Micron technology, inc. (20250132302). HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLY
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLY
Organization Name
Inventor(s)
Kwun-Han Wu of New Taipei City TW
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLY
This abstract first appeared for US patent application 20250132302 titled 'HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLY
Original Abstract Submitted
a semiconductor device is presented. the semiconductor device includes a lower semiconductor die, a stack of upper semiconductor dies disposed over the lower semiconductor die, a top semiconductor die disposed over the stack of upper semiconductor dies, a non-conductive film material disposed between adjacent semiconductor dies of the lower semiconductor die and the stack of upper semiconductor dies, and a mold compound material disposed between the top semiconductor die and the stack of upper semiconductor dies, and on sidewalls of the stack of upper semiconductor dies and the top semiconductor die.