Mitsubishi electric corporation (20250142852). SEMICONDUCTOR APPARATUS
SEMICONDUCTOR APPARATUS
Organization Name
mitsubishi electric corporation
Inventor(s)
SEMICONDUCTOR APPARATUS
This abstract first appeared for US patent application 20250142852 titled 'SEMICONDUCTOR APPARATUS
Original Abstract Submitted
an interconnection member has a bonded surface in contact with a bonding member. in plan view seen in a direction perpendicular to a front surface electrode, the bonded surface covers at least a portion of each of a plurality of diode regions. the plurality of diode regions include a first diode region, a second diode region, and a third diode region. in plan view, the second diode region is located in a first direction with respect to the first diode region and is spaced from the first diode region. in plan view, the third diode region is located in a second direction, which is perpendicular to the first direction, with respect to the first diode region, and is spaced from each of the first diode region and the second diode region.