Micron technology, inc. (20250125266). COMPONENT INTER-DIGITATED VIAS AND LEADS
COMPONENT INTER-DIGITATED VIAS AND LEADS
Organization Name
Inventor(s)
Christopher F. Kinney of Folsom CA US
COMPONENT INTER-DIGITATED VIAS AND LEADS
This abstract first appeared for US patent application 20250125266 titled 'COMPONENT INTER-DIGITATED VIAS AND LEADS
Original Abstract Submitted
aspects of the present disclosure are directed to systems and methods to reduce inductance on an integrated circuit package of a memory sub-system. a memory sub-system is also hereinafter referred to as a “memory device.” an example of a memory sub-system is a storage system, such as a ssd, and can be embodied as an integrated circuit package, including but not limited to a pin grid array (pga), and ball grid array (bga).