Mitsubishi Electric Corporation patent applications on April 3rd, 2025
Patent Applications by Mitsubishi Electric Corporation on April 3rd, 2025
Mitsubishi Electric Corporation: 15 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H10D30/66 (2), H10D62/832 (2), H02M7/00 (2), H01L23/31 (2), H01L23/00 (2) B23K26/21 (1), B41J25/308 (1), C02F3/006 (1), F04C29/12 (1), G02B6/2821 (1)
With keywords such as: surface, unit, semiconductor, electrode, water, device, signal, direction, cylinder, and quality in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
Inventor(s): Hidekazu NAKAI of Tokyo JP for mitsubishi electric corporation, Nobutaka KOBAYASHI of Tokyo JP for mitsubishi electric corporation, Takayoshi HORIGUCHI of Tokyo JP for mitsubishi electric corporation, Kazuya HORIO of Tokyo JP for mitsubishi electric corporation, Ryogo KOBA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): B23K26/21, B23K26/70
CPC Code(s): B23K26/21
Abstract: a laser processing head includes a first processing head unit and a second processing head unit. an end portion of the first processing head unit facing the second processing head unit is formed with a first inclined surface. an end portion of the second processing head unit facing the first processing head unit is formed with a second inclined surface parallel to the first inclined surface. at least one of the first inclined surface or the second inclined surface is provided with an attraction member. at least one of the first inclined surface or the second inclined surface is provided with a movable pin protruding toward the other thereof and energized toward the other thereof. at least the other of the first inclined surface or the second inclined surface is provided with a pin seat. each of the movable pin and the pin seat is plural in number.
20250108643. PRINTING APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takuma MIYAZAKI of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Kentaro MATSUI of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Gen TADA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): B41J25/308, B41J3/28, B41J11/00
CPC Code(s): B41J25/308
Abstract: there is provided a reliable printing apparatus in which a distance between a printing head and a surface to be printed is kept constant. a printing apparatus according to the present disclosure includes: a printing head having a printing surface; a fixing unit connected to the printing head and having a fixing guide disposed along a first direction including the printing surface; a movable unit connected to the fixing unit, having a movable guide disposed along the first direction, and being movable with respect to the printing head along a second direction, the second direction intersecting with the first direction; a holding mechanism disposed on the movable unit and holding, along the first direction, an object to be printed that is printed by the printing head; and a vibration suppression unit disposed at an end of the movable unit and holding the object to be printed along the second direction.
Inventor(s): Wataru YOSHIDA of Tokyo JP for mitsubishi electric corporation, Yoshifumi HAYASHI of Tokyo JP for mitsubishi electric corporation, Eiji IMAMURA of Tokyo JP for mitsubishi electric corporation, Seiji NODA of Tokyo JP for mitsubishi electric corporation, Kenta SHIMODA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): C02F3/00, C02F3/12, G01N33/18
CPC Code(s): C02F3/006
Abstract: a water treatment system includes: a first water quality measurement value acquisition unit which acquires a water quality measurement value at a first time point, of treatment target water; a water quality variation pattern acquisition unit which, acquires a plurality of water quality variation patterns; an inflow water quality estimation unit which selects a water quality variation pattern that matches an acquisition condition for the water quality measurement value at the first time point, from the water quality variation patterns in the water quality variation pattern acquisition unit, and estimates an inflow water quality value subsequent to the first time point from the selected water quality variation pattern; and a control unit which controls an aeration amount from a blower to a reaction tank subsequent to the first time point, on the basis of the estimated inflow water quality value.
Inventor(s): Takuma TSUKAMOTO of Tokyo JP for mitsubishi electric corporation, Tomohiro IYANAGI of Tokyo JP for mitsubishi electric corporation, Hiroki NAGASAWA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): F04C29/12, F04C23/00
CPC Code(s): F04C29/12
Abstract: a hermetic compressor includes a compression mechanism in a hermetic container. the compression mechanism is driven by an electric motor through a rotation shaft, and includes a cylinder including a cylinder chamber having a cylindrical shape. the cylinder has a cylinder suction hole extending in a radial direction of the cylinder and allowing fluid to be sucked into the cylinder chamber. in an outer circumferential surface of the cylinder, a cylindrical groove is formed in such a manner as to surround the cylinder suction hole. between the cylinder suction hole and the cylindrical groove, a cylinder tubular portion is provided. to an outer circumferential surface of the cylinder tubular portion, a suction pipe or a connecting pipe provided at one end of the suction pipe is connected, the suction pipe being a pipe through which the fluid is guided from outside of the hermetic container to the cylinder chamber.
