Mediatek inc. (20250112197). WIREBOND MULTICHIP PACKAGE
WIREBOND MULTICHIP PACKAGE
Organization Name
Inventor(s)
Yu-Liang Hsiao of Hsinchu City TW
Ming-Hsien Chou of Hsinchu City TW
WIREBOND MULTICHIP PACKAGE
This abstract first appeared for US patent application 20250112197 titled 'WIREBOND MULTICHIP PACKAGE
Original Abstract Submitted
a semiconductor package includes a carrier substrate comprising a first surface and a second surface opposite to the first surface. a first electronic component and a second electronic component are mounted on the first surface of the carrier substrate in a side-by-side manner. the first electronic component is provided with first data (dq) pads along a first side directly facing the second electronic component. the second electronic component is provided with second data (dq) pads along a second side in proximity to the first electronic component. the first dq pads are directly connects to the second dq pads through first bond wires.