Microsoft technology licensing, llc (20250120042). ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING
ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING
Organization Name
microsoft technology licensing, llc
Inventor(s)
Bharath Ramakrishnan of Bellevue WA US
Husam Atallah Alissa of Redmond WA US
Christian L. Belady of Mercer Island WA US
Sean Michael James of Olympia WA US
Vaidehi Oruganti of Kirkland WA US
ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING
This abstract first appeared for US patent application 20250120042 titled 'ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING
Original Abstract Submitted
a processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. at least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. an electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.