Inventor(s): Keita MOCHIZUKI of Tokyo JP for mitsubishi electric corporation, Kazumasa KISHIMOTO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G02B6/28
CPC Code(s): G02B6/2821
Abstract: an interval between the first and second optical waveguides () of the optical power transition unit is equal to or less than a wavelength of the light. each of the first and second optical waveguides () is a high-mesa structure which includes a lower cladding layer (), a core layer (), and an upper cladding layer () which are sequentially stacked on the semiconductor substrate (). the first optical waveguide and the second optical waveguide have different widths. a gap core layer () is formed on the lower cladding layer between the core layers of the first and second optical waveguides of the optical power transition unit. an equivalent refractive index of the gap core layer when leakage of the light in a height direction is taken into consideration is lower than an equivalent refractive index of the core layers of the first and second optical waveguides.
Inventor(s): Tomoya FUJITA of Tokyo JP for mitsubishi electric corporation, Takeshi KUBO of Tokyo JP for mitsubishi electric corporation, Hiroyuki KINOSHITA of Tokyo JP for mitsubishi electric corporation, Junji MATSUNO of Tokyo JP for mitsubishi electric corporation, Kohei HIBINO of Aichi JP for mitsubishi electric corporation, Takuya HIRAO of Aichi JP for mitsubishi electric corporation, Akira ISEKI of Aichi JP for mitsubishi electric corporation
IPC Code(s): G05B19/404, B23Q15/12
CPC Code(s): G05B19/404
Abstract: a numerical controller includes: a model holding unit that holds a machine model, the machine model being a model that simulates deformation of a mechanical structure accompanying motion of the mechanical structure in axial directions and representing an error amount as an amount of displacement of a tool; a machining error estimation unit that estimates an error direction and the error amount in the error direction on the basis of axis data that is data on drive of a drive mechanism and the machine model, the error direction being a direction in which displacement of the tool occurs among the axial directions; and a correction amount arithmetic unit that selects one or more of the axes subject to correction, and performs arithmetic to find a correction amount used for correction of a command to be output to the drive mechanism for the axis selected.
Inventor(s): Kazufumi OKI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L21/66, H01L21/56, H01L23/00, H01L23/28
CPC Code(s): H01L22/12
Abstract: an object is to provide a technique callable of determining whether or not a wire is nearly broken. a semiconductor device includes a semiconductor element, a terminal, a main wire electrically connected between the semiconductor element and the terminal, a dummy wire, and sealing resin. both ends of the dummy wire are connected to portions where both ends of the main wire are connected, and tensile strength of the dummy wire itself is lower than that of the main wire itself. the sealing resin covers the semiconductor element, the main wire, and the dummy wire.
Inventor(s): Kohei EBIHARA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L23/31, H01L23/29, H02M7/00, H02M7/5387, H10D8/60, H10D30/66, H10D62/10, H10D62/832
CPC Code(s): H01L23/3192
Abstract: a semiconductor device includes a field insulating film formed on an epitaxial layer, a front surface electrode riding onto an inner peripheral end of the field insulating film, and an outer peripheral electrode riding onto an outer peripheral end of the field insulating film. to a surface portion of the epitaxial layer, connected is the front surface electrode, and in the surface portion of the epitaxial layer, formed is a well region extending up to the outside of the outer peripheral end of the front surface electrode. a moisture-resistant insulating film is formed so as to cover the outer peripheral end of the front surface electrode, an inner peripheral end of the outer peripheral electrode, and the field insulating film. on the moisture-resistant insulating film, formed is a semi-insulating film connected to the front surface electrode and the outer peripheral electrode which are exposed from the moisture-resistant insulating film.
Inventor(s): Yoshihisa UCHIDA of Tokyo JP for mitsubishi electric corporation, Shintaro ARAKI of Tokyo JP for mitsubishi electric corporation, Tatsuya KAWASE of Tokyo JP for mitsubishi electric corporation, Hikaru GOTO of Tokyo JP for mitsubishi electric corporation, Yoshiaki TAKEWAKI of Fukuoka JP for mitsubishi electric corporation
IPC Code(s): H01L23/495, H01L23/00, H01L23/31, H01L25/065
CPC Code(s): H01L23/49568
Abstract: an object of the present disclosure is to increase heat radiation properties of a semiconductor device without increasing a size of the semiconductor device. a semiconductor device includes: a base material; a semiconductor chip mounted to an upper surface of the base material; a main electrode and a signal electrode formed in regions different from each other on the semiconductor chip, respectively; a main terminal bonded to the main electrode; and a signal terminal connected to the signal electrode via a metal wire, wherein a region in the signal terminal to which the metal wire is bonded overhangs the base material while being separated from the base material.
20250112454. POWER CONVERTER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Ryota KITAMURA of Tokyo JP for mitsubishi electric corporation, Masafumi ICHIHARA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H02H7/12, H02M1/088, H02M3/158
CPC Code(s): H02H7/1213
Abstract: a power converter including transistors, a converter controller, and a functional safety controller that outputs a gate drive allowing signal. further, there is shutoff circuitry that outputs a result of a logical conjunction using the gate pulse and the gate drive allowing signal as a drive signal, gate drive circuitry that outputs a gate signal on the basis of the drive signal, and a current detector that detects current flowing through a phase including the transistors and outputs a current value. after confirming on the basis of the current value and the gate signal that the gate signal changes to an on state during a period of no current flow through the transistor, the functional safety controller puts the gate drive allowing signal into a temporarily off state while the gate pulse is on and determines whether or not the gate signal changes to an off state.
