Mitsubishi electric corporation (20250149399). POWER MODULE AND POWER CONVERSION APPARATUS
POWER MODULE AND POWER CONVERSION APPARATUS
Organization Name
mitsubishi electric corporation
Inventor(s)
POWER MODULE AND POWER CONVERSION APPARATUS
This abstract first appeared for US patent application 20250149399 titled 'POWER MODULE AND POWER CONVERSION APPARATUS
Original Abstract Submitted
an object is to provide a technique capable of suppressing a warpage of a heat radiation member caused by heat stress in a power module. a power module includes: a semiconductor element; a ceramic substrate including a mounting surface on which the semiconductor element is mounted; and a fin base bonded to a surface of the ceramic substrate on a side opposite to the mounting surface, wherein a bonding region in the ceramic substrate bonded to the fin base is a region corresponding to a portion on which the semiconductor element is mounted, and an area of the bonding region in the ceramic substrate bonded to the fin base is smaller than an area of the portion on which the semiconductor element is mounted.