signal having one of first, second and third voltages in ascending order. the low-voltage malfunction prevention circuit includes a detection comparison circuit that detects an output voltage and determines whether the output voltage is less than or equal to a threshold value representing a voltage value that is less than a predetermined output voltage. when the output voltage is less than the threshold value, the low-voltage malfunction prevention circuit outputs the first drive signal as the second drive signal to the drive circuit.


20240413804. TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS USING MULTIPLE DIELECTRIC LAYER THICKNESSES TO SUPPRESS SPURIOUS MODES_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Bryant GARCIA of Mississauga (CA) for murata manufacturing co., ltd.

IPC Code(s): H03H9/02, H03H9/205, H03H9/56

CPC Code(s): H03H9/02157



Abstract: acoustic filters and methods of fabricating acoustic filters are disclosed. a filter includes a single-crystal piezoelectric plate having a front surface and a back surface attached to a substrate, and a plurality of acoustic resonators including a first shunt resonator, a second shunt resonator, and one or more series resonators. each of the plurality of acoustic resonators includes an interdigital transducer (idt) formed on the front surface of the piezoelectric plate, interleaved fingers of the idt disposed on a respective diaphragm formed by a portion of the piezoelectric plate that spans a cavity in the substrate. a frequency setting dielectric layer is formed over the first and second shunt resonators but not over the one or more series resonators. the frequency setting dielectric layer has a thickness t on the first shunt resonator and a thickness t on the second shunt resonator, where t is not equal to t


20240413807. ACOUSTIC WAVE DEVICE, HIGH FREQUENCY FILTER, AND FILTER CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yasuharu NAKAI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H03H9/145, H03H9/02, H03H9/25, H03H9/64

CPC Code(s): H03H9/145



Abstract: an acoustic wave device includes a substrate, an idt electrode on the substrate, and a dielectric film on the substrate. the substrate includes a piezoelectric layer, a low acoustic velocity layer, and a high acoustic velocity layer in this order. the idt electrode includes electrode fingers and busbar electrodes that connect the electrode fingers. on the piezoelectric layer, the dielectric film is located only in a region where the electrode fingers and the busbar electrodes are not located, between the busbar electrodes in a plan view of the substrate. a film thickness of the dielectric film is smaller than a film thickness of the electrode fingers.


20240413849. Power Spectral Density Power Detector_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Peter Bacon of Derry NH (US) for murata manufacturing co., ltd.

IPC Code(s): H04B1/10, H04B1/12, H04B1/16

CPC Code(s): H04B1/1036



Abstract: circuits and methods that provide fine-resolution measurements of rf signal power within a communication system band, thereby more accurately measuring rf interference or the potential of rf interference. one aspect of embodiments of the present invention is a narrow-band tunable filter that includes two elements coupled in series, a periodic passband filter and a tunable filter. the purpose of the periodic passband filter is to generate multiple periodic passbands for an applied rf signal. the purpose of the tunable filter is to generate a single passband, generally with a tunable center frequency. by serially coupling the two filter types in either order, the single passband of the tunable filter is superimposed over one of the periodic passbands of the periodic passband filter, synergistically resulting in an extremely narrow passband.


Murata Manufacturing Co., Ltd. patent applications on December 12th, 2024

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