20250112561. ELECTRONIC APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takahiro MASUYAMA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): H02M7/00, H01G4/224, H01G4/228, H05K7/14
CPC Code(s): H02M7/003
Abstract: an electronic apparatus includes a base that is planar-shaped, a capacitor, a first planar-shaped member, at least one second planar-shaped member, and fixtures. the capacitor is attached to the first planar-shaped member. the second planar-shaped member is between the first planar-shaped member and the base and has a through-hole for insertion of the capacitor. the fixtures fix the first planar-shaped member to the second planar-shaped member and fix the second planar-shaped member to the base.
20250112576. CONVEYANCE SYSTEM_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Tatsuya KAWASE of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H02P25/064, B65G54/02
CPC Code(s): H02P25/064
Abstract: a conveyance system includes a plurality of conveyance path units constituting a conveyance path on which a conveyance body moves, and each connected to a common direct-current bus. a conveyance path unit that is each of the plurality of conveyance path units includes a drive unit supplied with power from the direct-current bus to thereby generate motive power for moving the conveyance body. among the plurality of conveyance path units, one or at least one of two or more of the conveyance path units which the conveyance body has not entered executes regenerative power supply for supplying the drive unit with regenerative power generated in the plurality of conveyance path units.
Inventor(s): Kota KURIHARA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Seiji NODA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Makoto TAKATA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Yoichi ITO of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Ayumu OSUMI of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04R3/12, A61M21/00, G10K15/04
CPC Code(s): H04R3/12
Abstract: a sound environment control system according to the present disclosure controls sound environment in a room, and includes an information processing device, an output device, and a sensor. the information processing device generates a sound having a plurality of frequency components. the output device outputs the sound generated by the information processing device into the room. the sensor senses biometric information of a person in the room. the sound includes a meaningless sound that is meaningless to the person. the information processing device determines conditions of the person, using the biometric information sensed by the sensor. depending on the determined conditions of the person, the information processing device adjusts at least one of a frequency and a magnitude of at least one frequency component forming the meaningless sound.
Inventor(s): Akinori HEISHI of Tokyo JP for mitsubishi electric corporation, Satoru OKAGAKI of Tokyo JP for mitsubishi electric corporation, Haruka SUZUKI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H05B47/155, F21V14/02, F21V14/06, H05B47/16
CPC Code(s): H05B47/155
Abstract: a leaf-filtered sunlight simulation control device includes a plurality of light sources, a single lens, and a leaf-filtered sunlight light source control module to control positions of the plurality of light sources. the leaf-filtered sunlight light source control module controls the positions of the plurality of light sources so that f<a is satisfied, where f is a focal length of the lens and a is a distance from a center axis of the lens to each of the light sources.
Inventor(s): Kazunari NAKATA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H10D30/66, H10D62/832, H10D64/27
CPC Code(s): H10D30/668
Abstract: a semiconductor device includes an insulating film covering a reference surface of a semiconductor substrate and an electrode. the insulating film includes a first upper surface and a protrusion part protruding from the first upper surface corresponding to the reference surface of the semiconductor substrate and at least a part of the electrode protruding from the reference surface, respectively. a distance from the reference surface of the semiconductor substrate to a connection part connecting the first upper surface of the insulating film and a surface of the protrusion part is equal to or larger than a distance from the reference surface of the semiconductor substrate to a second upper surface of the electrode.
Mitsubishi Electric Corporation patent applications on April 3rd, 2025
- Mitsubishi Electric Corporation
- B23K26/21
- B23K26/70
- CPC B23K26/21
- Mitsubishi electric corporation
- B41J25/308
- B41J3/28
- B41J11/00
- CPC B41J25/308
- C02F3/00
- C02F3/12
- G01N33/18
- CPC C02F3/006
- F04C29/12
- F04C23/00
- CPC F04C29/12
- G02B6/28
- CPC G02B6/2821
- G05B19/404
- B23Q15/12
- CPC G05B19/404
- H01L21/66
- H01L21/56
- H01L23/00
- H01L23/28
- CPC H01L22/12
- H01L23/31
- H01L23/29
- H02M7/00
- H02M7/5387
- H10D8/60
- H10D30/66
- H10D62/10
- H10D62/832
- CPC H01L23/3192
- H01L23/495
- H01L25/065
- CPC H01L23/49568
- H02H7/12
- H02M1/088
- H02M3/158
- CPC H02H7/1213
- H01G4/224
- H01G4/228
- H05K7/14
- CPC H02M7/003
- H02P25/064
- B65G54/02
- CPC H02P25/064
- H04R3/12
- A61M21/00
- G10K15/04
- CPC H04R3/12
- H05B47/155
- F21V14/02
- F21V14/06
- H05B47/16
- CPC H05B47/155
- H10D64/27
- CPC H10D30/668