Micron technology, inc. (20250149530). STACKED INTERPOSER STRUCTURES, AND RELATED METHODS
STACKED INTERPOSER STRUCTURES, AND RELATED METHODS
Organization Name
Inventor(s)
STACKED INTERPOSER STRUCTURES, AND RELATED METHODS
This abstract first appeared for US patent application 20250149530 titled 'STACKED INTERPOSER STRUCTURES, AND RELATED METHODS
Original Abstract Submitted
an interposer comprises a semiconductor material and includes cache memory under a location on the interposer for a host device. memory interface circuitry may also be located under one or more locations on the interposer for memory devices. microelectronic device assemblies incorporating such an interposer and comprising a host device and multiple memory devices are also disclosed, as are methods of fabricating such microelectronic device assemblies.